XC2V1500-5BG575I

IC FPGA 392 I/O 575BGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 392 884736 575-BBGA

Quantity 1,320 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package575-BGA (31x31)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case575-BBGANumber of I/O392Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1920Number of Logic Elements/Cells17280
Number of Gates1500000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits884736

Overview of XC2V1500-5BG575I – Virtex®-II Field Programmable Gate Array (FPGA) IC 392 884736 575-BBGA

The XC2V1500-5BG575I is a Virtex®-II platform FPGA offered in a 575-ball BGA package. It provides a high-density, industrial-grade programmable logic solution with 1,500,000 gates and a comprehensive set of on-chip resources for system-level integration.

Designed for applications requiring substantial logic, embedded memory, and flexible I/O, this device combines 1,920 CLBs, 17,280 logic elements, approximately 0.885 Mbits of embedded memory, and 392 user I/Os to support complex digital designs across communications, data processing, and control systems.

Key Features

  • Logic Resources  1,920 configurable logic blocks (CLBs) and 17,280 logic elements provide the programmable fabric required for complex logic implementation.
  • On-Chip Memory  Approximately 0.885 Mbits of embedded RAM (884,736 bits) supports data buffering, state storage, and intermediate processing without external memory.
  • Gate Density  1,500,000 system gates enable high integration density for feature-rich designs.
  • Rich I/O  392 user I/Os accommodate extensive external interfacing and high-pin-count system requirements.
  • Dedicated Arithmetic Blocks  Series-level architecture includes 18-bit × 18-bit multiplier blocks for efficient implementation of DSP and arithmetic functions.
  • Clock Management  Series features Digital Clock Manager (DCM) modules and global clock multiplexing to support precise clocking and timing control in complex systems.
  • Package  575-BBGA package (supplier package: 575-BGA, 31×31) for high-density board integration and robust soldered placement.
  • Supply Voltage  Core supply range of 1.425 V to 1.575 V to match system power rails and board-level power designs.
  • Industrial Temperature Range  Rated for operation from −40°C to 100°C, suitable for industrial environments.
  • RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

  • Telecommunications & Networking  High gate count and abundant I/O make the device suitable for packet processing, protocol bridging, and custom interface logic.
  • Signal Processing  Embedded RAM and dedicated multiplier resources enable implementation of DSP functions such as filters, FFTs, and data path acceleration.
  • Memory Interface Controllers  On-chip resources and series-level support for high-performance external memory interfaces facilitate DRAM and SRAM controller designs.
  • Embedded System Control  Large logic capacity and flexible I/O support complex control, monitoring, and timing functions in industrial automation and instrumentation.

Unique Advantages

  • High integration density: With 1.5M gates and 17,280 logic elements, the device reduces the need for multiple discrete components and simplifies board-level integration.
  • Substantial on-chip memory: Approximately 0.885 Mbits of embedded RAM supports local buffering and state retention, lowering external memory dependency.
  • Flexible I/O count: 392 user I/Os enable wide connectivity to peripherals, memory devices, and high-pin-count boards without additional interface chips.
  • Industrial operating range: Rated from −40°C to 100°C for reliable operation in demanding industrial environments.
  • Compact BGA package: The 575-BBGA package provides a high-pin-count solution in a single, manufacturable footprint for space-constrained designs.
  • Standards-conscious manufacturing: RoHS compliance supports environmental and regulatory requirements.

Why Choose XC2V1500-5BG575I?

The XC2V1500-5BG575I positions itself as a high-density, industrial-grade Virtex®-II FPGA option for designs that require a balance of logic capacity, embedded memory, and extensive I/O. Its combination of 1.5M gates, 17,280 logic elements, approximately 0.885 Mbits of on-chip RAM, and 392 I/Os makes it suitable for system-level integration where consolidation of functionality and reliable operation across a wide temperature range are important.

Choose this device when your project demands scalable programmable logic, substantive embedded resources, and a rugged package suitable for industrial applications—backed by the Virtex-II series architecture and capabilities documented in the product specification.

Request a quote or submit an inquiry for pricing and availability of the XC2V1500-5BG575I to evaluate it for your next design project.

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