XC2V1000-6FGG456C

The XC2V1000-6FGG456C is a commercial-grade Virtex®-II field programmable gate array in a 456-ball BGA package configured for surface-mount assembly. It provides a balanced mix of logic, embedded memory, and I/O suitable for designs that require on-chip logic density, memory resources, and flexible high-performance I/O.

Built on the Virtex-II platform architecture, the device targets applications that need dedicated arithmetic blocks, embedded SelectRAM resources, and configurable I/O standards—delivering integration that helps reduce external component count while supporting complex interfacing and signal-processing functions.

Key Features

• Logic Capacity 1,280 configurable logic blocks (CLBs) and 11,520 logic elements provide the core programmable fabric for combinational and sequential logic implementation.
• Embedded Memory Approximately 0.737 Mbits of on-chip RAM (737,280 total RAM bits) of SelectRAM-style resources for data buffering, FIFOs, and on-chip storage.
• Arithmetic Resources Virtex-II platform includes dedicated 18-bit × 18-bit multiplier blocks for efficient implementation of DSP and arithmetic functions.
• I/O and Connectivity 324 user I/O pins in a 456-BBGA package (supplier device package: 456-FBGA 23×23) to support rich external interfacing and multiple I/O standards.
• Clock and Timing The Virtex-II architecture provides Digital Clock Manager (DCM) capabilities and global clock multiplexing to enable precise clock de-skew, frequency synthesis, and phase management (platform-level feature).
• Package & Mounting 456-BBGA surface-mount package (456-FBGA, 23×23) for high-density board designs requiring BGA mounting.
• Electrical & Environmental Core supply voltage range 1.425 V to 1.575 V and commercial operating temperature from 0 °C to 85 °C. RoHS compliant.
• Device Scale Documented at approximately 1,000,000 system gates, providing a reference for integration scale and complexity.

Typical Applications

• Communications Equipment Implement protocol logic, memory interfaces and high-speed I/O paths where dense logic and embedded RAM support packet buffering and interface control.
• Signal Processing & DSP Use the embedded multiplier blocks and on-chip RAM for filtering, transforms, and other arithmetic-heavy algorithms.
• Memory Interface Controllers Integrate controllers and bridge logic for SDR/DDR memory interfaces and SRAM/QDR front ends leveraging the device’s on-chip memory and I/O resources.
• Embedded Systems & Prototyping Rapidly prototype system logic and glue functions in compact board footprints using the 456-BBGA package and broad I/O count.

Unique Advantages

• Balanced Integration: Combines 11,520 logic elements with substantial embedded RAM to minimize external components and simplify board-level memory design.
• Rich I/O in a Compact Package: 324 I/Os in a 456-ball BGA allow dense external interfacing for multi-protocol and multi-peripheral applications.
• DSP-Ready Resources: Platform-level 18×18 multipliers accelerate arithmetic workloads, enabling efficient implementation of signal-processing pipelines.
• Deterministic Clocking: Virtex-II clock management features (DCM and global clock multiplexing) provide flexible, precise clock control for synchronous designs.
• Design Scalability: Approximately 1,000,000 system gates and a sizable CLB/logic element count support mid-range to complex designs while retaining a compact package footprint.
• Compliance and Assembly: RoHS-compliant and supplied in a surface-mount BGA package suitable for modern electronics manufacturing processes.

Why Choose XC2V1000-6FGG456C?

The XC2V1000-6FGG456C positions itself as a versatile commercial FPGA solution for applications that require a practical balance of logic, embedded memory, and flexible I/O in a compact BGA package. Its Virtex-II platform capabilities—such as dedicated multiplier resources, SelectRAM memory hierarchy, and clock management features—make it a strong fit for designs involving data buffering, signal processing, and complex interfacing.

Engineers and system designers will find value in the device’s integration level and predictable electrical window (1.425–1.575 V core supply and 0 °C–85 °C operating range), which support streamlined BOMs and robust prototype-to-production workflows.

Request a quote or submit your specification to receive pricing and availability for the XC2V1000-6FGG456C. Our team will respond with lead-time and order options tailored to your project schedule.