XC2V1500-5BGG575I
| Part Description |
Virtex®-II Field Programmable Gate Array (FPGA) IC 392 884736 575-BBGA |
|---|---|
| Quantity | 1,329 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 575-BGA (31x31) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 575-BBGA | Number of I/O | 392 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1920 | Number of Logic Elements/Cells | 17280 | ||
| Number of Gates | 1500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 884736 |
Overview of XC2V1500-5BGG575I – Virtex®-II FPGA, 1.5M gates, 575-BBGA
The XC2V1500-5BGG575I is a Virtex®-II Field Programmable Gate Array (FPGA) provided by AMD. It combines a high gate count FPGA fabric with substantial embedded memory and a large I/O complement, delivered in a 575-ball BGA package for surface-mount applications.
This device targets industrial applications that require sizable logic capacity, embedded RAM, and flexible high-speed interfaces—enabling memory interfaces, arithmetic acceleration, and complex system glue logic while operating across a wide temperature and supply range.
Key Features
- Logic Capacity — Approximately 1,500,000 system gates with 17,280 logic elements, providing a platform for complex combinational and sequential logic designs.
- Embedded Memory — Approximately 0.885 Mbits of on-chip RAM (884,736 total RAM bits) for data buffering, FIFO structures, and embedded storage.
- I/O Density — 392 user I/Os to interface directly with multiple peripherals, external memories, and high-pin-count subsystems.
- Arithmetic and DSP Resources — Dedicated multiplier blocks and SelectRAM memory hierarchy to support arithmetic acceleration and DSP-style processing (as detailed in the Virtex-II platform specification).
- Clock Management — Integrated clock management features described in the Virtex-II family documentation, including Digital Clock Manager (DCM) functionality for precise clock control.
- Package and Mounting — 575-BBGA package (575-BGA, 31 × 31 mm), surface-mount mounting type suitable for high-density board designs.
- Power and Operating Range — Supported core voltage range 1.425 V to 1.575 V and industrial operating temperature range −40 °C to 100 °C.
- Environmental Compliance — RoHS compliant.
Typical Applications
- High‑performance memory interfaces — Implement SDR/DDR, SRAM, or specialized DRAM interfaces using the device’s embedded memory resources and I/O density for connection to external memory devices.
- DSP and arithmetic acceleration — Leverage on‑chip multiplier blocks and embedded RAM to implement signal processing pipelines and fixed-point arithmetic functions.
- System glue and protocol bridging — Use the abundant logic elements and 392 I/Os to consolidate glue logic, protocol conversion, and multi‑lane interfaces on a single device.
- Industrial control and automation — Industrial-grade temperature range and robust packaging make the device suitable for control systems, motor drives, and factory automation subsystems.
Unique Advantages
- High integration density: 1.5M gates and 17,280 logic elements reduce external components by consolidating complex control and processing functions on one FPGA.
- Substantial on‑chip RAM: Approximately 0.885 Mbits of embedded memory supports deep buffering and embedded data structures without immediate reliance on external RAM.
- Large I/O complement: 392 I/Os enable direct interfacing to multiple peripherals and parallel buses, minimizing the need for external I/O expansion.
- Industrial temperature capability: Specified operation from −40 °C to 100 °C supports deployment in demanding industrial environments.
- Standard BGA packaging: 575-ball BGA (31 × 31 mm) provides a compact, manufacturable form factor for high-density boards.
- Regulatory readiness: RoHS compliance supports environmentally regulated product designs.
Why Choose XC2V1500-5BGG575I?
The XC2V1500-5BGG575I positions itself as a high-capacity Virtex®-II FPGA option that balances logic density, embedded memory, and extensive I/O in a single industrial-grade package. Its combination of approximately 1.5M system gates, roughly 0.885 Mbits of on-chip RAM, and 392 I/Os supports complex system designs that require on‑chip acceleration, large buffering, and broad peripheral connectivity.
This device is appropriate for engineering teams building industrial control systems, memory interfaces, DSP accelerators, or consolidation-focused designs that benefit from the Virtex-II platform’s clock management and arithmetic resources. The industrial operating range and RoHS compliance add practical value for long-term deployment and regulatory alignment.
Request a quote or submit an inquiry to check availability and pricing for XC2V1500-5BGG575I and to discuss how this FPGA can fit into your next design.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








