XC2V1000-5FGG456C

The XC2V1000-5FGG456C is a Virtex®-II platform Field Programmable Gate Array (FPGA) supplied in a 456-ball fine-pitch BGA package. It provides a configurable logic fabric with 11,520 logic elements and approximately 0.74 Mbits of embedded RAM, combined with 324 user I/Os and a 1,000,000-gate equivalent capacity for flexible system integration.

Designed for commercial-grade applications, this device targets designs that require on-chip memory, DSP-style multiplier resources and high-density I/O in a compact 23 × 23 mm FBGA footprint. Key value propositions include integrated memory and arithmetic blocks, extensive I/O, and a compact surface-mount package compatible with RoHS-compliant assemblies.

Key Features

• Configurable Logic Resources — Approximately 11,520 logic elements that enable medium-density programmable logic implementation and custom hardware acceleration.
• Embedded Memory — Total on-chip RAM of 737,280 bits (approximately 0.74 Mbits) for buffering, FIFOs and tightly coupled data storage.
• Arithmetic and DSP Resources — Dedicated 18‑bit × 18‑bit multiplier blocks for fixed-point and arithmetic-heavy functions (series-level capability).
• I/O Density and Flexibility — 324 user I/Os in a fine-pitch BGA package supporting a wide range of interface standards and on-chip Digitally Controlled Impedance (DCI) features (series-level capability).
• Clocking and Timing — Digital Clock Manager (DCM) functionality for clock de-skew, frequency synthesis and phase adjustments (series-level capability).
• Power and Supply — Core supply range of 1.425 V to 1.575 V to match system power rails and enable stable core operation.
• Package and Mounting — 456-ball BGA (456‑BBGA), supplier device package 456‑FBGA (23×23 mm), surface mount; RoHS compliant.
• Operating Range and Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.

Typical Applications

• Memory Interface and Bridge Designs — On-chip SelectRAM resources and series-level DRAM/SRAM interface support make this device suitable for buffering and protocol bridging between memory subsystems.
• Signal Processing and DSP — Dedicated 18×18 multipliers and substantial embedded RAM support arithmetic-intensive functions such as filtering, encoding and data aggregation.
• High‑Density I/O and Protocol Conversion — 324 user I/Os and series-level SelectIO features enable implementing parallel and serial interfaces, I/O aggregation, and protocol adaptation.
• Prototyping and Custom Logic — The combination of logic elements, embedded RAM and clock management resources suits platform prototyping, proof-of-concept boards and custom control logic.

Unique Advantages

• Balanced Logic and Memory — Approximately 11,520 logic elements paired with ~0.74 Mbits of on-chip RAM reduce the need for external buffering and simplify board-level memory design.
• Compact, RoHS‑Compliant Package — 456-ball fine-pitch BGA (23×23 mm) provides a high pin-count, space-efficient solution for surface-mount assemblies while meeting RoHS requirements.
• Built-in DSP Primitives — Dedicated 18×18 multipliers accelerate arithmetic workloads, enabling lower-latency data processing without adding discrete DSP chips.
• Flexible Clock Management — On-chip clock management features support precise timing control and multi-clock systems, simplifying timing closure for complex designs.
• Commercial-Grade Reliability — Specified operating range of 0 °C to 85 °C and a defined core voltage window support predictable behavior in commercial environments.

Why Choose XC2V1000-5FGG456C?

The XC2V1000-5FGG456C positions itself as a versatile Virtex®-II FPGA option for commercial designs that require a balance of logic capacity, embedded memory and appreciable I/O density in a compact BGA package. Its combination of approximately 11,520 logic elements, dedicated multiplier resources and roughly 0.74 Mbits of embedded RAM supports a broad set of tasks from protocol conversion and memory interfacing to DSP-accelerated functions.

For engineers and procurement teams building medium-density programmable systems, this device offers an integrated platform that reduces external component count, streamlines board routing with high I/O density, and aligns with standard commercial temperature and supply specifications for predictable deployment.

Request a quote or submit an RFQ to begin procurement for XC2V1000-5FGG456C and evaluate how this Virtex®-II FPGA fits your design requirements.