XC2V1000-5BGG575C

IC FPGA 328 I/O 575BGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 328 737280 575-BBGA

Quantity 379 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package575-BGA (31x31)GradeCommercialOperating Temperature0°C – 85°C
Package / Case575-BBGANumber of I/O328Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1280Number of Logic Elements/Cells11520
Number of Gates1000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits737280

Overview of XC2V1000-5BGG575C – Virtex®-II Field Programmable Gate Array, 328 I/O, approximately 0.74 Mbits RAM, 575-BBGA

The XC2V1000-5BGG575C is a Virtex®-II series field programmable gate array supplied in a 575-ball BGA (31 × 31 mm) package. It provides a mid-range integration point with logic, embedded memory and programmable I/O density suited to commercial embedded systems and communications equipment.

This device combines roughly 11,520 logic elements (1280 CLBs), approximately 0.74 Mbits of on-chip RAM (737,280 bits), 18×18 multiplier resources and flexible clock management features from the Virtex‑II architecture to support data buffering, interfacing and signal processing tasks within a single FPGA package.

Key Features

  • Logic Capacity — Approximately 11,520 logic elements (1280 CLBs) and a device gate count of 1,000,000 provide mid-range logic integration for control, glue logic and moderate-density processing.
  • Embedded Memory — Total on-chip RAM of 737,280 bits (approximately 0.74 Mbits) suitable for local data buffers, FIFOs and small lookup tables.
  • Arithmetic Resources — Dedicated multiplier resources (18-bit × 18-bit) for arithmetic-intensive functions and DSP-like building blocks as described in the Virtex‑II platform documentation.
  • I/O and Packaging — 328 user I/Os in a 575-BBGA surface-mount package (31 × 31 mm) enabling broad peripheral and bus connectivity in compact PCB layouts.
  • Clocking and Timing — Virtex‑II family clock management features (including Digital Clock Manager modules and global clock mux buffers) support precise clock distribution and frequency management for synchronous designs.
  • Power and Operating Range — Core supply voltage range of 1.425 V to 1.575 V and commercial operating temperature range of 0 °C to 85 °C for typical commercial applications.
  • Mounting and Compliance — Surface-mount BGA package with RoHS-compliant lead-free status for environmentally conscious assembly.
  • Development Ecosystem — Virtex‑II devices are supported by the Virtex‑II platform toolchain referenced in the product specification, simplifying integration into existing Xilinx-based design flows.

Typical Applications

  • Communications Equipment — Interface bridging, protocol handling and packet buffering using abundant I/O and on-chip RAM for mid-range networking modules.
  • Embedded Systems — System glue logic, peripheral interfacing and custom control implementations for commercial embedded products.
  • Signal Processing — Acceleration of arithmetic kernels and data-path functions leveraging dedicated multipliers and local RAM for moderate-performance DSP tasks.
  • Memory Controllers & Interfaces — Implementation of SDR/DDR or SRAM interface logic and temporary data storage using available I/O and embedded memory resources.
  • Prototyping and Evaluation — Platform for validating system-level architectures and proof-of-concept designs that require flexible reprogrammability and significant I/O capacity.

Unique Advantages

  • Balanced Integration: Combines logic, memory and I/O in a single 575-BBGA package, reducing board-level complexity and component count.
  • Mid-Range Capacity: Approximately 11,520 logic elements and 1,000,000 gates provide the headroom needed for control logic, interfaces and moderate processing tasks without moving to larger device families.
  • Substantial On-Chip RAM: Approximately 0.74 Mbits of embedded memory supports local buffering and data staging to minimize external memory dependence.
  • Rich I/O Count: 328 programmable I/Os enable connectivity to multiple peripherals, buses and memory devices within a compact BGA footprint.
  • Clock and DSP Support: Virtex‑II clock management and multiplier resources enable precise timing control and efficient implementation of arithmetic functions.
  • RoHS-Compliant Packaging: Surface-mount 575-BBGA package meets lead-free assembly requirements for commercial production.

Why Choose XC2V1000-5BGG575C?

The XC2V1000-5BGG575C positions itself as a practical Virtex‑II platform choice for commercial designs that require a balanced mix of logic, embedded memory and I/O without the footprint of larger devices. Its combination of approximately 11,520 logic elements, roughly 0.74 Mbits of on-chip RAM and 328 user I/Os makes it well suited to communications, embedded controllers, memory interfaces and mid-range signal processing tasks.

Supported by the Virtex‑II platform documentation and development tools referenced in the product specification, this device offers a reliable, well-documented building block for teams looking to integrate programmable logic into commercial products while maintaining a compact BGA package and RoHS compliance.

Request a quote or submit your specifications to receive pricing and availability for the XC2V1000-5BGG575C. Our team will provide a tailored response to support your project timeline and procurement needs.

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