XC2V1000-4FGG256C
| Part Description |
Virtex®-II Field Programmable Gate Array (FPGA) IC 172 737280 256-BGA |
|---|---|
| Quantity | 311 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 172 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1280 | Number of Logic Elements/Cells | 11520 | ||
| Number of Gates | 1000000 | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 737280 |
Overview of XC2V1000-4FGG256C – Virtex®-II FPGA, 172 I/O, 256-BGA
The XC2V1000-4FGG256C is a Virtex®-II field programmable gate array optimized for commercial embedded and system designs. Built on the Virtex-II platform architecture, it delivers a balance of programmable logic, on-chip memory, and flexible I/O for applications that require custom digital logic, memory interfacing, and arithmetic acceleration.
This device provides 11,520 logic elements, approximately 0.74 Mbits of embedded memory, and 172 user I/O in a 256-ball fine-pitch BGA package, making it suitable for space-constrained board designs that need significant programmable resources within a surface-mount package and a commercial operating temperature range.
Key Features
- Programmable Logic 11,520 logic elements (cells) providing a dense array of resources for custom logic implementation and control functions.
- Embedded Memory Approximately 0.74 Mbits of on-chip RAM suitable for buffering, FIFOs, and small lookup tables within the FPGA fabric.
- I/O Capacity 172 user I/O pins supporting diverse external interfaces and board-level connectivity.
- Arithmetic and Gate Capacity Device gate count of approximately 1,000,000 gates to support complex combinational and sequential logic designs.
- Supply and Power Core voltage specified at 1.425 V to 1.575 V for predictable power and timing behavior.
- Package and Mounting 256-ball fine-pitch BGA (256-FBGA, 17×17) in a surface-mount form factor for compact PCB integration.
- Operating Temperature and Grade Commercial grade operation from 0 °C to 85 °C, suitable for standard commercial electronic environments.
- Environmental Compliance RoHS compliant for regulatory alignment with lead-free manufacturing.
- Platform Capability (Virtex-II) Platform-level features such as integrated memory hierarchy, dedicated multiplier resources, and clock-management elements are available across the Virtex-II family to support high-performance designs.
Typical Applications
- Communications and Networking Use the device’s dense logic and flexible I/O to implement protocol processing, packet handling, and memory-interface logic commonly required in communications equipment.
- Memory Interface Controllers The combination of embedded RAM and gate capacity is suitable for building SDR/DDR or SRAM interface controllers and buffering logic.
- Signal Processing and Arithmetic Acceleration On-chip RAM and abundant logic elements support custom DSP kernels and arithmetic functions for mid-range signal-processing tasks.
- Embedded System Prototyping Compact 256-BGA package and extensive programmable resources make the device useful for prototyping custom SoC glue logic and control subsystems.
Unique Advantages
- Balanced Resource Mix: Combines 11,520 logic elements with approximately 0.74 Mbits of embedded memory to handle both control logic and local data storage without external SRAM for many functions.
- Solid I/O Count: 172 user I/Os enable multiple peripheral interfaces or parallel buses while staying within a compact BGA footprint.
- Compact Package Integration: 256-FBGA (17×17) surface-mount package supports dense PCB layouts and modern assembly processes.
- Commercial Temperature Rating: Rated 0 °C to 85 °C to meet requirements for standard commercial electronic applications.
- RoHS Compliant: Aligns with lead-free manufacturing and environmental compliance initiatives.
Why Choose XC2V1000-4FGG256C?
The XC2V1000-4FGG256C offers a practical blend of programmable logic capacity, embedded memory, and I/O density in a compact 256-BGA package. Its core voltage range and commercial temperature rating make it suitable for a wide range of commercial embedded systems where board space and integration are priorities.
This device is a good fit for designers needing a reliable Virtex®-II platform FPGA to implement custom interfaces, memory controllers, and arithmetic-intensive logic, while keeping BOM complexity and external component counts under control.
Request a quote or submit your design requirements to receive pricing and availability for the XC2V1000-4FGG256C. Our team can provide delivery and lead-time information to support your procurement or design cycle.

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