XC2V1500-4FFG896C

IC FPGA 528 I/O 896FCBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 528 884736 896-BBGA, FCBGA

Quantity 1,820 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package896-FCBGA (31x31)GradeCommercialOperating Temperature0°C – 85°C
Package / Case896-BBGA, FCBGANumber of I/O528Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs1920Number of Logic Elements/Cells17280
Number of Gates1500000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits884736

Overview of XC2V1500-4FFG896C – Virtex®-II Field Programmable Gate Array (896-FCBGA)

The XC2V1500-4FFG896C is a Virtex®-II series Field Programmable Gate Array (FPGA) offered in an 896-ball flip-chip BGA (31×31) package for surface-mount assembly. It delivers high logic capacity and embedded memory with flexible I/O and clocking features suitable for commercial-grade applications requiring complex programmable logic and advanced memory interfaces.

Designed to support high-density logic, on-chip RAM, and a large I/O count, this device is aimed at applications such as memory interface controllers, data-path acceleration, and system-level glue logic where integration and reprogrammability are key.

Key Features

  • Logic Capacity  Approximately 17,280 logic elements and 1,500,000 system gates provide ample resources for medium- to high-complexity designs.
  • Embedded Memory  Approximately 0.885 Mbits of on-chip RAM (884,736 bits) in block SelectRAM resources for data buffering, FIFOs, and state storage.
  • High I/O Count  528 user I/Os enable wide parallel interfaces and dense connectivity to external devices and memory.
  • Multipliers and Arithmetic  Series-level support for dedicated 18-bit × 18-bit multiplier blocks for efficient arithmetic and DSP implementations.
  • Clock Management  Digital Clock Manager (DCM) circuitry (as provided in the Virtex-II platform) supports precise clock de-skew, frequency synthesis and phase shifting for robust timing control.
  • SelectRAM and Memory Hierarchy  SelectRAM™ block resources and distributed RAM support complex memory architectures and fast on-chip storage.
  • Configurable I/O Technology  SelectIO™-style functionality: multiple single-ended and differential I/O standards and programmable I/O characteristics to support diverse signaling requirements.
  • Power and Supply  Specified core voltage range: 1.425 V to 1.575 V.
  • Package and Mounting  896-FCBGA (31×31) package case; surface-mount mounting type for PCB assembly.
  • Commercial Grade Temperature Range  Rated for 0°C to 85°C operation.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • Memory Interface Controllers  Use the device’s SelectRAM resources and high I/O count to implement SDR/DDR and SRAM interface logic for memory controllers and buffer engines.
  • Data Path Acceleration  Leverage the dedicated multiplier blocks and abundant logic elements for arithmetic-heavy signal processing and data-path acceleration tasks.
  • High-Density Glue Logic  High logic capacity and wide I/O enable consolidation of multiple glue-logic functions and bus translation in embedded systems.

Unique Advantages

  • High Integration: Combining roughly 17,280 logic elements with nearly 0.885 Mbits of embedded RAM reduces the need for external logic and discrete memory components.
  • Flexible I/O and Signaling: 528 user I/Os provide extensive connectivity options for parallel interfaces and memory buses, simplifying board-level routing and system partitioning.
  • Dedicated Arithmetic Resources: Built-in 18×18 multiplier blocks accelerate implementation of DSP and arithmetic functions without consuming general-purpose logic.
  • Robust Clock Management: On-chip clock management capabilities (DCM) enable refined timing control for multi-clock systems and high-performance data paths.
  • Commercial Temperature and RoHS Compliance: Commercial operating range (0°C to 85°C) and RoHS compliance meet standard commercial product requirements.
  • Surface-Mount BGA Packaging: 896-FCBGA (31×31) package offers a high-pin-count, compact footprint suitable for dense PCB layouts.

Why Choose XC2V1500-4FFG896C?

The XC2V1500-4FFG896C positions itself as a versatile, commercial-grade FPGA option within the Virtex®-II platform family, offering a strong balance of logic capacity, embedded memory, and high I/O count in a compact FCBGA package. It is well suited for designers implementing complex memory interfaces, data-path processing, or integrated system functions that benefit from reprogrammability and on-chip resources.

Supported by the Virtex-II platform’s architecture and development ecosystem, this device provides a predictable hardware foundation for scaling designs and integrating dedicated arithmetic and clocking features without relying on extensive external components.

Request a quote or submit a purchase inquiry to evaluate the XC2V1500-4FFG896C for your next project.

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