XC2V1500-4FG676I

The XC2V1500-4FG676I is a Virtex®-II series field programmable gate array supplied in a 676‑ball BGA package. It combines a dense logic fabric, embedded memory, and flexible I/O to support complex, industrial-grade digital designs.

Designed for applications requiring substantial on‑chip logic and memory with wide I/O capability, this device offers a balanced platform for high‑integration FPGA implementations in industrial environments.

Key Features

• Logic Capacity 1920 configurable logic blocks (CLBs), delivering 17,280 logic elements and approximately 1,500,000 system gates for complex logic integration.
• Embedded Memory 884,736 total on‑chip RAM bits, providing approximately 0.885 Mbits of embedded memory for buffering, FIFOs, and local storage.
• Arithmetic Resources On‑chip multiplier support as described in the Virtex‑II series datasheet for implementing dedicated arithmetic and DSP functions.
• I/O and Signaling 392 user I/Os with SelectIO and Digitally Controlled Impedance (DCI) capabilities described in the series documentation, enabling a variety of single‑ended and differential signaling standards.
• Clock and Timing Series‑level clock management features such as Digital Clock Manager (DCM) blocks are available for precise clocking and phase control as detailed in the product family specification.
• Package and Mounting 676‑BGA (supplier device package: 676‑FBGA, 27×27) surface‑mount package suitable for board‑level integration where high I/O density is required.
• Power Core voltage supply range of 1.425 V to 1.575 V for device operation.
• Industrial Temperature Grade Specified operating temperature range from −40 °C to 100 °C, suitable for industrial environments.
• Compliance RoHS compliant.

Typical Applications

• Memory Interface and Controllers Use the device’s embedded memory and high‑performance interface features to implement SDR/DDR memory controllers, buffering, and external memory bridges.
• Signal Processing and DSP Leverage on‑chip multipliers and dense logic resources to implement arithmetic pipelines, filtering, and custom signal‑processing blocks.
• Industrial Control Deploy in industrial automation and control systems where industrial temperature range and high I/O count support sensor, actuator, and fieldbus interfacing.

Unique Advantages

• High Logic Integration: Consolidate complex functions on a single device with 17,280 logic elements and 1.5M gates, reducing board‑level component count.
• Substantial Embedded Memory: Approximately 0.885 Mbits of on‑chip RAM supports large local buffers and state storage without external memory.
• Flexible I/O Options: 392 I/Os and series‑documented SelectIO/DCI features enable a wide range of signaling standards and on‑chip termination options.
• Industrial‑Grade Thermal Range: −40 °C to 100 °C operating range allows deployment in demanding temperature environments.
• Compact, High‑Density Package: 676‑FBGA (27×27) package offers high I/O density for space constrained PCB designs.
• Standards‑Conscious Manufacturing: RoHS compliance simplifies integration into modern production and procurement workflows.

Why Choose XC2V1500-4FG676I?

The XC2V1500-4FG676I delivers a balanced combination of logic capacity, embedded memory, and flexible I/O in a 676‑BGA package tailored for industrial applications. Its array of series‑level features for clock management, on‑chip arithmetic, and I/O flexibility make it suitable for designs that require significant on‑chip integration and robust environmental performance.

This part is well suited to engineering teams building complex controllers, memory interfaces, or DSP‑centric functions who need a proven FPGA platform with industrial temperature range and RoHS compliance.

Request a quote or submit a procurement inquiry to receive pricing and availability for the XC2V1500-4FG676I and to discuss how it fits your next design.