XC2V1000-5FF896I

IC FPGA 432 I/O 896FCBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 432 737280 896-BBGA, FCBGA

Quantity 12 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package896-FCBGA (31x31)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case896-BBGA, FCBGANumber of I/O432Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs1280Number of Logic Elements/Cells11520
Number of Gates1000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits737280

Overview of XC2V1000-5FF896I – Virtex®-II Field Programmable Gate Array (FPGA) IC 432 737280 896-BBGA, FCBGA

The XC2V1000-5FF896I is a Virtex®-II platform FPGA supplied in an 896-ball flip-chip BGA (31×31) package. It provides 11,520 logic elements, approximately 0.74 Mbits of embedded RAM, and 432 user I/Os, making it suitable for industrial embedded systems that require flexible, reprogrammable logic with substantial on-chip memory and I/O density.

Designed for surface-mount assembly and rated for industrial temperatures (–40 °C to 100 °C) with a core supply range of 1.425 V to 1.575 V, this device is intended for applications that need a balance of logic capacity, memory resources, and robust I/O connectivity.

Key Features

  • Logic Capacity — 11,520 logic elements providing programmable resources for custom digital functions and glue logic.
  • Embedded Memory — Total on-chip RAM of 737,280 bits (approximately 0.74 Mbits) for embedded buffering, FIFOs, and local storage.
  • I/O Density — 432 user I/O pins to support broad external interfacing and high-pin-count designs.
  • System Gate Scale — Approximately 1,000,000 system gates for medium-density integration.
  • Package & Mounting — 896-ball FCBGA package (31×31) optimized for surface-mount PCB assembly.
  • Industrial Temperature & Supply — Rated for –40 °C to 100 °C operation with a core voltage range of 1.425 V to 1.575 V.
  • Platform Series Features — Built on the Virtex-II platform; series-level features include SelectRAM memory hierarchy, dedicated 18-bit × 18-bit multiplier blocks, Digital Clock Manager (DCM) clock resources, and high-performance I/O standards as documented in the Virtex-II data volume.
  • Regulatory — RoHS compliant for lead-free assembly compatibility.

Typical Applications

  • Memory Interface and Bridge Designs — Use the device where on-chip memory and the Virtex-II platform’s external DRAM/SDRAM interface support are required for buffering and protocol bridging.
  • Signal Processing and Arithmetic Acceleration — Leverage embedded RAM and the platform’s multiplier resources to implement fixed-point DSP blocks and custom arithmetic pipelines.
  • High-Density I/O Aggregation — Deploy in systems needing large numbers of parallel I/Os for data acquisition, protocol conversion, or multi-channel sensor aggregation.
  • Embedded System Glue Logic — Implement control, timing, and custom peripheral interfaces where reprogrammability and moderate logic capacity simplify BOM and design changes.

Unique Advantages

  • Balanced Logic and Memory — 11,520 logic elements paired with approximately 0.74 Mbits of RAM offers a practical mix for mid-range custom logic and buffering without external SRAM dependence.
  • High I/O Count — 432 user I/Os reduce the need for external multiplexing and enable direct connections to multiple peripherals or parallel data streams.
  • Industrial Operational Range — Specified for –40 °C to 100 °C operation, supporting deployment in industrial environments.
  • Surface-Mount, High-Density Package — 896-FCBGA (31×31) package supports compact board layouts and high-density system integration.
  • Platform-Level Tool Support — As part of the Virtex-II family, the device is documented within the Virtex-II product specification and supported by the platform’s development resources.
  • RoHS Compliance — Meets environmental requirements for lead-free assembly workflows.

Why Choose XC2V1000-5FF896I?

The XC2V1000-5FF896I positions itself as a reliable mid-range FPGA solution for industrial embedded designs that require a blend of programmable logic, embedded memory, and high I/O capacity. Its Virtex-II platform heritage brings documented architecture features—such as SelectRAM resources and dedicated multiplication blocks—that ease implementation of memory-intensive and arithmetic-heavy functions.

This device is well suited to engineers and procurement teams seeking a reprogrammable, industrial-grade FPGA in a compact FCBGA package, offering predictable supply voltage and temperature specifications along with RoHS compliance and platform-level documentation for design and verification.

Request a quote or submit an inquiry to receive availability, pricing, and volume lead-time information for the XC2V1000-5FF896I.

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