XC2V1000-5FGG456I

IC FPGA 324 I/O 456FBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 324 737280 456-BBGA

Quantity 144 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package456-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case456-BBGANumber of I/O324Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1280Number of Logic Elements/Cells11520
Number of Gates1000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits737280

Overview of XC2V1000-5FGG456I – Virtex®-II Field Programmable Gate Array (FPGA) IC 324 737280 456-BBGA

The XC2V1000-5FGG456I is a Virtex®-II platform FPGA manufactured by AMD, offering a mid-range logic density and extensive I/O in a compact BGA package. It combines 11,520 logic elements with approximately 0.737 Mbits of embedded RAM and 324 user I/Os to address designs that require programmable logic, on-chip memory, and flexible interfacing.

This device is intended for industrial-temperature applications and supports a core voltage supply range of 1.425 V to 1.575 V, packaged in a 456-ball BGA format suitable for surface-mount assembly.

Key Features

  • Logic Capacity  Provides 11,520 logic elements (11520 logic elements) and a gate equivalence of 1,000,000 gates for mid-range programmable designs.
  • Embedded Memory  Approximately 0.737 Mbits of on-chip RAM (737,280 total RAM bits) for data buffering, FIFOs, and local storage within user logic.
  • I/O Resources  324 user I/Os enable broad external connectivity for parallel buses, memory interfaces, and peripheral control.
  • Arithmetic and DSP Support  Device specification references dedicated multiplier resources in the Virtex-II architecture suitable for arithmetic and signal-processing functions.
  • Clock and Timing  Virtex-II platform features include Digital Clock Manager (DCM) circuitry and global clock resources for flexible clocking and deskew (as described in the Virtex-II series documentation).
  • Power and Supply  Core voltage operating range of 1.425 V to 1.575 V for compatibility with targeted system power architectures.
  • Package and Mounting  456-ball BGA package case; supplier device package listed as 456-FBGA (23×23). Surface-mount mounting type.
  • Temperature Range  Industrial operating range from −40°C to 100°C for use in temperature-demanding environments.
  • RoHS Compliance  Device is RoHS compliant for regulatory and environmental considerations.

Typical Applications

  • Memory Interface Controllers  Use the device’s abundant I/O and on-chip memory to implement SDR/DDR or SRAM interface logic and custom memory controllers.
  • Embedded Signal Processing  Leverage dedicated multipliers and logic elements for fixed-point DSP blocks, filtering, or packet processing tasks.
  • High-Density Logic Integration  Consolidate multiple glue-logic functions and custom state machines into a single FPGA to reduce board-level complexity.
  • Industrial Control and Automation  Deploy in control, monitoring, and I/O aggregation roles that require industrial temperature operation and flexible I/O configurations.

Unique Advantages

  • Balanced Logic and Memory  11,520 logic elements combined with approximately 0.737 Mbits of embedded RAM provide a balanced resource mix for control, buffering, and mid-sized logic partitions.
  • Extensive I/O Count  324 user I/Os give designers the ability to interface directly with wide parallel buses, memory devices, and peripheral sets without external glue chips.
  • Industrial Temperature Capability  Rated for −40°C to 100°C operation, suitable for deployment in temperature-challenging industrial environments.
  • Compact BGA Packaging  456-ball BGA (supplier 456-FBGA 23×23) reduces PCB footprint while supporting high pin-count connectivity for complex systems.
  • Platform-Level Features  Built on the Virtex-II architecture with documented features such as SelectRAM memory resources, 18×18 multipliers, and Digital Clock Manager blocks to support common FPGA design patterns.

Why Choose XC2V1000-5FGG456I?

The XC2V1000-5FGG456I positions itself as a practical Virtex-II FPGA choice when mid-range logic density, a substantial on-chip memory footprint, and a high I/O count are required in an industrial-temperature device. Its combination of 11,520 logic elements, approximately 0.737 Mbits of embedded RAM, and 324 I/Os makes it well suited to applications that need integrated logic, buffering, and flexible external interfaces.

Designed within the Virtex-II platform, the device benefits from series-level architecture features—such as dedicated multipliers and clock management resources—providing designers with a mature set of capabilities for creating robust, scalable systems that align with long-term deployment and support expectations.

Request a quote or submit a purchase inquiry today to evaluate how the XC2V1000-5FGG456I can fit into your next FPGA-based design.

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