XC2V1000-6FFG896C

IC FPGA 432 I/O 896FCBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 432 737280 896-BBGA, FCBGA

Quantity 96 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package896-FCBGA (31x31)GradeCommercialOperating Temperature0°C – 85°C
Package / Case896-BBGA, FCBGANumber of I/O432Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs1280Number of Logic Elements/Cells11520
Number of Gates1000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits737280

Overview of XC2V1000-6FFG896C – Virtex®-II Field Programmable Gate Array (FPGA) IC 432 737280 896-BBGA, FCBGA

The XC2V1000-6FFG896C is a Virtex®-II class FPGA offered in an 896-ball flip-chip FCBGA package (31 × 31 mm). It delivers a one-million-gate-class, reprogrammable logic platform with 11,520 logic elements and 1,280 CLBs for implementing medium-density custom digital systems.

Designed for commercial-grade applications, this device integrates approximately 0.74 Mbits of embedded RAM, 432 user I/O pins, and on-chip resources suited for memory interfaces, arithmetic functions and custom I/O logic—all within a surface-mount FCBGA package. The device operates from a 1.425 V to 1.575 V core supply and is rated for 0 °C to 85 °C operation.

Key Features

  • Core Logic 1,280 configurable logic blocks (CLBs) and approximately 11,520 logic elements provide a reprogrammable fabric for implementing custom digital logic and control functions.
  • Embedded Memory & DSP Approximately 0.74 Mbits of on-chip RAM in 18-Kb block SelectRAM resources and dedicated 18-bit × 18-bit multiplier blocks support local storage and arithmetic acceleration.
  • I/O Capacity 432 user I/O pins in the 896-FCBGA package enable broad external connectivity for parallel buses, memory interfaces and custom signaling.
  • Architecture & Platform Features Based on the Virtex-II platform, the device benefits from SelectRAM memory hierarchy, configurable logic arrays and dedicated arithmetic resources as described in the Virtex-II specification.
  • Clocking & Timing Platform-level features include digital clock management and global clock distribution resources to support synchronous designs (see Virtex-II platform documentation for details).
  • Package & Power 896-FCBGA (31 × 31 mm) surface-mount package; core voltage supply range 1.425 V to 1.575 V for the device.
  • Operating Range & Compliance Commercial grade device with an operating temperature of 0 °C to 85 °C and RoHS-compliant status.
  • Development Ecosystem Supported by the Virtex-II platform development tools and vendor-supplied design flows referenced in the device datasheet.

Typical Applications

  • Memory Interface & Bridging Use the device's abundant I/O and SelectRAM resources to implement SDR/DDR or SRAM interface logic and custom memory controllers.
  • Digital Signal Processing Dedicated 18×18 multipliers and embedded RAM make the device suitable for medium-complexity DSP blocks, filters and arithmetic accelerators.
  • High‑I/O System Glue Logic With 432 user I/Os and flexible I/O standards at the platform level, the FPGA is well-suited for protocol bridging, bus interfacing and custom peripheral integration.
  • Custom Control and Prototyping Reprogrammable logic density and on-chip resources enable rapid implementation of control algorithms, state machines and prototype systems.

Unique Advantages

  • Balanced logic and memory: Approximately 11,520 logic elements paired with ~0.74 Mbits of embedded RAM deliver a balanced resource mix for control and data-path functions.
  • Substantial I/O count: 432 user I/Os in a compact 896-FCBGA package simplify system-level integration without large PCB footprints.
  • Platform-level DSP support: On-chip 18 × 18 multipliers and SelectRAM blocks provide native support for arithmetic and buffering tasks, reducing external component needs.
  • Commercial temperature rating: 0 °C to 85 °C operation aligns the device to a wide range of commercial and enterprise applications.
  • RoHS compliant: Environmentally compliant manufacturing status supports regulatory and supply-chain requirements.

Why Choose XC2V1000-6FFG896C?

The XC2V1000-6FFG896C positions itself as a versatile, mid-density Virtex-II FPGA option—offering a one-million-gate-class architecture with a balanced combination of logic, embedded RAM and dedicated arithmetic blocks. Its 432 I/O pins and compact 896-FCBGA package make it practical for systems that require significant external interfacing without excessive board area.

For designers seeking a commercial-grade, reprogrammable solution with platform-level features documented in the Virtex-II family specification, this device provides a clear tradeoff of integration and flexibility. The device is supported by the Virtex-II development ecosystem referenced in the product documentation, helping accelerate design, verification and deployment.

Request a quote or contact sales to discuss availability, lead times and pricing for the XC2V1000-6FFG896C.

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