XC2V1500-5BG575I
| Part Description |
Virtex®-II Field Programmable Gate Array (FPGA) IC 392 884736 575-BBGA |
|---|---|
| Quantity | 1,320 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 575-BGA (31x31) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 575-BBGA | Number of I/O | 392 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1920 | Number of Logic Elements/Cells | 17280 | ||
| Number of Gates | 1500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 884736 |
Overview of XC2V1500-5BG575I – Virtex®-II Field Programmable Gate Array (FPGA) IC 392 884736 575-BBGA
The XC2V1500-5BG575I is a Virtex®-II platform FPGA offered in a 575-ball BGA package. It provides a high-density, industrial-grade programmable logic solution with 1,500,000 gates and a comprehensive set of on-chip resources for system-level integration.
Designed for applications requiring substantial logic, embedded memory, and flexible I/O, this device combines 1,920 CLBs, 17,280 logic elements, approximately 0.885 Mbits of embedded memory, and 392 user I/Os to support complex digital designs across communications, data processing, and control systems.
Key Features
- Logic Resources 1,920 configurable logic blocks (CLBs) and 17,280 logic elements provide the programmable fabric required for complex logic implementation.
- On-Chip Memory Approximately 0.885 Mbits of embedded RAM (884,736 bits) supports data buffering, state storage, and intermediate processing without external memory.
- Gate Density 1,500,000 system gates enable high integration density for feature-rich designs.
- Rich I/O 392 user I/Os accommodate extensive external interfacing and high-pin-count system requirements.
- Dedicated Arithmetic Blocks Series-level architecture includes 18-bit × 18-bit multiplier blocks for efficient implementation of DSP and arithmetic functions.
- Clock Management Series features Digital Clock Manager (DCM) modules and global clock multiplexing to support precise clocking and timing control in complex systems.
- Package 575-BBGA package (supplier package: 575-BGA, 31×31) for high-density board integration and robust soldered placement.
- Supply Voltage Core supply range of 1.425 V to 1.575 V to match system power rails and board-level power designs.
- Industrial Temperature Range Rated for operation from −40°C to 100°C, suitable for industrial environments.
- RoHS Compliant Manufactured to meet RoHS environmental requirements.
Typical Applications
- Telecommunications & Networking High gate count and abundant I/O make the device suitable for packet processing, protocol bridging, and custom interface logic.
- Signal Processing Embedded RAM and dedicated multiplier resources enable implementation of DSP functions such as filters, FFTs, and data path acceleration.
- Memory Interface Controllers On-chip resources and series-level support for high-performance external memory interfaces facilitate DRAM and SRAM controller designs.
- Embedded System Control Large logic capacity and flexible I/O support complex control, monitoring, and timing functions in industrial automation and instrumentation.
Unique Advantages
- High integration density: With 1.5M gates and 17,280 logic elements, the device reduces the need for multiple discrete components and simplifies board-level integration.
- Substantial on-chip memory: Approximately 0.885 Mbits of embedded RAM supports local buffering and state retention, lowering external memory dependency.
- Flexible I/O count: 392 user I/Os enable wide connectivity to peripherals, memory devices, and high-pin-count boards without additional interface chips.
- Industrial operating range: Rated from −40°C to 100°C for reliable operation in demanding industrial environments.
- Compact BGA package: The 575-BBGA package provides a high-pin-count solution in a single, manufacturable footprint for space-constrained designs.
- Standards-conscious manufacturing: RoHS compliance supports environmental and regulatory requirements.
Why Choose XC2V1500-5BG575I?
The XC2V1500-5BG575I positions itself as a high-density, industrial-grade Virtex®-II FPGA option for designs that require a balance of logic capacity, embedded memory, and extensive I/O. Its combination of 1.5M gates, 17,280 logic elements, approximately 0.885 Mbits of on-chip RAM, and 392 I/Os makes it suitable for system-level integration where consolidation of functionality and reliable operation across a wide temperature range are important.
Choose this device when your project demands scalable programmable logic, substantive embedded resources, and a rugged package suitable for industrial applications—backed by the Virtex-II series architecture and capabilities documented in the product specification.
Request a quote or submit an inquiry for pricing and availability of the XC2V1500-5BG575I to evaluate it for your next design project.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








