XC2V1000-5FFG896C
| Part Description |
Virtex®-II Field Programmable Gate Array (FPGA) IC 432 737280 896-BBGA, FCBGA |
|---|---|
| Quantity | 927 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FCBGA (31x31) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BBGA, FCBGA | Number of I/O | 432 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 1280 | Number of Logic Elements/Cells | 11520 | ||
| Number of Gates | 1000000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 737280 |
Overview of XC2V1000-5FFG896C – Virtex®-II FPGA, 11,520 logic elements, 737,280 bits RAM, 432 I/O
The XC2V1000-5FFG896C is a Virtex®-II Field Programmable Gate Array (FPGA) offered in a 896‑ball FCBGA package (31 × 31 mm). The device integrates 11,520 logic elements, approximately 0.74 Mbits of embedded RAM (737,280 bits) and 432 user I/Os to support complex digital designs requiring flexible logic, memory and connectivity resources.
Built on the Virtex‑II platform, this part targets applications that need programmable logic, on‑chip memory and wide I/O density while operating within commercial temperature and supply ranges.
Key Features
- Core Logic 11,520 logic elements providing the programmable logic capacity required for medium‑complexity FPGA designs.
- Embedded Memory Approximately 0.74 Mbits (737,280 bits) of on‑chip RAM for efficient data buffering, state storage and local memory structures.
- I/O Resources 432 user I/Os to support broad connectivity and interface options for external peripherals and memory devices.
- System Gates 1,000,000 system gates for mapping a wide range of digital functions and integrating multiple subsystems on a single device.
- Power and Supply Core voltage range of 1.425 V to 1.575 V to match common FPGA power architectures and regulators.
- Package & Mounting 896‑ball FCBGA (31 × 31 mm) surface‑mount package (896‑BBGA format) for high I/O density in a compact footprint.
- Operating Conditions Commercial grade operation from 0 °C to 85 °C and RoHS‑compliant construction for regulatory compliance in commercial applications.
Typical Applications
- Memory interface controllers Use the device’s dense I/O and on‑chip RAM to implement SDR/DDR or SRAM interface logic and buffering between processors and external memory.
- Signal processing and DSP Embedded RAM and abundant logic elements allow implementation of FIR filters, data path pipelines and other arithmetic‑centric modules.
- High‑density I/O aggregation Ideal for systems that consolidate multiple parallel I/O streams, protocol bridging, or custom bus logic requiring many user I/Os.
- Prototyping and system integration Suitable for developing and validating medium‑complexity digital subsystems before final integration or ASIC migration.
Unique Advantages
- Balanced logic and memory Combines 11,520 logic elements with approximately 0.74 Mbits of embedded RAM to support mixed control and data‑path designs on a single device.
- High I/O count 432 user I/Os reduce the need for external buffering or multiplexing when interfacing to multiple peripherals or memory devices.
- Compact, high‑density package The 896‑ball FCBGA (31 × 31 mm) delivers high pin‑count in a compact form factor suitable for space‑constrained boards.
- Commercial operating range Rated for 0 °C to 85 °C, aligning with commercial electronics environments and standard thermal designs.
- RoHS compliance Meets RoHS requirements for lead‑free assembly and environmental regulatory considerations.
- Deterministic supply requirements A defined core voltage range (1.425 V to 1.575 V) simplifies power budgeting and regulator selection during system design.
Why Choose XC2V1000-5FFG896C?
The XC2V1000-5FFG896C positions itself as a versatile Virtex‑II FPGA option for medium‑complexity designs that require a balanced mix of logic, embedded RAM and high I/O density in a compact FCBGA package. Its 11,520 logic elements and approximately 0.74 Mbits of embedded memory make it suitable for applications that integrate custom control logic, buffering and interface functions on a single programmable device.
This part is well suited to design teams and OEMs seeking a RoHS‑compliant, commercial‑grade FPGA with clearly defined supply and temperature requirements, enabling predictable integration into mainstream electronic systems.
Request a quote or submit a sales inquiry to obtain pricing, availability and lead‑time information for the XC2V1000-5FFG896C.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








