XC2V1500-5FGG676I
| Part Description |
Virtex®-II Field Programmable Gate Array (FPGA) IC 392 884736 676-BGA |
|---|---|
| Quantity | 142 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BGA | Number of I/O | 392 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1920 | Number of Logic Elements/Cells | 17280 | ||
| Number of Gates | 1500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 884736 |
Overview of XC2V1500-5FGG676I – Virtex®-II FPGA, 676-BGA, 1,500,000 gates
The XC2V1500-5FGG676I is a Virtex®-II field programmable gate array (FPGA) in a 676-ball fine-pitch BGA (27 × 27) package, offered by AMD. It provides a high-density, reprogrammable logic fabric with 17,280 logic elements and substantial embedded memory, combined with flexible I/O and industrial-grade temperature range for demanding embedded and digital systems.
Engineered for designs that require on-chip memory, arithmetic acceleration and robust interfacing, this device delivers a combination of logic capacity, embedded RAM and I/O resources suited to complex system functions such as memory controllers, data path processing and hardware-accelerated logic.
Key Features
- Logic Capacity 17,280 logic elements (equivalent cells) and an effective system gate count of 1,500,000 provide resources for complex custom logic and state machines.
- Embedded Memory Approximately 0.885 Mbits of on-chip RAM (884,736 total bits) supports data buffering, FIFOs and small on-chip data stores.
- I/O Resources 392 user I/Os in a 676-FBGA (27×27) package enable broad external connectivity and board routing flexibility.
- Package & Mounting 676-BGA (676-FBGA) surface-mount package (27 × 27) for high-density board designs.
- Power Supply Core supply range specified at 1.425 V to 1.575 V for integration into regulated power domains.
- Industrial Temperature Range Rated for −40 °C to 100 °C operation, suitable for industrial environments.
- Architecture-Level Features Virtex-II platform capabilities include SelectRAM memory hierarchy, dedicated 18-bit × 18-bit multiplier blocks, Digital Clock Manager (DCM) blocks, and SelectIO™-Ultra technology with Digitally Controlled Impedance (DCI) — providing flexible clocking, arithmetic acceleration and multiple I/O standards support.
- RoHS Compliant Device manufacturing complies with RoHS requirements.
Typical Applications
- High-speed memory interfaces Implement SDR/DDR memory controllers and custom SRAM/DRAM interfaces using the device’s embedded RAM and interface-oriented architecture features.
- Signal and data path processing Use dedicated multiplier blocks and on-chip RAM for arithmetic-heavy functions, filtering, and data buffering in real-time pipelines.
- Custom protocol bridging Leverage abundant logic and flexible I/O to create protocol translators, custom communications endpoints and interface glue logic.
Unique Advantages
- High logic density: 17,280 logic elements and 1.5M gates enable consolidation of multiple functions into a single programmable device, reducing system complexity.
- Significant on-chip RAM: Approximately 0.885 Mbits of embedded memory supports buffer and state storage without immediate dependence on external memory.
- Flexible I/O and interface support: 392 user I/Os and Virtex-II SelectIO features provide support for a range of signaling standards and board-level connectivity options.
- Built-in arithmetic and clock management: Dedicated 18×18 multipliers and Digital Clock Manager blocks facilitate efficient implementation of arithmetic modules and precise clocking/topologies.
- Industrial robustness: Rated from −40 °C to 100 °C and supplied in a 676-FBGA surface-mount package to meet industrial application requirements.
- Standards-aware platform features: Series-level Virtex-II capabilities include SelectRAM memory hierarchy and Digitally Controlled Impedance (DCI) for on-chip termination and signal integrity options.
Why Choose XC2V1500-5FGG676I?
The XC2V1500-5FGG676I combines substantial logic capacity, embedded memory and a broad set of architectural features drawn from the Virtex-II platform to address complex embedded and digital system requirements. Its mix of logic, RAM and I/O resources makes it well suited for designers who need to implement high-density custom logic, memory interfaces and arithmetic-accelerated functions within an industrial temperature envelope.
For teams focused on reducing board-level complexity while retaining design flexibility, this FPGA provides a scalable, reprogrammable building block backed by the Virtex-II architecture and designed for integration into professional embedded products.
Request a quote or submit a sales inquiry to check availability, lead times and pricing for the XC2V1500-5FGG676I. Our team can provide technical availability details and help with order placement.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








