XC2V1000-4FFG896C

The XC2V1000-4FFG896C is a Virtex®-II Field Programmable Gate Array (FPGA) in a 896‑ball flip‑chip FCBGA package (31 × 31 mm). It combines programmable logic, embedded memory, and high-density I/O to support complex digital designs in commercial applications.

Designed for applications that require significant on-chip resources, the device provides 11,520 logic elements, approximately 0.737 Mbits of embedded RAM, and 432 user I/Os, while operating from a 1.425 V to 1.575 V core supply and within a 0 °C to 85 °C commercial temperature range.

Key Features

• Core Logic  Provides 11,520 logic elements suitable for medium-complexity FPGA designs and system integration.
• Embedded Memory  Approximately 737,280 total RAM bits of on-chip memory for data buffering, FIFOs and small shared memory structures.
• High-Density I/O  432 user I/Os accommodate extensive external interfacing and parallel connectivity.
• Arithmetic and DSP Resources  Series-level architecture includes dedicated multiplier resources (18‑bit × 18‑bit multipliers) for arithmetic acceleration as described in the Virtex‑II platform documentation.
• Clock Management  Support for advanced clocking functions at the platform level, including Digital Clock Manager (DCM) features documented for the Virtex‑II family.
• Package and Mounting  896‑ball flip‑chip FCBGA (31 × 31 mm), surface mount package optimized for high-density PCB designs.
• Power and Supply  Core voltage specified from 1.425 V to 1.575 V to meet the device’s operating requirements.
• Operating Range  Commercial grade device rated for 0 °C to 85 °C operation.
• Regulatory  RoHS compliant.

Typical Applications

• High‑performance interfaces  Use the XC2V1000-4FFG896C to implement DRAM/SRAM interface logic and other memory controllers that benefit from embedded RAM and dedicated multiplier resources.
• Signal processing and arithmetic acceleration  Leverage on‑chip multiplier blocks and logic fabric for fixed‑function DSP tasks and custom arithmetic pipelines.
• Custom I/O and bus bridging  432 I/Os enable implementation of wide parallel interfaces, protocol bridging, or custom peripheral glue logic in commercial products.
• Embedded system control  Deploy as central logic in embedded systems that require programmable control, timing management, and moderate on‑chip memory.

Unique Advantages

• Balanced resource mix: Combination of 11,520 logic elements and approximately 0.737 Mbits of embedded RAM supports designs requiring both logic density and local memory.
• High I/O count: 432 user I/Os reduce external glue logic and simplify board-level integration for multi‑bus or parallel interfaces.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation to suit mainstream commercial applications.
• Compact FCBGA package: 896‑ball FCBGA (31 × 31 mm) delivers high pin density in a surface‑mount form factor for space‑constrained PCBs.
• Vendor platform capabilities: Part of the Virtex‑II platform family, which documents clock management, multiplier, and SelectRAM resources to accelerate common FPGA tasks.
• RoHS compliant: Meets lead‑free and restricted‑substance requirements for compliant product designs.

Why Choose XC2V1000-4FFG896C?

The XC2V1000-4FFG896C positions itself as a commercially rated Virtex‑II FPGA option combining a substantial logic element count, meaningful on‑chip RAM capacity, and a high I/O count in a compact flip‑chip FCBGA package. It is suited to developers building mid‑range programmable systems that require embedded memory, arithmetic acceleration, and flexible interfacing.

Choosing this device provides a balance of performance and integration for commercial embedded designs, offering a well‑documented platform of features to support development and scaling across related Virtex‑II devices.

Request a quote or submit a purchase inquiry for the XC2V1000-4FFG896C to discuss availability and pricing for your project requirements.