XC2V1000-4FGG456I

The XC2V1000-4FGG456I is a Virtex®-II field programmable gate array (FPGA) IC from AMD supplied in a 456-BBGA (23×23) package. It combines a substantial programmable logic capacity with embedded RAM and a high pin-count I/O footprint for complex, configurable digital designs.

Built for industrial-grade applications, this device provides 11,520 logic elements, approximately 737,280 bits of on-chip RAM, and 324 user I/Os, enabling configurable compute, memory and interface functions within a single surface-mount package.

Key Features

• Programmable Logic Core  11,520 logic elements (cells) providing the fundamental configurable logic resources for custom digital functions and finite-state logic.
• Embedded Memory  Approximately 737,280 bits of on-chip RAM to implement buffers, FIFOs, and small mapped memories without external components.
• High I/O Count  324 user I/Os available in the 456-BBGA package for broad interfacing to peripherals, memory devices, and high-density connectors.
• Arithmetic and DSP Support (platform)  Virtex-II platform feature set includes dedicated 18‑bit × 18‑bit multipliers and fast carry chains for arithmetic and DSP tasks.
• Clock Management (platform)  Virtex-II family documentation describes Digital Clock Manager (DCM) functionality for precise clock de-skew and frequency synthesis.
• Package and Mounting  456‑BBGA (23×23) surface-mount package designed for high-density board layouts and reliable soldered connections.
• Power and Electrical Range  Supported core voltage range: 1.425 V to 1.575 V, suitable for designs targeting the specified supply envelope.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Device Density  Approximate system gate count: 1,000,000 gates, enabling moderately complex system implementations.
• Standards and Documentation  Virtex‑II platform product documentation provides detailed architecture, I/O standards, timing and pinout guidance for system integration.

Typical Applications

• Memory Interface Controllers  Use the device to implement SDR/DDR and other high-performance memory controllers leveraging the Virtex‑II platform’s memory interface architecture.
• Signal Processing and DSP  Deploy dedicated multiplier resources and embedded RAM for filtering, transform engines, and real‑time data paths.
• Custom I/O and Protocol Bridging  Leverage 324 I/Os to create protocol translators, bus bridges, or bespoke I/O subsystems for industrial equipment.
• Embedded System Prototyping  Implement control logic, state machines and peripheral interfaces for proof‑of‑concept and pre-production platforms.

Unique Advantages

• High-density programmable logic: 11,520 logic elements deliver flexible on-chip logic capacity to integrate multiple subsystems and reduce external component count.
• Substantial embedded RAM: Approximately 737 Kbits of on-chip memory support buffering and local data storage, simplifying board-level memory architecture.
• Large I/O footprint: 324 user I/Os in a 456-BBGA package enable dense connectivity to peripherals, sensors, and external memory devices.
• Industrial operating range: Specified −40 °C to 100 °C temperature rating supports deployment in demanding environments.
• Comprehensive platform documentation: Virtex‑II series datasheets provide architecture, timing and pinout references to streamline integration and verification.
• Surface-mount packaging: 456‑FBGA (23×23) supplier device package supports modern PCB assembly and compact system designs.

Why Choose XC2V1000-4FGG456I?

The XC2V1000-4FGG456I positions itself as a robust Virtex‑II platform FPGA option where a balance of programmable logic, on-chip RAM and a high number of I/Os is required. Its industrial temperature rating, defined core voltage window, and BGA packaging make it suitable for space-constrained, production-grade systems.

Choose this device when your design requires integrated memory resources, dedicated arithmetic blocks (as provided by the Virtex‑II platform), and numerous I/O lines in a single, solderable package—backed by the series’ detailed documentation for architecture, pinout and timing.

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