XC2V1000-6FGG256C
| Part Description |
Virtex®-II Field Programmable Gate Array (FPGA) IC 172 737280 256-BGA |
|---|---|
| Quantity | 1,274 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 172 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1280 | Number of Logic Elements/Cells | 11520 | ||
| Number of Gates | 1000000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 737280 |
Overview of XC2V1000-6FGG256C – Virtex®-II Field Programmable Gate Array (FPGA) 256‑BGA
The XC2V1000-6FGG256C is a Virtex®-II platform FPGA IC delivering a balanced combination of logic, embedded memory, DSP resources and high-density I/O in a 256-ball BGA package. It is suited to commercial embedded designs that require substantial on-chip logic and memory alongside flexible I/O and clock management capabilities.
As a member of the Virtex-II family, the device targets applications that integrate logic, SelectRAM-style embedded memory, and arithmetic/multiplier functions while supporting a 1.425 V–1.575 V core supply and commercial temperature operation.
Key Features
- Logic Capacity Provides 11,520 logic elements and 1,280 CLBs (configurable logic blocks) to implement complex digital logic and control functions.
- Embedded Memory Approximately 0.74 Mbits of on-chip RAM (737,280 total RAM bits) for local buffering, FIFOs and state storage.
- DSP and Arithmetic Resources Virtex-II platform includes dedicated multiplier resources suitable for arithmetic-intensive functions (series feature).
- High‑Density I/O 172 user I/O pins support broad interfacing options for external devices and memory.
- Package and Mounting 256-ball fine-pitch BGA (256-FBGA, 17×17) in a surface-mount form factor for compact PCB integration.
- Power and Temperature Core voltage supply range of 1.425 V to 1.575 V; commercial operating temperature range from 0 °C to 85 °C.
- Integration and Standards (Platform) Virtex-II platform capabilities include SelectRAM memory hierarchy, 18×18 multipliers, and Digital Clock Manager (DCM) features as described in the series documentation.
- Environmental Compliance RoHS compliant for materials and assembly.
Typical Applications
- Embedded Control and SoC Prototyping Use the on-chip logic and memory to prototype control engines, custom peripherals, and system integration functions.
- High‑Performance I/O Bridging 172 user I/Os enable board-level interface bridging between processors, memory devices and peripherals.
- Signal Processing and Arithmetic Leverage the Virtex-II platform’s dedicated multipliers and logic fabric for DSP tasks, data aggregation and filtering.
- Memory Interface and Buffering Embedded RAM resources provide local buffering for DRAM/SRAM interfaces and packet or streaming data handling.
Unique Advantages
- Balanced Logic and Memory: 11,520 logic elements combined with approximately 0.74 Mbits of embedded RAM lets designers implement both control logic and data buffering on-chip.
- Flexible I/O Count: 172 user I/Os accommodate wide bus interfaces and mixed-signal board designs without immediate external glue logic.
- Compact, Surface‑Mount Package: 256-FBGA (17×17) enables high-density PCB layouts while keeping the device surface-mount for automated assembly.
- Commercial Temperature Range: Rated 0 °C to 85 °C for standard commercial deployments where industrial grading is not required.
- Standards-Based Platform Features: Built on the Virtex-II architecture with SelectRAM, clock management and multiplier resources described in the platform documentation, simplifying migration across family devices.
- Regulatory Compliance: RoHS compliance supports modern manufacturing and environmental requirements.
Why Choose XC2V1000-6FGG256C?
The XC2V1000-6FGG256C offers a practical mix of logic density, embedded memory and I/O in a compact 256-BGA package for commercial embedded designs. Its Virtex-II platform heritage provides platform-level features—such as SelectRAM memory resources and dedicated arithmetic blocks—that designers can leverage to implement data buffering, arithmetic processing and flexible interfacing without excessive external components.
This device is well suited to engineering teams building prototypes, I/O‑rich controllers, or DSP-accelerated functions who require a commercially-rated FPGA with verified platform capabilities and RoHS compliance. The combination of on-chip resources and package density provides a cost-effective path for mid-range FPGA integration.
Request a quote or submit a procurement inquiry today to check availability and pricing for the XC2V1000-6FGG256C.

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