XC2V1500-5BGG575C
| Part Description |
Virtex®-II Field Programmable Gate Array (FPGA) IC 392 884736 575-BBGA |
|---|---|
| Quantity | 72 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 575-BGA (31x31) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 575-BBGA | Number of I/O | 392 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1920 | Number of Logic Elements/Cells | 17280 | ||
| Number of Gates | 1500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 884736 |
Overview of XC2V1500-5BGG575C – Virtex®-II FPGA, 1.5M Gates, 575-BBGA
The XC2V1500-5BGG575C is a Virtex®-II field programmable gate array (FPGA) offered in a 575-BBGA package. It delivers approximately 1,500,000 system gates with 1,920 CLBs and 17,280 logic elements, making it suitable for complex digital designs that require high logic density and substantial on-chip memory.
As part of the Virtex-II platform, this device integrates SelectRAM memory resources, dedicated 18-bit × 18-bit multipliers, and Digital Clock Manager (DCM) capabilities at the series level. The device provides 392 user I/Os, operates from a 1.425 V to 1.575 V supply, and is specified for commercial temperature operation (0 °C to 85 °C). It is RoHS-compliant and supplied in a surface-mount 575-BBGA (575-BGA 31x31) package.
Key Features
- Core Capacity Approximately 1,500,000 system gates with 1,920 CLBs and 17,280 logic elements to support dense logic implementations and complex control paths.
- Embedded Memory Approximately 0.885 Mbits of total on-chip RAM (884,736 bits) for block SelectRAM and distributed memory usage within designs.
- DSP Resources Series-level support for dedicated 18-bit × 18-bit multiplier blocks to accelerate arithmetic and signal-processing functions.
- I/O Density 392 user I/Os for broad interface connectivity and flexible board-level integration.
- Clock Management Virtex-II platform Digital Clock Manager (DCM) resources provide high-performance clocking and phase/frequency control for multi-clock designs.
- Power and Supply Device supply specified between 1.425 V and 1.575 V to match system power rails and design requirements.
- Package and Mounting 575-BBGA package (575-BGA, 31x31) in a surface-mount form factor for high-density PCB assembly.
- Operating Grade Commercial temperature rating from 0 °C to 85 °C and RoHS-compliant materials.
Typical Applications
- High-performance memory interfaces Use the device’s abundant logic, embedded RAM, and series-level DRAM/SRAM interface support to implement memory controllers and buffering logic.
- DSP and signal processing Leverage dedicated multiplier blocks and substantial logic resources for arithmetic-intensive functions and real-time processing pipelines.
- High-density I/O systems The 392 user I/Os enable complex board-level interconnects, multi-protocol bridging, and broad peripheral interfacing.
- System integration and prototyping Combine logic density and on-chip memory to consolidate functions and accelerate development of complex FPGA-based systems.
Unique Advantages
- Significant logic capacity: Enables consolidation of large designs into a single FPGA, reducing external glue logic and simplifying system architecture.
- Substantial embedded memory: Approximately 0.885 Mbits of on-chip RAM supports large buffers, queues, and state storage without immediate dependence on external memory.
- Dedicated arithmetic blocks: 18-bit × 18-bit multipliers accelerate multiply-intensive operations, improving throughput for DSP workloads.
- Robust I/O complement: 392 I/Os provide the flexibility to support multiple interfaces and high-pin-count subsystems from a single device.
- Commercial temperature and RoHS compliance: Ready for standard commercial applications with environmentally compliant materials.
- Surface-mount BGA packaging: 575-BBGA (575-BGA 31x31) supports high-density board designs and automated assembly processes.
Why Choose XC2V1500-5BGG575C?
The XC2V1500-5BGG575C positions itself as a high-capacity Virtex®-II FPGA for designers who need substantial gate counts, plentiful logic elements, and on-chip RAM in a single surface-mount BGA package. With 392 I/Os, dedicated multiplier resources, and platform-level clock-management and memory features, it targets complex digital designs that require a mix of compute, memory, and I/O density within a commercial temperature range.
Choosing this device offers long-term design scalability and integration benefits for system and board-level developers who prioritize consolidating logic and memory into a configurable silicon solution while maintaining RoHS compliance and standard commercial-grade operation.
Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the XC2V1500-5BGG575C.

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