XC2V1000-4FFG896I

IC FPGA 432 I/O 896FCBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 432 737280 896-BBGA, FCBGA

Quantity 841 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package896-FCBGA (31x31)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case896-BBGA, FCBGANumber of I/O432Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs1280Number of Logic Elements/Cells11520
Number of Gates1000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits737280

Overview of XC2V1000-4FFG896I – Virtex®-II FPGA, 11,520 Logic Cells, 432 I/O, 896-FCBGA

The XC2V1000-4FFG896I is an industrial-grade Virtex®-II field programmable gate array (FPGA) delivering approximately 1,000,000 system gates in a 896-FCBGA package. Built on the Virtex-II platform architecture, this device combines configurable logic, embedded memory, dedicated arithmetic blocks and a high-density I/O interface for mid-range system designs.

Typical use cases include complex digital glue logic, memory and interface bridging, mid-density signal processing and control applications where a balance of logic capacity, I/O count and package density are required. The device offers a precise supply/temperature operating window and RoHS compliance for production deployment.

Key Features

  • Logic Resources 1280 configurable logic blocks (CLBs) providing 11,520 logic cells, supporting complex combinational and sequential logic implementations.
  • System Gate Count Approximately 1,000,000 system gates for mid-density integration of digital functions.
  • Embedded Memory Approximately 0.74 Mbits of on-chip RAM (737,280 total RAM bits) organized in block SelectRAM resources for dual-port memory and distributed RAM usage.
  • Dedicated Arithmetic On-chip 18-bit × 18-bit multiplier blocks for accelerated arithmetic and DSP tasks.
  • I/O Capacity 432 user I/O pins to support wide external interfaces and parallel buses from a single device.
  • Clock & Timing Virtex-II platform clock management features including Digital Clock Manager (DCM) functionality as described in the series specification for flexible clocking and phase control.
  • Package & Mounting 896-FCBGA (31 × 31) package case, surface-mount design suited for high-density board layouts.
  • Power & Temperature Supply range of 1.425 V to 1.575 V and an industrial operating temperature range from −40 °C to 100 °C.
  • Environmental RoHS-compliant material status.

Typical Applications

  • High-density interface bridging Use the 432 I/O pins and on-chip memory to implement bus bridging, protocol conversion and parallel interfacing in industrial systems.
  • Embedded DSP and arithmetic Leverage the 18×18 multiplier blocks and embedded RAM for mid-performance signal processing, filtering and arithmetic acceleration.
  • Control and automation Deploy as centralized logic for machine control, sensor aggregation and deterministic I/O handling within industrial temperature ranges.
  • Memory interface logic Implement SDR/DDR-style external memory interface glue and timing control using the device’s memory hierarchy and clock management features.

Unique Advantages

  • Balanced mid-range capacity: Provides approximately 1M system gates and 11,520 logic cells, enabling substantial on-chip logic without unnecessary overhead.
  • Significant I/O density: 432 available I/Os reduce the need for external IO expanders and simplify board-level routing for parallel interfaces.
  • Embedded memory resources: Around 0.74 Mbits of on-chip RAM in block SelectRAM structures support dual-port memory and distributed storage for data buffering and state machines.
  • Dedicated arithmetic blocks: 18×18 multipliers accelerate computational tasks and reduce the reliance on external DSP engines.
  • Industrial temperature rating: −40 °C to 100 °C operating range supports deployment in demanding environments.
  • RoHS compliance: Meets lead-free manufacturing requirements for modern production environments.

Why Choose XC2V1000-4FFG896I?

The XC2V1000-4FFG896I positions itself as a practical choice for engineers needing a mid-density FPGA with broad I/O capability, embedded memory and dedicated arithmetic resources. Its Virtex-II architecture elements—CLBs, SelectRAM, multiplier blocks and clock management features—make it well suited for control, interface and mid-performance signal processing applications where integration and deterministic behavior matter.

This part is appropriate for teams seeking a production-ready, industrial-grade FPGA in an 896-FCBGA surface-mount package with clearly defined supply and temperature limits and RoHS-compliant materials. It provides a durable platform for designs that require a balance of logic capacity, I/O density and on-chip memory.

Request a quote or submit an RFQ to obtain pricing, availability and lead-time information for the XC2V1000-4FFG896I.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up