XC2V1000-4FGG256I

The XC2V1000-4FGG256I is an industrial-grade Virtex®-II Field Programmable Gate Array (FPGA) in a 256-ball fine-pitch BGA package. It provides 11,520 logic elements and approximately 0.74 Mbits of embedded RAM, making it suitable for designs that require mid-range logic density, on-chip memory, and flexible I/O connectivity.

Built on the Virtex-II platform, the device targets industrial applications that benefit from embedded memory, dedicated arithmetic resources, and a robust I/O complement. Its value proposition centers on integration of logic, memory, and I/O in a compact surface-mount BGA footprint with wide operating temperature and supply tolerances.

Key Features

• Logic Capacity  11,520 logic elements provide programmable logic resources for combinational and sequential designs.
• Embedded Memory  Approximately 0.74 Mbits of on-chip RAM (737,280 total RAM bits) for buffering, FIFOs, and local data storage.
• IO and Packaging  172 user I/Os in a 256-FBGA (17×17) surface-mount package, enabling a broad range of board-level interfaces.
• Arithmetic and DSP Support  Virtex-II platform features include dedicated multiplier blocks and SelectRAM memory hierarchy for arithmetic and DSP-oriented tasks.
• Power and Supply  Nominal core supply range of 1.425 V to 1.575 V for reliable core operation within specified limits.
• Industrial Temperature Range  Rated for −40 °C to 100 °C operation to meet industrial environmental requirements.
• Package and Mounting  256-ball fine-pitch BGA (256-FBGA) surface-mount package (17×17 mm) for compact board integration.
• Manufacturer and Compliance  Produced by AMD and RoHS compliant.

Typical Applications

• Industrial Control  Programmable logic and embedded memory support control algorithms, I/O aggregation, and interface bridging in industrial automation equipment.
• High-Performance Memory Interfaces  Virtex-II platform capabilities and on-chip RAM make the device suitable for designs that require DRAM/SRAM interfacing and memory buffering.
• Signal Processing and DSP  Dedicated arithmetic resources and embedded RAM enable acceleration of arithmetic-heavy tasks such as filtering, encoding, and protocol processing.
• Prototyping and System Integration  Mid-range logic density and flexible I/O allow rapid hardware prototyping and consolidation of multiple board-level functions into a single FPGA.

Unique Advantages

• Industrial-Grade Operation:  Specified operation from −40 °C to 100 °C supports deployment in temperature-challenging environments.
• Balanced Logic and Memory:  11,520 logic elements paired with approximately 0.74 Mbits of embedded RAM offers a balanced resource mix for mixed control and data-path designs.
• Compact, High-Density Package:  256-FBGA (17×17) footprint provides a compact solution for space-constrained boards while maintaining 172 I/Os.
• Platform-Level Capabilities:  Built on the Virtex-II platform, leveraging features such as SelectRAM and dedicated multipliers to simplify implementation of memory and arithmetic functions.
• RoHS Compliant:  Environmentally compliant manufacturing reduces regulatory risk for many product programs.

Why Choose XC2V1000-4FGG256I?

The XC2V1000-4FGG256I positions itself as a versatile, industrial-grade Virtex®-II FPGA combining moderate logic density, meaningful on-chip RAM, and a broad set of I/Os in a compact 256-FBGA package. It is well suited for designers implementing memory interfaces, signal processing blocks, control logic, and system integration tasks that require reliable operation across a wide temperature range.

For development teams seeking a proven platform-level architecture with discrete arithmetic and memory resources, this device offers a clear balance of capacity, connectivity, and environmental robustness backed by AMD's Virtex-II lineage.

Request a quote or submit a request for pricing to begin sourcing XC2V1000-4FGG256I for your next design. Our team can provide availability and ordering information tailored to your project needs.