XC2V1000-4FGG256C

IC FPGA 172 I/O 256FBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 172 737280 256-BGA

Quantity 311 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O172Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1280Number of Logic Elements/Cells11520
Number of Gates1000000ECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits737280

Overview of XC2V1000-4FGG256C – Virtex®-II FPGA, 172 I/O, 256-BGA

The XC2V1000-4FGG256C is a Virtex®-II field programmable gate array optimized for commercial embedded and system designs. Built on the Virtex-II platform architecture, it delivers a balance of programmable logic, on-chip memory, and flexible I/O for applications that require custom digital logic, memory interfacing, and arithmetic acceleration.

This device provides 11,520 logic elements, approximately 0.74 Mbits of embedded memory, and 172 user I/O in a 256-ball fine-pitch BGA package, making it suitable for space-constrained board designs that need significant programmable resources within a surface-mount package and a commercial operating temperature range.

Key Features

  • Programmable Logic 11,520 logic elements (cells) providing a dense array of resources for custom logic implementation and control functions.
  • Embedded Memory Approximately 0.74 Mbits of on-chip RAM suitable for buffering, FIFOs, and small lookup tables within the FPGA fabric.
  • I/O Capacity 172 user I/O pins supporting diverse external interfaces and board-level connectivity.
  • Arithmetic and Gate Capacity Device gate count of approximately 1,000,000 gates to support complex combinational and sequential logic designs.
  • Supply and Power Core voltage specified at 1.425 V to 1.575 V for predictable power and timing behavior.
  • Package and Mounting 256-ball fine-pitch BGA (256-FBGA, 17×17) in a surface-mount form factor for compact PCB integration.
  • Operating Temperature and Grade Commercial grade operation from 0 °C to 85 °C, suitable for standard commercial electronic environments.
  • Environmental Compliance RoHS compliant for regulatory alignment with lead-free manufacturing.
  • Platform Capability (Virtex-II) Platform-level features such as integrated memory hierarchy, dedicated multiplier resources, and clock-management elements are available across the Virtex-II family to support high-performance designs.

Typical Applications

  • Communications and Networking Use the device’s dense logic and flexible I/O to implement protocol processing, packet handling, and memory-interface logic commonly required in communications equipment.
  • Memory Interface Controllers The combination of embedded RAM and gate capacity is suitable for building SDR/DDR or SRAM interface controllers and buffering logic.
  • Signal Processing and Arithmetic Acceleration On-chip RAM and abundant logic elements support custom DSP kernels and arithmetic functions for mid-range signal-processing tasks.
  • Embedded System Prototyping Compact 256-BGA package and extensive programmable resources make the device useful for prototyping custom SoC glue logic and control subsystems.

Unique Advantages

  • Balanced Resource Mix: Combines 11,520 logic elements with approximately 0.74 Mbits of embedded memory to handle both control logic and local data storage without external SRAM for many functions.
  • Solid I/O Count: 172 user I/Os enable multiple peripheral interfaces or parallel buses while staying within a compact BGA footprint.
  • Compact Package Integration: 256-FBGA (17×17) surface-mount package supports dense PCB layouts and modern assembly processes.
  • Commercial Temperature Rating: Rated 0 °C to 85 °C to meet requirements for standard commercial electronic applications.
  • RoHS Compliant: Aligns with lead-free manufacturing and environmental compliance initiatives.

Why Choose XC2V1000-4FGG256C?

The XC2V1000-4FGG256C offers a practical blend of programmable logic capacity, embedded memory, and I/O density in a compact 256-BGA package. Its core voltage range and commercial temperature rating make it suitable for a wide range of commercial embedded systems where board space and integration are priorities.

This device is a good fit for designers needing a reliable Virtex®-II platform FPGA to implement custom interfaces, memory controllers, and arithmetic-intensive logic, while keeping BOM complexity and external component counts under control.

Request a quote or submit your design requirements to receive pricing and availability for the XC2V1000-4FGG256C. Our team can provide delivery and lead-time information to support your procurement or design cycle.

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