XC2V1500-5FGG676C

IC FPGA 392 I/O 676FBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 392 884736 676-BGA

Quantity 1,112 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case676-BGANumber of I/O392Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1920Number of Logic Elements/Cells17280
Number of Gates1500000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits884736

Overview of XC2V1500-5FGG676C – Virtex®-II Field Programmable Gate Array (FPGA) IC 392 884736 676-BGA

The XC2V1500-5FGG676C is a Virtex®-II field programmable gate array offered in a 676-ball fine-pitch BGA (27×27) package. It provides a high-density, commercial-grade FPGA fabric with 17,280 logic elements (cells), 1,920 CLBs, and approximately 0.885 Mbits of embedded RAM, suitable for designs that require significant programmable logic and on-chip memory.

Designed for applications that need flexible I/O and memory interfacing, the Virtex-II platform documented in the product datasheet includes features such as SelectRAM memory hierarchy, dedicated 18-bit × 18-bit multipliers, and digital clock management — giving designers a platform-level set of capabilities to accelerate implementation of memory interfaces, DSP functions, and high-speed I/O systems.

Key Features

  • Logic Capacity  17,280 logic elements (cells) and 1,920 CLBs provide substantial programmable logic for medium-to-high density designs; the device is specified at approximately 1,500,000 system gates.
  • Embedded Memory  Approximately 0.885 Mbits of on-chip RAM (884,736 bits) for data buffering, FIFOs, and scratchpad storage inside the FPGA fabric.
  • Arithmetic and DSP Resources  Platform-level features include dedicated 18-bit × 18-bit multiplier blocks useful for multiply-accumulate and DSP workloads.
  • Clock Management  The Virtex-II platform includes Digital Clock Manager (DCM) circuitry for precise clock de-skew and flexible frequency/phase control, enabling robust timing management for complex designs.
  • I/O Capacity and Flexibility  392 user I/Os in a fine-pitch BGA package support dense board-level connectivity. The platform supports a variety of high-performance I/O standards and on-chip termination options as documented in the Virtex-II datasheet.
  • Package and Mounting  Supplied in a 676-FBGA (27×27) surface-mount package for compact, board-mounted integration.
  • Power  Core voltage supply range: 1.425 V to 1.575 V, enabling proper integration with supply rails specified for the device.
  • Operating Conditions  Commercial grade device rated for 0 °C to 85 °C operating temperature and RoHS compliant for lead-free assembly.

Typical Applications

  • Memory Interface Controllers  Implement SDR/DDR and SRAM interface logic leveraging the device’s on-chip RAM and platform-level memory interface support.
  • Signal Processing and DSP  Use dedicated 18×18 multipliers and embedded RAM for filtering, transforms, and other fixed-point DSP tasks.
  • High-Density I/O Bridging  Leverage 392 I/Os in the 676-BGA package for protocol bridging, bus interfacing, and multi-channel I/O aggregation.
  • Prototype and System Integration  Medium- to high-complexity FPGA designs that require substantial logic resources, on-chip memory, and flexible clocking for system validation and integration.

Unique Advantages

  • Substantial Logic and Memory in One Device: 17,280 logic elements combined with approximately 0.885 Mbits of embedded RAM reduce the need for external logic and memory in many designs.
  • Dedicated DSP Primitives: Built-in 18×18 multipliers accelerate arithmetic-heavy functions and simplify implementation of signal-processing blocks.
  • Flexible Clocking and Timing: On-platform Digital Clock Manager features support precise clock de-skew and frequency synthesis for complex timing domains.
  • High I/O Count in Compact Package: 392 user I/Os in a 676-FBGA (27×27) package enable dense connectivity while keeping board area and routing manageable.
  • Commercial Temperature Range and RoHS Compliance: Rated for 0 °C to 85 °C and RoHS compliant to support standard commercial product assemblies.

Why Choose XC2V1500-5FGG676C?

The XC2V1500-5FGG676C combines a substantial logic array, embedded RAM, and dedicated arithmetic blocks in a compact 676-BGA package, making it well suited for designers who need medium-to-high density FPGA resources with flexible I/O and robust clocking options. Its commercial-grade operating range and RoHS compliance support standard product deployments where these specifications meet project requirements.

This device is appropriate for teams implementing memory interfaces, DSP pipelines, or I/O-dense subsystems that benefit from integrated multipliers, selectRAM resources and platform-level clock management as documented in the Virtex-II datasheet.

Request a quote or submit an inquiry to receive pricing and availability for the XC2V1500-5FGG676C and to discuss how it fits your design requirements.

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