XC2V1000-4FG256I

IC FPGA 172 I/O 256FBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 172 737280 256-BGA

Quantity 675 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-BGANumber of I/O172Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1280Number of Logic Elements/Cells11520
Number of Gates1000000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits737280

Overview of XC2V1000-4FG256I – Virtex®-II Field Programmable Gate Array (FPGA) 256-BGA

The XC2V1000-4FG256I is an industrial-grade Virtex®-II FPGA in a 256-ball BGA package, offering reconfigurable logic and embedded memory for demanding embedded and industrial applications. Built on the Virtex-II platform architecture, this device provides a balance of logic capacity, on-chip RAM, and flexible I/O to support custom hardware acceleration, protocol bridging, and system integration tasks.

Key Features

  • Core Logic 11,520 logic elements (cells) and approximately 1,000,000 system gates provide a programmable fabric for implementing custom logic and control functions.
  • Embedded Memory Approximately 0.737 Mbits of total on-chip RAM (737,280 bits) for data buffering, FIFOs, and local storage within the FPGA fabric.
  • I/O Capacity 172 user I/Os to connect with external peripherals, sensors, and memory devices, enabling multi-channel interfacing in compact designs.
  • Arithmetic and DSP Resources Virtex-II platform features include dedicated multiplier blocks (18-bit × 18-bit) and fast carry chains for arithmetic acceleration and DSP tasks.
  • Clocking and Timing Platform-level clock management capabilities (Digital Clock Manager modules and global clock buffers described in the Virtex-II specification) support precise clocking and timing control for high-performance designs.
  • Package & Mounting 256-ball fine-pitch BGA (supplier package: 256-FBGA, 17 × 17 mm), surface-mount device optimized for PCB assembly and compact system layouts.
  • Power & Supply Operating core supply range 1.425 V to 1.575 V to match platform power rails and system-level power architectures.
  • Industrial Temperature Range Rated for −40 °C to 100 °C operating temperature, suitable for industrial environments.
  • RoHS Compliant Meets RoHS requirements for lead-free manufacturing and environmental compliance.

Typical Applications

  • Industrial Control Use the XC2V1000-4FG256I for programmable logic in factory automation, process control, and motor control interfaces where industrial temperature rating and flexible I/O are required.
  • Memory Interface and Bridge Implement high-performance external memory controllers and interface bridging using the FPGA’s logic resources and on-chip RAM.
  • Signal Processing and DSP Leverage dedicated multiplier blocks and logic fabric to implement filtering, transform engines, and custom arithmetic accelerators.
  • Prototyping and System Integration Compact 256-BGA package and abundant I/O make this device suitable for board-level prototypes and integration into space-constrained systems.

Unique Advantages

  • Significant Logic Capacity: 11,520 logic elements enable complex finite-state machines, custom processors, and glue-logic consolidation to reduce BOM count.
  • On-Chip Memory for Local Storage: Approximately 0.737 Mbits of embedded RAM reduces dependence on external memory for buffering and low-latency data paths.
  • Flexible I/O Count: 172 user I/Os provide broad connectivity options for sensors, peripherals, and external memory devices without external multiplexing.
  • Industrial-Grade Robustness: −40 °C to 100 °C rating and RoHS compliance support deployment in industrial environments with environmental reliability.
  • Compact Surface-Mount Package: 256-FBGA (17 × 17 mm) package supports high-density PCB designs while maintaining accessibility to numerous I/O lines.

Why Choose XC2V1000-4FG256I?

The XC2V1000-4FG256I delivers a practical combination of programmable logic, embedded memory, and ample I/O in an industrial-grade FPGA package. Its logic capacity and on-chip RAM make it well suited to embedded designers and system integrators who need deterministic, reconfigurable hardware for control, interface, and signal-processing tasks.

With a surface-mount 256-FBGA package, industrial temperature rating, and RoHS compliance, this device offers durable integration for long-term projects where reliability and compactness matter. The Virtex-II platform features documented in the product specification provide a foundation of clocking, arithmetic, and I/O capabilities for scalable FPGA-based designs.

If you would like a quote or need more information about availability and lead times for XC2V1000-4FG256I, please request a quote or contact sales to submit a purchase inquiry.

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