XC2V1000-6FGG256C

IC FPGA 172 I/O 256FBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 172 737280 256-BGA

Quantity 1,274 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O172Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1280Number of Logic Elements/Cells11520
Number of Gates1000000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits737280

Overview of XC2V1000-6FGG256C – Virtex®-II Field Programmable Gate Array (FPGA) 256‑BGA

The XC2V1000-6FGG256C is a Virtex®-II platform FPGA IC delivering a balanced combination of logic, embedded memory, DSP resources and high-density I/O in a 256-ball BGA package. It is suited to commercial embedded designs that require substantial on-chip logic and memory alongside flexible I/O and clock management capabilities.

As a member of the Virtex-II family, the device targets applications that integrate logic, SelectRAM-style embedded memory, and arithmetic/multiplier functions while supporting a 1.425 V–1.575 V core supply and commercial temperature operation.

Key Features

  • Logic Capacity  Provides 11,520 logic elements and 1,280 CLBs (configurable logic blocks) to implement complex digital logic and control functions.
  • Embedded Memory  Approximately 0.74 Mbits of on-chip RAM (737,280 total RAM bits) for local buffering, FIFOs and state storage.
  • DSP and Arithmetic Resources  Virtex-II platform includes dedicated multiplier resources suitable for arithmetic-intensive functions (series feature).
  • High‑Density I/O  172 user I/O pins support broad interfacing options for external devices and memory.
  • Package and Mounting  256-ball fine-pitch BGA (256-FBGA, 17×17) in a surface-mount form factor for compact PCB integration.
  • Power and Temperature  Core voltage supply range of 1.425 V to 1.575 V; commercial operating temperature range from 0 °C to 85 °C.
  • Integration and Standards (Platform)  Virtex-II platform capabilities include SelectRAM memory hierarchy, 18×18 multipliers, and Digital Clock Manager (DCM) features as described in the series documentation.
  • Environmental Compliance  RoHS compliant for materials and assembly.

Typical Applications

  • Embedded Control and SoC Prototyping  Use the on-chip logic and memory to prototype control engines, custom peripherals, and system integration functions.
  • High‑Performance I/O Bridging  172 user I/Os enable board-level interface bridging between processors, memory devices and peripherals.
  • Signal Processing and Arithmetic  Leverage the Virtex-II platform’s dedicated multipliers and logic fabric for DSP tasks, data aggregation and filtering.
  • Memory Interface and Buffering  Embedded RAM resources provide local buffering for DRAM/SRAM interfaces and packet or streaming data handling.

Unique Advantages

  • Balanced Logic and Memory:  11,520 logic elements combined with approximately 0.74 Mbits of embedded RAM lets designers implement both control logic and data buffering on-chip.
  • Flexible I/O Count:  172 user I/Os accommodate wide bus interfaces and mixed-signal board designs without immediate external glue logic.
  • Compact, Surface‑Mount Package:  256-FBGA (17×17) enables high-density PCB layouts while keeping the device surface-mount for automated assembly.
  • Commercial Temperature Range:  Rated 0 °C to 85 °C for standard commercial deployments where industrial grading is not required.
  • Standards-Based Platform Features:  Built on the Virtex-II architecture with SelectRAM, clock management and multiplier resources described in the platform documentation, simplifying migration across family devices.
  • Regulatory Compliance:  RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose XC2V1000-6FGG256C?

The XC2V1000-6FGG256C offers a practical mix of logic density, embedded memory and I/O in a compact 256-BGA package for commercial embedded designs. Its Virtex-II platform heritage provides platform-level features—such as SelectRAM memory resources and dedicated arithmetic blocks—that designers can leverage to implement data buffering, arithmetic processing and flexible interfacing without excessive external components.

This device is well suited to engineering teams building prototypes, I/O‑rich controllers, or DSP-accelerated functions who require a commercially-rated FPGA with verified platform capabilities and RoHS compliance. The combination of on-chip resources and package density provides a cost-effective path for mid-range FPGA integration.

Request a quote or submit a procurement inquiry today to check availability and pricing for the XC2V1000-6FGG256C.

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