XC2V1000-5FFG896C

IC FPGA 432 I/O 896FCBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 432 737280 896-BBGA, FCBGA

Quantity 927 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package896-FCBGA (31x31)GradeCommercialOperating Temperature0°C – 85°C
Package / Case896-BBGA, FCBGANumber of I/O432Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs1280Number of Logic Elements/Cells11520
Number of Gates1000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits737280

Overview of XC2V1000-5FFG896C – Virtex®-II FPGA, 11,520 logic elements, 737,280 bits RAM, 432 I/O

The XC2V1000-5FFG896C is a Virtex®-II Field Programmable Gate Array (FPGA) offered in a 896‑ball FCBGA package (31 × 31 mm). The device integrates 11,520 logic elements, approximately 0.74 Mbits of embedded RAM (737,280 bits) and 432 user I/Os to support complex digital designs requiring flexible logic, memory and connectivity resources.

Built on the Virtex‑II platform, this part targets applications that need programmable logic, on‑chip memory and wide I/O density while operating within commercial temperature and supply ranges.

Key Features

  • Core Logic  11,520 logic elements providing the programmable logic capacity required for medium‑complexity FPGA designs.
  • Embedded Memory  Approximately 0.74 Mbits (737,280 bits) of on‑chip RAM for efficient data buffering, state storage and local memory structures.
  • I/O Resources  432 user I/Os to support broad connectivity and interface options for external peripherals and memory devices.
  • System Gates  1,000,000 system gates for mapping a wide range of digital functions and integrating multiple subsystems on a single device.
  • Power and Supply  Core voltage range of 1.425 V to 1.575 V to match common FPGA power architectures and regulators.
  • Package & Mounting  896‑ball FCBGA (31 × 31 mm) surface‑mount package (896‑BBGA format) for high I/O density in a compact footprint.
  • Operating Conditions  Commercial grade operation from 0 °C to 85 °C and RoHS‑compliant construction for regulatory compliance in commercial applications.

Typical Applications

  • Memory interface controllers  Use the device’s dense I/O and on‑chip RAM to implement SDR/DDR or SRAM interface logic and buffering between processors and external memory.
  • Signal processing and DSP  Embedded RAM and abundant logic elements allow implementation of FIR filters, data path pipelines and other arithmetic‑centric modules.
  • High‑density I/O aggregation  Ideal for systems that consolidate multiple parallel I/O streams, protocol bridging, or custom bus logic requiring many user I/Os.
  • Prototyping and system integration  Suitable for developing and validating medium‑complexity digital subsystems before final integration or ASIC migration.

Unique Advantages

  • Balanced logic and memory  Combines 11,520 logic elements with approximately 0.74 Mbits of embedded RAM to support mixed control and data‑path designs on a single device.
  • High I/O count  432 user I/Os reduce the need for external buffering or multiplexing when interfacing to multiple peripherals or memory devices.
  • Compact, high‑density package  The 896‑ball FCBGA (31 × 31 mm) delivers high pin‑count in a compact form factor suitable for space‑constrained boards.
  • Commercial operating range  Rated for 0 °C to 85 °C, aligning with commercial electronics environments and standard thermal designs.
  • RoHS compliance  Meets RoHS requirements for lead‑free assembly and environmental regulatory considerations.
  • Deterministic supply requirements  A defined core voltage range (1.425 V to 1.575 V) simplifies power budgeting and regulator selection during system design.

Why Choose XC2V1000-5FFG896C?

The XC2V1000-5FFG896C positions itself as a versatile Virtex‑II FPGA option for medium‑complexity designs that require a balanced mix of logic, embedded RAM and high I/O density in a compact FCBGA package. Its 11,520 logic elements and approximately 0.74 Mbits of embedded memory make it suitable for applications that integrate custom control logic, buffering and interface functions on a single programmable device.

This part is well suited to design teams and OEMs seeking a RoHS‑compliant, commercial‑grade FPGA with clearly defined supply and temperature requirements, enabling predictable integration into mainstream electronic systems.

Request a quote or submit a sales inquiry to obtain pricing, availability and lead‑time information for the XC2V1000-5FFG896C.

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