XC2V1500-5BGG575C

IC FPGA 392 I/O 575BGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 392 884736 575-BBGA

Quantity 72 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package575-BGA (31x31)GradeCommercialOperating Temperature0°C – 85°C
Package / Case575-BBGANumber of I/O392Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1920Number of Logic Elements/Cells17280
Number of Gates1500000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits884736

Overview of XC2V1500-5BGG575C – Virtex®-II FPGA, 1.5M Gates, 575-BBGA

The XC2V1500-5BGG575C is a Virtex®-II field programmable gate array (FPGA) offered in a 575-BBGA package. It delivers approximately 1,500,000 system gates with 1,920 CLBs and 17,280 logic elements, making it suitable for complex digital designs that require high logic density and substantial on-chip memory.

As part of the Virtex-II platform, this device integrates SelectRAM memory resources, dedicated 18-bit × 18-bit multipliers, and Digital Clock Manager (DCM) capabilities at the series level. The device provides 392 user I/Os, operates from a 1.425 V to 1.575 V supply, and is specified for commercial temperature operation (0 °C to 85 °C). It is RoHS-compliant and supplied in a surface-mount 575-BBGA (575-BGA 31x31) package.

Key Features

  • Core Capacity  Approximately 1,500,000 system gates with 1,920 CLBs and 17,280 logic elements to support dense logic implementations and complex control paths.
  • Embedded Memory  Approximately 0.885 Mbits of total on-chip RAM (884,736 bits) for block SelectRAM and distributed memory usage within designs.
  • DSP Resources  Series-level support for dedicated 18-bit × 18-bit multiplier blocks to accelerate arithmetic and signal-processing functions.
  • I/O Density  392 user I/Os for broad interface connectivity and flexible board-level integration.
  • Clock Management  Virtex-II platform Digital Clock Manager (DCM) resources provide high-performance clocking and phase/frequency control for multi-clock designs.
  • Power and Supply  Device supply specified between 1.425 V and 1.575 V to match system power rails and design requirements.
  • Package and Mounting  575-BBGA package (575-BGA, 31x31) in a surface-mount form factor for high-density PCB assembly.
  • Operating Grade  Commercial temperature rating from 0 °C to 85 °C and RoHS-compliant materials.

Typical Applications

  • High-performance memory interfaces  Use the device’s abundant logic, embedded RAM, and series-level DRAM/SRAM interface support to implement memory controllers and buffering logic.
  • DSP and signal processing  Leverage dedicated multiplier blocks and substantial logic resources for arithmetic-intensive functions and real-time processing pipelines.
  • High-density I/O systems  The 392 user I/Os enable complex board-level interconnects, multi-protocol bridging, and broad peripheral interfacing.
  • System integration and prototyping  Combine logic density and on-chip memory to consolidate functions and accelerate development of complex FPGA-based systems.

Unique Advantages

  • Significant logic capacity: Enables consolidation of large designs into a single FPGA, reducing external glue logic and simplifying system architecture.
  • Substantial embedded memory: Approximately 0.885 Mbits of on-chip RAM supports large buffers, queues, and state storage without immediate dependence on external memory.
  • Dedicated arithmetic blocks: 18-bit × 18-bit multipliers accelerate multiply-intensive operations, improving throughput for DSP workloads.
  • Robust I/O complement: 392 I/Os provide the flexibility to support multiple interfaces and high-pin-count subsystems from a single device.
  • Commercial temperature and RoHS compliance: Ready for standard commercial applications with environmentally compliant materials.
  • Surface-mount BGA packaging: 575-BBGA (575-BGA 31x31) supports high-density board designs and automated assembly processes.

Why Choose XC2V1500-5BGG575C?

The XC2V1500-5BGG575C positions itself as a high-capacity Virtex®-II FPGA for designers who need substantial gate counts, plentiful logic elements, and on-chip RAM in a single surface-mount BGA package. With 392 I/Os, dedicated multiplier resources, and platform-level clock-management and memory features, it targets complex digital designs that require a mix of compute, memory, and I/O density within a commercial temperature range.

Choosing this device offers long-term design scalability and integration benefits for system and board-level developers who prioritize consolidating logic and memory into a configurable silicon solution while maintaining RoHS compliance and standard commercial-grade operation.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the XC2V1500-5BGG575C.

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