XC2V1000-5FGG256C

IC FPGA 172 I/O 256FBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 172 737280 256-BGA

Quantity 400 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O172Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1280Number of Logic Elements/Cells11520
Number of Gates1000000ECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits737280

Overview of XC2V1000-5FGG256C – Virtex®-II Field Programmable Gate Array (FPGA) IC 172 737280 256-BGA

The XC2V1000-5FGG256C is a commercial-grade Virtex®-II platform FPGA offered by AMD. It delivers a reprogrammable logic fabric with 11,520 logic elements, embedded memory, and a 172-pin I/O count in a 256-ball fine-pitch BGA package suitable for surface-mount assembly.

Designed for applications that require flexible, high-density programmable logic with substantial on-chip RAM and a broad set of I/O capabilities, this device balances integration and I/O flexibility while operating from a 1.425 V to 1.575 V supply within a 0 °C to 85 °C commercial temperature range.

Key Features

  • Logic Capacity  Approximately 11,520 logic elements providing reprogrammable logic resources for custom digital functions and system integration.
  • Embedded Memory  Approximately 0.74 Mbits of on-chip RAM (737,280 total RAM bits) for data buffering, FIFOs, and embedded storage.
  • I/O Count & Package  172 user I/Os in a 256-ball fine-pitch BGA package (256-FBGA, 17×17); surface-mount mounting type for compact board designs.
  • Gate Equivalent  Listed at 1,000,000 gates, enabling mid-range system integration and logic consolidation.
  • Power and Operating Range  Core supply 1.425 V to 1.575 V and commercial operating temperature from 0 °C to 85 °C.
  • Memory and Arithmetic Architecture (Virtex-II)  Series-level features include a SelectRAM memory hierarchy and dedicated 18 × 18 multipliers for efficient arithmetic implementation.
  • Clocking and Timing (Virtex-II)  Series-level clock management capabilities such as Digital Clock Manager (DCM) modules and global clock buffers to support precise clocking architectures.
  • I/O Technology (Virtex-II)  Series-level SelectIO features and Digitally Controlled Impedance (DCI) options for flexible interfacing and on-chip termination where applicable.
  • Compliance  RoHS compliant.

Typical Applications

  • Memory Interface Prototyping  Use for designs requiring on-chip RAM and series-level high-performance external memory interfaces such as SDR/DDR SDRAM and specialized SRAM variants.
  • Digital Signal and Arithmetic Acceleration  Leverage dedicated multiplier blocks and abundant logic elements for DSP blocks, filtering, and arithmetic pipelines.
  • Custom I/O and Protocol Bridging  Deploy where flexible I/O counts and SelectIO capabilities are needed to connect diverse peripherals or implement custom bus bridges.
  • Embedded System Glue Logic  Integrate complex control logic, state machines, and buffering functions to reduce board-level BOM and simplify system architecture.

Unique Advantages

  • High-density reprogrammable logic: 11,520 logic elements and 1,000,000 gate equivalence enable consolidation of discrete logic and embedded subsystems into a single device.
  • Substantial on-chip RAM: Approximately 0.74 Mbits of embedded memory reduces dependence on external memory for moderate buffering and storage needs.
  • Flexible I/O and package: 172 user I/Os in a compact 256-FBGA (17×17) surface-mount package support complex interfacing while keeping PCB area small.
  • Clock and arithmetic resources: Series-level Digital Clock Manager and dedicated multipliers simplify implementation of precise timing and compute-intensive functions.
  • Regulatory and assembly readiness: RoHS compliance and surface-mount BGA packaging support modern manufacturing and environmental requirements.
  • Commercial temperature rating: Specified for 0 °C to 85 °C environments, appropriate for a wide range of commercial and consumer electronics designs.

Why Choose XC2V1000-5FGG256C?

The XC2V1000-5FGG256C delivers a balanced mix of logic density, embedded memory, and flexible I/O in a compact 256-FBGA package. Its Virtex®-II platform capabilities—such as SelectRAM memory hierarchy, dedicated multipliers, and clock management features—make it well suited for mid-range FPGA tasks where integration and adaptability are priorities.

This device is a fit for engineering teams that need reprogrammable logic to prototype or deploy custom digital functions, memory interfaces, and protocol bridging while maintaining a compact board footprint and RoHS-compliant manufacturing readiness.

If you would like pricing, availability, or to request a quote for XC2V1000-5FGG256C, please submit a quote request or contact sales to get started.

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