XC2V1000-4BGG575I

The XC2V1000-4BGG575I is a Virtex®-II field programmable gate array provided in a 575-ball BGA package. The device delivers reconfigurable logic resources and embedded memory tailored for industrial applications that require a mix of logic density, on-chip RAM and a substantial I/O complement.

Built on the Virtex-II platform architecture, the device is suitable for designs that leverage dedicated arithmetic blocks, SelectRAM memory hierarchy and flexible I/O options to implement memory interfaces, DSP functions and complex system glue logic while operating across an industrial temperature range.

Key Features

• Logic Resources — 11,520 logic elements and 1,280 CLBs provide programmable fabric for implementing combinational and sequential logic.
• Embedded Memory — Approximately 0.74 Mbits (737,280 bits) of on-chip RAM for buffering, FIFOs and local storage.
• I/O Density — 328 user I/Os in a 575-ball BGA footprint to support a wide range of external interfaces and board-level connectivity.
• Arithmetic and DSP — Virtex-II platform includes dedicated 18-bit × 18-bit multiplier blocks suitable for arithmetic- and signal-processing tasks.
• Clock Management — Platform-level support for Digital Clock Manager (DCM) modules and global clock multiplexing for flexible clocking and deskew.
• Power and Supply — Core supply range of 1.425 V to 1.575 V for defined power sequencing and operation.
• Package and Mounting — 575-BBGA (575-BGA, 31 × 31 mm) surface-mount package for high-density board designs.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Standards and Compliance — RoHS compliant.

Typical Applications

• Memory Interface Controllers — Implement SDR/DDR, SRAM or other external memory controllers using the device’s high-performance interface capabilities and embedded memory.
• Signal Processing and DSP — Use dedicated multiplier blocks and on-chip RAM for filtering, transforms and other arithmetic-intensive workloads.
• High‑I/O System Glue Logic — 328 I/Os in a compact BGA package enable protocol bridging, bus interfacing and multi‑device coordination on dense boards.
• Industrial Control Systems — Industrial temperature rating and reconfigurable logic make the device suitable for automation, motor control and programmable logic tasks in industrial equipment.

Unique Advantages

• Balanced Logic and Memory — 11,520 logic elements combined with approximately 0.74 Mbits of embedded RAM reduces reliance on external memory for many designs.
• Substantial I/O in a Compact Footprint — 328 user I/Os in a 575-BBGA package simplify board-level integration for multi-interface systems.
• Industrial Reliability — −40 °C to 100 °C operating range and RoHS compliance support long-term deployment in industrial environments.
• Deterministic Clocking and DSP Support — Platform-level DCMs and dedicated multipliers help achieve precise timing and efficient arithmetic implementations.
• Surface-Mount Packaging — 575-BBGA surface-mount package enables high-density assembly and consistent manufacturing processes.

Why Choose XC2V1000-4BGG575I?

The XC2V1000-4BGG575I positions itself as an industrial-grade reconfigurable logic device that combines mid-range logic density with significant embedded memory and a high I/O count. It is suited for engineers who need a versatile FPGA for memory interfaces, DSP tasks and board-level system integration while maintaining operation across industrial temperatures.

Designers gain a compact, surface-mount BGA solution that brings together Virtex-II platform capabilities (memory hierarchy, dedicated multipliers, clock management) with clear, verifiable specifications for power, thermal range and package geometry—helpful when planning hardware, thermal and supply-chain requirements.

Request a quote or submit a parts inquiry to receive pricing and availability for the XC2V1000-4BGG575I. Our team can provide lead-time details and ordering information to support your project timelines.