XC2V1500-4BG575I
| Part Description |
Virtex®-II Field Programmable Gate Array (FPGA) IC 392 884736 575-BBGA |
|---|---|
| Quantity | 453 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 575-BGA (31x31) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 575-BBGA | Number of I/O | 392 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1920 | Number of Logic Elements/Cells | 17280 | ||
| Number of Gates | 1500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 884736 |
Overview of XC2V1500-4BG575I – Virtex®-II Field Programmable Gate Array (FPGA) IC 392 884736 575-BBGA
The XC2V1500-4BG575I is an AMD Virtex®-II platform FPGA in a 575-ball BGA (31×31 mm) package designed for industrial applications. It combines high-density logic, on-chip embedded memory, and a broad set of I/O resources to support custom digital designs that require substantial integration in a single device.
Key architectural elements include approximately 17,280 logic elements, roughly 1.5 million gates, and approximately 0.885 Mbits of embedded RAM, delivering a compact solution for complex control, signal processing, and protocol-bridging functions in industrial systems.
Key Features
- Core Logic Approximately 17,280 logic elements and 1,500,000 system gates provide substantial programmable fabric for complex logic and state-machine implementations.
- Embedded Memory Approximately 0.885 Mbits of on-chip RAM (884,736 total bits) suitable for buffering, FIFOs, and small on-chip data storage.
- I/O Capacity 392 user I/O pins support wide connectivity to peripherals, memory devices, and external logic while enabling flexible board-level interfacing.
- Arithmetic and Clock Management (Series Features) Series-level capabilities include dedicated 18-bit × 18-bit multiplier blocks and Digital Clock Manager (DCM) modules for frequency synthesis and clock de-skew as described in the Virtex-II platform documentation.
- Package & Mounting 575-BBGA package (31×31 mm) with surface-mount construction provides a high-density board footprint suited to compact systems.
- Power and Supply Specified core voltage range of 1.425 V to 1.575 V for predictable power planning and regulator selection.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C, supporting deployment in industrial environments.
- Regulatory & Reliability RoHS compliant, supporting environmentally conscious designs and regulatory requirements.
Typical Applications
- Industrial Control — Integration of custom control logic, signal conditioning, and protocol translation in factory automation and process-control equipment.
- Communications Infrastructure — Implementation of custom packet processing, interface bridging, or protocol adaptation where substantial logic and I/O are required.
- Data Acquisition & Signal Processing — On-chip memory and multiplier resources support buffering and arithmetic tasks for sensor data aggregation and preprocessing.
Unique Advantages
- High Integration Density: With roughly 1.5 million gates and 17,280 logic elements, the device reduces board-level component count by consolidating complex designs into a single FPGA.
- Substantial On-Chip Memory: Approximately 0.885 Mbits of embedded RAM enables local buffering and reduces external memory dependency for many use cases.
- Extensive I/O Resources: 392 I/Os provide flexible connectivity for multiple interfaces and peripheral sets without sacrificing board real estate.
- Industrial-Grade Operation: Specified operation from −40 °C to 100 °C and RoHS compliance make the device suitable for industrial deployments requiring robust thermal performance and regulatory conformance.
- Compact, Surface-Mount Package: The 575-BBGA (31×31 mm) package balances high pin-count capability with a compact footprint for space-constrained designs.
Why Choose XC2V1500-4BG575I?
The XC2V1500-4BG575I positions itself as a high-density, industrial-grade Virtex-II FPGA option for designs that need a balance of programmable logic, embedded memory, and substantial I/O in a compact BGA package. Its combination of approximately 17,280 logic elements, roughly 0.885 Mbits of on-chip RAM, and 392 I/Os supports designs ranging from industrial control to communications and data-acquisition systems.
Developers and procurement teams seeking a proven platform-level FPGA with series-level capabilities for arithmetic blocks and clock management will find the XC2V1500-4BG575I a capable device for mid- to high-complexity programmable logic applications where industrial temperature operation and RoHS compliance are required.
Request a quote or submit your requirements to receive pricing and availability information for the XC2V1500-4BG575I. Our team can help determine fit for your design and provide lead-time guidance.

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