XC2V1000-4BGG575C

IC FPGA 328 I/O 575BGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 328 737280 575-BBGA

Quantity 1,230 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package575-BGA (31x31)GradeCommercialOperating Temperature0°C – 85°C
Package / Case575-BBGANumber of I/O328Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1280Number of Logic Elements/Cells11520
Number of Gates1000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits737280

Overview of XC2V1000-4BGG575C – Virtex®-II FPGA, 575-BBGA, 328 I/O

The XC2V1000-4BGG575C is a Virtex®-II Field Programmable Gate Array (FPGA) provided in a 575-BBGA package. It delivers a combination of programmable logic, embedded memory and a large number of user I/Os suitable for commercial-temperature FPGA designs.

Built on the Virtex-II platform, the device provides configurable logic resources, embedded SelectRAM memory and high-capacity I/O in a surface-mount 575-BBGA (575-BGA, 31×31) package, with supply and thermal ranges appropriate for commercial applications.

Key Features

  • Logic Resources 1,280 CLBs and 11,520 logic elements delivering up to 1,000,000 system gates for complex programmable logic implementations.
  • Embedded Memory Approximately 0.737 Mbits (737,280 bits) of on-chip RAM organized as SelectRAM resources for local data storage and buffering.
  • I/O Capacity 328 user I/Os to support a wide range of external interfaces and board-level connectivity in the 575-BBGA footprint.
  • Arithmetic and DSP Support Virtex-II architecture includes dedicated multiplier blocks (18-bit × 18-bit) and fast carry structures for arithmetic and DSP functions.
  • Clock and Timing Platform features such as Digital Clock Manager (DCM) modules and global clock buffers provide flexible clock management (as defined by the Virtex-II family).
  • Package and Mounting 575-BBGA package (supplier device package: 575-BGA, 31×31), surface-mount mounting for compact, high-density board designs.
  • Power and Thermal Voltage supply range of 1.425 V to 1.575 V. Operating temperature range of 0 °C to 85 °C (commercial grade).
  • Standards and Compliance RoHS compliant for environmental regulatory requirements.

Typical Applications

  • Embedded Systems — Use the device to implement custom logic, protocol handling and control functions where compact FPGA packaging and significant I/O are required.
  • High-Speed Interfaces — Leverage the large I/O count and Virtex-II SelectIO capabilities for board-level interface bridging and memory controller logic.
  • Signal Processing and DSP — Dedicated multiplier blocks and on-chip RAM enable local arithmetic and buffering for DSP tasks within commercial electronic products.

Unique Advantages

  • High Logic Density: 1,280 CLBs and 11,520 logic elements provide substantial programmable resources within a single FPGA package.
  • Significant Embedded Memory: Approximately 0.737 Mbits of on-chip RAM reduces external memory dependence for many buffering and scratchpad needs.
  • Robust I/O Count: 328 user I/Os support multiple parallel buses and interface standards in a compact BGA footprint.
  • Dedicated DSP Primitives: 18×18 multipliers and fast carry logic support efficient implementation of arithmetic-intensive functions.
  • Commercial Temperature Suitability: Rated for 0 °C to 85 °C, matching requirements for a wide range of standard electronic products.
  • Regulatory Compliance: RoHS compliance supports environmentally conscious product design and manufacturing.

Why Choose XC2V1000-4BGG575C?

The XC2V1000-4BGG575C combines substantial programmable logic, embedded memory and a high I/O count in a 575-BBGA surface-mount package, providing a balanced platform for commercial FPGA designs. Its Virtex-II architecture elements—SelectRAM memory, DSP multipliers and clock management features—offer flexible building blocks for implementing control, interface and signal-processing functions.

This device is well suited for designers and engineers developing compact, I/O-rich programmable solutions at commercial temperature ranges who need a field-programmable platform with integrated memory and DSP capabilities.

Request a quote for XC2V1000-4BGG575C to check pricing and availability for your project needs.

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