XC2V1000-6BGG575C

The XC2V1000-6BGG575C is a Virtex®-II platform field programmable gate array designed for mid-range programmable-logic applications. This commercial-grade, surface-mount FPGA integrates approximately 11,520 logic elements, roughly 1,000,000 system gates and approximately 0.74 Mbits of embedded RAM to support complex logic and memory-intense functions.

Targeted at designs that require flexible I/O and on-chip arithmetic and clock management resources, the device delivers a balanced mix of logic density, I/O capability and on-chip memory while operating from a 1.425 V to 1.575 V supply in a compact 575-BBGA (31×31) package.

Key Features

• Logic Capacity  Approximately 11,520 logic elements (11520 logic cells) and about 1,000,000 gates provide mid-range programmable logic for combinational and sequential designs.
• Embedded Memory  Approximately 737,280 bits (≈0.74 Mbits) of on-chip RAM for buffering, FIFOs and small data structures within the FPGA fabric.
• I/O Resources  328 user I/O pins support a wide range of external interfaces and peripherals while enabling dense board-level connectivity.
• Arithmetic and DSP  Series-level features include dedicated 18-bit × 18-bit multiplier blocks useful for multiply-accumulate and signal-processing functions.
• Clock Management  Supports Digital Clock Manager (DCM) functionality from the Virtex®-II platform for clock de-skew, synthesis and phase adjustments when used in designs leveraging platform features.
• Package & Mounting  575-BBGA (31×31) ball-grid array in a surface-mount package for compact, high-density board layouts.
• Power & Supply  Operates from a core supply range of 1.425 V to 1.575 V, enabling predictable power budgeting within the specified range.
• Operating Range  Commercial temperature rating from 0 °C to 85 °C for standard ambient operating conditions.
• Compliance  RoHS compliant, meeting common lead-free requirements for electronic assemblies.

Typical Applications

• Communications Equipment  Implements protocol bridging, packet processing, and memory-interface logic using the device’s combination of logic, embedded RAM and high I/O count.
• DSP and Signal Processing  Leverages on-chip multiplier blocks and embedded RAM to accelerate filtering, transforms and other arithmetic-heavy functions.
• Prototyping and System Integration  Serves as a flexible platform for validating custom logic, integrating peripherals and interfacing with external memory devices.
• Industrial Control  Handles mid-complexity control, sequencing and I/O aggregation tasks within commercial-temperature systems.

Unique Advantages

• Balanced Logic and Memory  Combines roughly 11,520 logic elements with approximately 0.74 Mbits of embedded RAM to support mixed-control and data-path designs without immediate external memory dependence.
• High I/O Density  328 available I/Os let designers implement multiple parallel interfaces and expand board-level connectivity while maintaining a single-package solution.
• On-Chip Arithmetic Blocks  Dedicated 18×18 multipliers simplify implementation of DSP kernels and offload compute from external processors.
• Compact, Surface-Mount Package  575-BBGA (31×31) offers a space-efficient footprint for designs where board area is a consideration.
• Predictable Power Envelope  Defined core supply range (1.425 V–1.575 V) supports consistent power planning and voltage rail design.
• Regulatory Compatibility  RoHS compliance supports lead-free assembly requirements and common environmental regulations.

Why Choose XC2V1000-6BGG575C?

The XC2V1000-6BGG575C positions itself as a mid-range Virtex®-II FPGA option that balances programmable logic capacity, embedded memory and a substantial I/O complement in a compact 575-BBGA surface-mount package. Its combination of approximately 11,520 logic elements, roughly 1,000,000 gates and approximately 0.74 Mbits of on-chip RAM makes it well suited to designs that need moderate logic density with on-board memory and DSP support while operating within standard commercial temperature ranges.

For engineering teams and procurement groups building communication, DSP, prototyping or industrial-control systems, this device delivers a robust platform-level feature set from the Virtex®-II family with predictable power and package characteristics and RoHS compliance for lead-free assembly workflows.

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