XC2S600E-6FG456Q

IC FPGA 329 I/O 456FBGA
Part Description

Spartan®-IIE Field Programmable Gate Array (FPGA) IC 329 294912 15552 456-BBGA

Quantity 621 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package456-FBGA (23x23)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case456-BBGANumber of I/O329Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3456Number of Logic Elements/Cells15552
Number of Gates600000ECCN3A001A7AHTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits294912

Overview of XC2S600E-6FG456Q – Spartan®-IIE FPGA, 456-BBGA

The XC2S600E-6FG456Q is a Spartan®-IIE field programmable gate array (FPGA) from AMD designed for applications that require dense logic, on-chip memory, and flexible I/O in a surface-mount 456-BBGA package. Built on the Spartan-IIE family architecture, this device provides a combination of logic capacity, embedded RAM, and system-level features suitable for embedded control, signal interfacing, and automotive-qualified designs.

Key Features

  • Core Logic  15,552 logic elements and an equivalent of 600,000 system gates provide substantial combinational and sequential resources for complex digital designs.
  • Embedded Memory  Approximately 0.295 Mbits of total on-chip RAM (294,912 bits) for distributed and block RAM usage in data buffering, small tables, and state storage.
  • I/O Capacity and Standards  329 user I/O pins with family-level support for many interface standards and up to 205 differential I/O pairs (per the Spartan‑IIE data), enabling diverse signal interfacing and high-speed connections.
  • Clocking and Timing  Dedicated clock-management resources including multiple delay-locked loops (DLLs) for clock phase control, multiplication/division and low-skew distribution (family architecture feature).
  • Automotive Qualification and Robustness  AEC‑Q100 qualification and Automotive grade designation, plus an operating temperature range of −40 °C to 125 °C, making the device suitable for temperature-demanding embedded applications.
  • Power and Supply  Core supply specified at 1.71 V to 1.89 V to support the device’s internal power domains and predictable DC characteristics.
  • Package and Mounting  Surface-mount 456-BBGA package (supplier package: 456-FBGA, 23×23) for compact board-level integration and high pin density.
  • Standards and Testability  Boundary-scan (IEEE 1149.1) support for board-level test and in-system validation (family-level feature).
  • Environmental Compliance  RoHS-compliant construction supports modern manufacturing and environmental requirements.

Typical Applications

  • Automotive Control Systems  Engine control, ADAS peripherals, or body electronics where AEC‑Q100 qualification and a −40 °C to 125 °C operating range are required.
  • Embedded Signal Processing  Data conditioning, protocol bridging, and custom logic offload using the device’s logic capacity and on-chip RAM.
  • High-Density I/O Interfaces  Multi-channel sensor interfaces, communication front-ends, or I/O aggregation leveraging 329 I/O pins and differential pair support.
  • Industrial Control  Deterministic control and sequencing applications benefiting from dedicated clock management and abundant logic resources.

Unique Advantages

  • Automotive-Grade Qualification: AEC‑Q100 qualification and a wide operating temperature range provide the traceable robustness needed for automotive electronics and harsh environments.
  • High Logic Density: 15,552 logic elements and 600,000 system-gate equivalence enable integration of complex functions and reduce external glue logic.
  • Substantial On-Chip Memory: Approximately 0.295 Mbits of embedded RAM supports buffering, lookup tables, and state storage without immediate need for external memory.
  • Flexible I/O and Packaging: 329 I/O pins in a compact 456-BBGA footprint allow high pin-count designs in space-constrained layouts.
  • Clocking Control: Integrated DLL resources and global clock distribution features (family-level) simplify timing management for multi-clock systems.
  • Manufacturing and Environmental Compliance: RoHS compliance and surface-mount BBGA packaging facilitate standard production flows and environmental standards adherence.

Why Choose XC2S600E-6FG456Q?

The XC2S600E-6FG456Q combines substantial logic capacity, embedded memory, and broad I/O resources in an automotive-qualified Spartan‑IIE device. Its specification set—including AEC‑Q100 qualification, a wide operating temperature range, and a compact 456-BBGA footprint—positions it for embedded and automotive use cases where reliability, integration, and predictable power/voltage behavior are important.

This device is suited to engineers and product teams seeking to consolidate discrete functions into a single programmable device, maintain in-system reprogrammability, and leverage on-chip resources for reduced BOM and simplified board design.

Request a quote or submit a parts inquiry today to evaluate the XC2S600E-6FG456Q for your next embedded or automotive project.

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