XC2V1500-5FGG676I

IC FPGA 392 I/O 676FBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 392 884736 676-BGA

Quantity 142 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case676-BGANumber of I/O392Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1920Number of Logic Elements/Cells17280
Number of Gates1500000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits884736

Overview of XC2V1500-5FGG676I – Virtex®-II FPGA, 676-BGA, 1,500,000 gates

The XC2V1500-5FGG676I is a Virtex®-II field programmable gate array (FPGA) in a 676-ball fine-pitch BGA (27 × 27) package, offered by AMD. It provides a high-density, reprogrammable logic fabric with 17,280 logic elements and substantial embedded memory, combined with flexible I/O and industrial-grade temperature range for demanding embedded and digital systems.

Engineered for designs that require on-chip memory, arithmetic acceleration and robust interfacing, this device delivers a combination of logic capacity, embedded RAM and I/O resources suited to complex system functions such as memory controllers, data path processing and hardware-accelerated logic.

Key Features

  • Logic Capacity  17,280 logic elements (equivalent cells) and an effective system gate count of 1,500,000 provide resources for complex custom logic and state machines.
  • Embedded Memory  Approximately 0.885 Mbits of on-chip RAM (884,736 total bits) supports data buffering, FIFOs and small on-chip data stores.
  • I/O Resources  392 user I/Os in a 676-FBGA (27×27) package enable broad external connectivity and board routing flexibility.
  • Package & Mounting  676-BGA (676-FBGA) surface-mount package (27 × 27) for high-density board designs.
  • Power Supply  Core supply range specified at 1.425 V to 1.575 V for integration into regulated power domains.
  • Industrial Temperature Range  Rated for −40 °C to 100 °C operation, suitable for industrial environments.
  • Architecture-Level Features  Virtex-II platform capabilities include SelectRAM memory hierarchy, dedicated 18-bit × 18-bit multiplier blocks, Digital Clock Manager (DCM) blocks, and SelectIO™-Ultra technology with Digitally Controlled Impedance (DCI) — providing flexible clocking, arithmetic acceleration and multiple I/O standards support.
  • RoHS Compliant  Device manufacturing complies with RoHS requirements.

Typical Applications

  • High-speed memory interfaces  Implement SDR/DDR memory controllers and custom SRAM/DRAM interfaces using the device’s embedded RAM and interface-oriented architecture features.
  • Signal and data path processing  Use dedicated multiplier blocks and on-chip RAM for arithmetic-heavy functions, filtering, and data buffering in real-time pipelines.
  • Custom protocol bridging  Leverage abundant logic and flexible I/O to create protocol translators, custom communications endpoints and interface glue logic.

Unique Advantages

  • High logic density: 17,280 logic elements and 1.5M gates enable consolidation of multiple functions into a single programmable device, reducing system complexity.
  • Significant on-chip RAM: Approximately 0.885 Mbits of embedded memory supports buffer and state storage without immediate dependence on external memory.
  • Flexible I/O and interface support: 392 user I/Os and Virtex-II SelectIO features provide support for a range of signaling standards and board-level connectivity options.
  • Built-in arithmetic and clock management: Dedicated 18×18 multipliers and Digital Clock Manager blocks facilitate efficient implementation of arithmetic modules and precise clocking/topologies.
  • Industrial robustness: Rated from −40 °C to 100 °C and supplied in a 676-FBGA surface-mount package to meet industrial application requirements.
  • Standards-aware platform features: Series-level Virtex-II capabilities include SelectRAM memory hierarchy and Digitally Controlled Impedance (DCI) for on-chip termination and signal integrity options.

Why Choose XC2V1500-5FGG676I?

The XC2V1500-5FGG676I combines substantial logic capacity, embedded memory and a broad set of architectural features drawn from the Virtex-II platform to address complex embedded and digital system requirements. Its mix of logic, RAM and I/O resources makes it well suited for designers who need to implement high-density custom logic, memory interfaces and arithmetic-accelerated functions within an industrial temperature envelope.

For teams focused on reducing board-level complexity while retaining design flexibility, this FPGA provides a scalable, reprogrammable building block backed by the Virtex-II architecture and designed for integration into professional embedded products.

Request a quote or submit a sales inquiry to check availability, lead times and pricing for the XC2V1500-5FGG676I. Our team can provide technical availability details and help with order placement.

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