XC2V1000-5FGG456I
| Part Description |
Virtex®-II Field Programmable Gate Array (FPGA) IC 324 737280 456-BBGA |
|---|---|
| Quantity | 144 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 456-FBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 456-BBGA | Number of I/O | 324 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1280 | Number of Logic Elements/Cells | 11520 | ||
| Number of Gates | 1000000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 737280 |
Overview of XC2V1000-5FGG456I – Virtex®-II Field Programmable Gate Array (FPGA) IC 324 737280 456-BBGA
The XC2V1000-5FGG456I is a Virtex®-II platform FPGA manufactured by AMD, offering a mid-range logic density and extensive I/O in a compact BGA package. It combines 11,520 logic elements with approximately 0.737 Mbits of embedded RAM and 324 user I/Os to address designs that require programmable logic, on-chip memory, and flexible interfacing.
This device is intended for industrial-temperature applications and supports a core voltage supply range of 1.425 V to 1.575 V, packaged in a 456-ball BGA format suitable for surface-mount assembly.
Key Features
- Logic Capacity Provides 11,520 logic elements (11520 logic elements) and a gate equivalence of 1,000,000 gates for mid-range programmable designs.
- Embedded Memory Approximately 0.737 Mbits of on-chip RAM (737,280 total RAM bits) for data buffering, FIFOs, and local storage within user logic.
- I/O Resources 324 user I/Os enable broad external connectivity for parallel buses, memory interfaces, and peripheral control.
- Arithmetic and DSP Support Device specification references dedicated multiplier resources in the Virtex-II architecture suitable for arithmetic and signal-processing functions.
- Clock and Timing Virtex-II platform features include Digital Clock Manager (DCM) circuitry and global clock resources for flexible clocking and deskew (as described in the Virtex-II series documentation).
- Power and Supply Core voltage operating range of 1.425 V to 1.575 V for compatibility with targeted system power architectures.
- Package and Mounting 456-ball BGA package case; supplier device package listed as 456-FBGA (23×23). Surface-mount mounting type.
- Temperature Range Industrial operating range from −40°C to 100°C for use in temperature-demanding environments.
- RoHS Compliance Device is RoHS compliant for regulatory and environmental considerations.
Typical Applications
- Memory Interface Controllers Use the device’s abundant I/O and on-chip memory to implement SDR/DDR or SRAM interface logic and custom memory controllers.
- Embedded Signal Processing Leverage dedicated multipliers and logic elements for fixed-point DSP blocks, filtering, or packet processing tasks.
- High-Density Logic Integration Consolidate multiple glue-logic functions and custom state machines into a single FPGA to reduce board-level complexity.
- Industrial Control and Automation Deploy in control, monitoring, and I/O aggregation roles that require industrial temperature operation and flexible I/O configurations.
Unique Advantages
- Balanced Logic and Memory 11,520 logic elements combined with approximately 0.737 Mbits of embedded RAM provide a balanced resource mix for control, buffering, and mid-sized logic partitions.
- Extensive I/O Count 324 user I/Os give designers the ability to interface directly with wide parallel buses, memory devices, and peripheral sets without external glue chips.
- Industrial Temperature Capability Rated for −40°C to 100°C operation, suitable for deployment in temperature-challenging industrial environments.
- Compact BGA Packaging 456-ball BGA (supplier 456-FBGA 23×23) reduces PCB footprint while supporting high pin-count connectivity for complex systems.
- Platform-Level Features Built on the Virtex-II architecture with documented features such as SelectRAM memory resources, 18×18 multipliers, and Digital Clock Manager blocks to support common FPGA design patterns.
Why Choose XC2V1000-5FGG456I?
The XC2V1000-5FGG456I positions itself as a practical Virtex-II FPGA choice when mid-range logic density, a substantial on-chip memory footprint, and a high I/O count are required in an industrial-temperature device. Its combination of 11,520 logic elements, approximately 0.737 Mbits of embedded RAM, and 324 I/Os makes it well suited to applications that need integrated logic, buffering, and flexible external interfaces.
Designed within the Virtex-II platform, the device benefits from series-level architecture features—such as dedicated multipliers and clock management resources—providing designers with a mature set of capabilities for creating robust, scalable systems that align with long-term deployment and support expectations.
Request a quote or submit a purchase inquiry today to evaluate how the XC2V1000-5FGG456I can fit into your next FPGA-based design.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








