XC2V1000-4FG456I

The XC2V1000-4FG456I is a Virtex®-II platform FPGA provided in a 456-ball BGA package and specified for industrial operation. It provides a programmable logic fabric with 11,520 logic elements, approximately 0.737 Mbits of embedded RAM, and a 324-pin I/O complement to support complex digital designs and multi‑interface systems.

Designed for applications that require integrated logic, memory, and I/O density in a surface-mount, industrial-grade package, this device delivers a balance of capacity and system-level integration while operating across a 1.425 V to 1.575 V core voltage range and an extended temperature range of −40 °C to 100 °C.

Key Features

• Logic Capacity  11,520 logic elements organized across 1,280 CLB resources, providing substantial programmable logic for control, signal processing, and glue-logic implementations.
• Embedded Memory  Approximately 0.737 Mbits of on-chip RAM to support buffering, FIFOs, and distributed storage without external memory for many use cases.
• Arithmetic Resources  On-chip 18-bit × 18-bit multiplier blocks suitable for implementing multiply-accumulate functions and DSP building blocks (series-level feature).
• Clock Management  Includes Digital Clock Manager (DCM) functionality and global clock multiplexing options (series-level features) for precise clocking and phase/frequency control in synchronous designs.
• I/O and Interfaces  324 user I/Os in the 456-BBGA package provide flexible external interfacing for a variety of digital standards; SelectIO-style capabilities are included at the series level.
• Package and Mounting  456-BBGA, surface-mount package (supplier device package: 456-FBGA 23×23) for high-density PCB integration.
• Power and Supply  Core supply requirement between 1.425 V and 1.575 V to match target system power rails and regulator designs.
• Operating Range and Grade  Industrial-grade device rated for −40 °C to 100 °C operation and RoHS-compliant for environmental and manufacturing considerations.
• System Capacity  Published device gate count of 1,000,000 gates indicating substantial integration potential for mixed-logic systems.

Typical Applications

• Industrial Control  Real-time control, protocol bridging, and state-machine tasks leveraging the device’s logic capacity and industrial temperature rating.
• Communications and Networking  Custom packet processing, interface bridging, and buffer management using embedded RAM and on-chip arithmetic resources.
• Embedded System Integration  Integration of glue logic, custom peripherals, and signal conditioning to consolidate functions and reduce BOM.
• Prototyping and Development Platforms  Platform-level Virtex®-II features facilitate development of hardware-accelerated prototypes and proof-of-concept systems.

Unique Advantages

• Substantial On-chip Logic:  11,520 logic elements enable consolidation of multiple functions into a single device, reducing external components and board area.
• Integrated Memory Resources:  Approximately 0.737 Mbits of embedded RAM supports local buffering and state storage, simplifying external memory requirements for many designs.
• Robust I/O Count:  324 user I/Os in a compact 456-BBGA footprint provide flexibility for multi-channel interfacing without sacrificing density.
• Industrial Temperature Rating:  Operation from −40 °C to 100 °C makes the device suitable for industrial environments where extended temperature tolerance is required.
• Package Density and Assembly:  Surface-mount 456-BBGA (23×23 FBGA equivalent) delivers high I/O and logic density for space-constrained PCBs.
• Standards and Compliance:  RoHS-compliant construction supports modern manufacturing and environmental requirements.

Why Choose XC2V1000-4FG456I?

The XC2V1000-4FG456I combines a Virtex®-II class FPGA architecture with a balanced mix of logic, embedded memory, and a substantial I/O complement in a compact BGA package. Its industrial temperature rating and RoHS compliance make it suitable for demanding embedded and control environments where system integration and reliability are priorities.

This device is well suited for engineering teams seeking a programmable, high-capacity logic element for applications that benefit from on-chip memory and dedicated arithmetic resources while maintaining a clear power-supply and package profile for efficient board-level integration.

Request a quote or submit an inquiry for pricing, lead times, and availability to evaluate the XC2V1000-4FG456I for your next design.