XC2V1000-5FG456I

The XC2V1000-5FG456I is a Virtex®-II platform FPGA offered in a 456-ball BGA package, designed for industrial-grade embedded logic and high-density I/O applications. It combines a configurable logic fabric, on-chip block RAM, and dedicated arithmetic resources to address custom digital processing, memory-interface, and I/O-intensive designs.

Built around the Virtex-II architecture, this device provides a balance of logic capacity, embedded memory and clock management features suitable for industrial systems requiring robust operating temperature and RoHS compliance.

Key Features

• Logic Capacity — 1,280 CLBs delivering 11,520 logic elements (cells) and approximately 1,000,000 system gates for implementing complex logic and control functions.
• Embedded Memory — Approximately 0.74 Mbits of on-chip RAM (737,280 total RAM bits) provided in 18-Kb block SelectRAM resources for FIFOs, buffers and distributed storage.
• Arithmetic Resources — Dedicated 18-bit × 18-bit multiplier blocks for efficient implementation of DSP and arithmetic-intensive functions.
• I/O — 324 user I/Os with high-density package options to support broad external interfacing and protocol bridging in mixed-signal systems.
• Clock Management — Integrated Digital Clock Manager (DCM) features for precise clock de-skew, frequency synthesis and phase shifting to support timing-critical designs.
• Configurable I/O Technology — SelectIO and Digitally Controlled Impedance (DCI) capabilities (as part of the Virtex-II platform) to assist in signal integrity and multi-standard interfacing.
• Package & Mounting — 456-ball BGA (456-BBGA) supplier package 456-FBGA (23×23), surface-mount mounting for compact board integration.
• Power & Temperature — Core supply voltage range 1.425 V to 1.575 V; industrial operating temperature from −40°C to 100°C.
• Compliance — RoHS compliant for regulatory and environmental considerations.

Typical Applications

• Memory Interface and Bridge — High-performance external memory interfaces (SDR/DDR, SRAM families) enabled by the device’s SelectRAM hierarchy and I/O flexibility.
• Embedded Signal Processing — DSP tasks and arithmetic pipelines using the dedicated 18×18 multipliers and substantial logic element capacity for filtering, encoding or transformation functions.
• Protocol and I/O Aggregation — Custom protocol bridging, multi-channel I/O aggregation and interface conversion leveraging the 324 user I/Os and configurable I/O standards.
• Industrial Control and Automation — Deterministic logic control, timing management and on-board buffering in industrial systems operating across −40°C to 100°C.

Unique Advantages

• Balanced Logic and Memory — Combination of 11,520 logic elements and approximately 0.74 Mbits of embedded RAM supports mixed logic and storage-intensive designs without external components.
• Dedicated DSP Primitives — Built-in 18×18 multipliers reduce design complexity for arithmetic-heavy signal processing tasks.
• Robust Clocking — Integrated DCM features provide flexible clock synthesis and de-skew capabilities to simplify timing closure in complex designs.
• Industrial Temperature Range — Rated for −40°C to 100°C to meet the demands of industrial deployments and extended-temperature applications.
• Compact, High-Density Package — 456-ball BGA (456-FBGA, 23×23) provides a space-efficient footprint for high-pin-count designs while supporting surface-mount assembly.
• Regulatory Compliance — RoHS compliance aids in meeting environmental and manufacturing standards.

Why Choose XC2V1000-5FG456I?

The XC2V1000-5FG456I positions itself as a practical Virtex®-II FPGA option for engineers needing a combination of logic density, embedded memory and deterministic clock management within an industrial temperature envelope. Its mix of CLBs, on-chip SelectRAM, dedicated multipliers and configurable I/O makes it well suited to systems that require custom digital processing, memory interfacing and flexible I/O integration.

For development teams and procurement, this device offers a balance of integration and proven Virtex-II platform features—helping to reduce external component count and simplify board-level design while maintaining environmental and assembly compatibility.

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