XC2V1000-5FGG256I

IC FPGA 172 I/O 256FBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 172 737280 256-BGA

Quantity 1,257 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-BGANumber of I/O172Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1280Number of Logic Elements/Cells11520
Number of Gates1000000ECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits737280

Overview of XC2V1000-5FGG256I – Virtex®-II FPGA, 256-BGA (Industrial)

The XC2V1000-5FGG256I is a Virtex®-II Field Programmable Gate Array (FPGA) provided by AMD, offered in a 256-ball BGA package. It delivers a balanced combination of programmable logic, embedded memory, and I/O connectivity aimed at mid-density FPGA applications.

Built on the Virtex-II platform architecture, the device targets designs that need on-chip RAM, dedicated arithmetic resources, and flexible I/O while operating across an industrial temperature range and a narrow core voltage window for controlled power delivery.

Key Features

  • Logic Capacity  Approximately 11,520 logic elements and about 1,000,000 system gates, providing a mid-range fabric for custom digital logic implementations.
  • Configurable Logic Blocks  1,280 CLB resources (as specified) to structure and map user logic across the device.
  • Embedded Memory  Approximately 0.737 Mbits of on-chip RAM (737,280 total RAM bits) for block and distributed memory needs within the design.
  • Dedicated Arithmetic  Virtex-II platform includes 18-bit × 18-bit multiplier resources for hardware-accelerated multiply operations (platform feature).
  • I/O Resources  172 user I/Os available on the 256-BGA package to interface with external devices and buses.
  • Clock and Timing  Platform-level clock management features (Digital Clock Manager and global clock buffers) designed to support precise clock distribution and de-skew in complex designs.
  • Package and Mounting  256-BGA (supplier package: 256-FBGA, 17×17) in a surface-mount form factor for PCB assembly.
  • Power Supply  Core voltage supply range from 1.425 V to 1.575 V to match regulated FPGA power rails.
  • Temperature and Grade  Industrial grade device with an operating temperature range of −40 °C to 100 °C.
  • Compliance  RoHS compliant for environmental and lead-free assembly considerations.

Typical Applications

  • Memory Interface and Control  Use the device’s embedded memory and platform memory hierarchy to implement DRAM/SRAM interface logic and buffer control functions.
  • Signal Processing  Leverage the device’s embedded RAM and multiplier resources for fixed-point DSP functions, packet processing, and data-path acceleration.
  • Custom Logic and Glue  Mid-density logic capacity and flexible I/O make the FPGA suitable for glue logic, protocol conversion, and custom peripheral controllers in embedded systems.
  • Timing-Critical Designs  Platform clock management capabilities support applications requiring precise clock distribution and phase control across multiple clock domains.

Unique Advantages

  • Balanced Logic and Memory  Combines approximately 11,520 logic elements with ~0.737 Mbits of embedded RAM to support both control logic and data buffering on-chip, reducing external memory dependencies.
  • Dedicated Arithmetic Resources  Includes platform-level 18×18 multiplier blocks to accelerate multiply-intensive algorithms without consuming general-purpose logic.
  • Flexible I/O Count  172 user I/Os in a compact 256-BGA footprint enable integration with numerous peripherals and board-level interfaces while keeping PCB area modest.
  • Industrial Temperature Range  Rated from −40 °C to 100 °C for deployment in industrial environments where extended temperature operation is required.
  • Controlled Core Voltage  Narrow supply range (1.425 V–1.575 V) supports precise power sequencing and predictable power delivery for reliable operation.
  • RoHS Compliant  Manufactured to meet RoHS requirements for lead-free assembly and regulatory conformity.

Why Choose XC2V1000-5FGG256I?

The XC2V1000-5FGG256I positions itself as a mid-density Virtex®-II FPGA option that blends programmable logic, embedded memory, and dedicated arithmetic blocks suitable for a range of embedded and signal-processing tasks. Its industrial temperature rating and RoHS compliance make it suitable for long-life and environmentally compliant designs.

This device is appropriate for engineers seeking a compact BGA package with a defined I/O count and on-chip resources that reduce external component count and simplify board-level design. The combination of core voltage specification, package, and platform-level features supports scalable designs where predictable power and timing behavior are important.

If you would like pricing, availability, or to request a quote for XC2V1000-5FGG256I, submit an inquiry or quote request and our team will respond with product and procurement details.

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