XC2V1500-6BGG575C

IC FPGA 392 I/O 575BGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 392 884736 575-BBGA

Quantity 961 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package575-BGA (31x31)GradeCommercialOperating Temperature0°C – 85°C
Package / Case575-BBGANumber of I/O392Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1920Number of Logic Elements/Cells17280
Number of Gates1500000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits884736

Overview of XC2V1500-6BGG575C – Virtex®-II FPGA, 1.5M gates, 575-BBGA

The XC2V1500-6BGG575C is a Virtex®-II field programmable gate array (FPGA) offered in a 575-ball BGA package. It combines high gate density with abundant I/O and on-chip memory to support complex digital designs that require integration of logic, memory and flexible interfacing.

Built for commercial-grade applications, this device delivers approximately 1.5 million gates, 17,280 logic elements, around 0.885 Mbits of embedded memory, and 392 user I/Os — making it suitable for designs that need significant programmable logic and on-chip RAM within a 31 × 31 mm BGA footprint.

Key Features

  • Core Logic 17,280 logic elements (cells) providing a high-density programmable fabric for complex combinational and sequential logic implementations.
  • On-Chip Memory Approximately 0.885 Mbits of embedded RAM (884,736 total bits) to support data buffering, FIFOs and local storage without external memory.
  • Connectivity / I/O 392 available user I/O pins for broad peripheral and bus interfacing needs; supplied in a standard 575-BBGA (575-BGA, 31×31 mm) package for dense board integration.
  • Arithmetic & DSP Architecture-level support includes dedicated multiplier resources and arithmetic-friendly structures (as described in the Virtex-II platform documentation) for implementing DSP and signal-processing functions.
  • Clock & Timing Management Platform-level clock management features (such as digital clock manager elements) are part of the Virtex-II family architecture to help implement precise clocking and deskew where required by the design.
  • Power & Supply Core supply voltage specified between 1.425 V and 1.575 V; surface-mount package simplifies automated assembly workflows.
  • Operating Range & Compliance Commercial operating temperature range from 0 °C to 85 °C. RoHS compliant for environmental regulatory alignment.

Typical Applications

  • High-density digital processing — Implement custom datapaths, protocol processing or hardware acceleration using the device's large logic capacity and on-chip RAM.
  • Memory-centric designs — Use the embedded RAM for buffering, packet queues or local data storage to minimize external memory dependence.
  • I/O bridging and interface control — Leverage 392 I/Os to connect multiple peripherals, parallel interfaces or board-level buses within a compact BGA package.
  • Prototyping and system integration — Suitable for development platforms that need a commercial-grade, high-capacity FPGA for functional validation and integration testing.

Unique Advantages

  • High logic density: 17,280 logic elements enable consolidation of complex functions onto a single device, reducing overall BOM and board area.
  • Substantial on-chip memory: Approximately 0.885 Mbits of embedded RAM supports large internal buffering and data handling without immediately requiring external memory.
  • Ample I/O count: 392 user I/Os provide flexibility for interfacing multiple peripherals, sensors, or external logic blocks in space-constrained designs.
  • Compact BGA package: 575-BBGA (31×31 mm) offers a balance of pin count and board footprint for dense multi-layer PCBs.
  • Design ecosystem alignment: As part of the Virtex-II platform, the device aligns with platform-level architectural features such as selectable clock management and DSP-friendly resources described in the product documentation.
  • Regulatory compatibility: RoHS compliance supports use in environments where lead-free and restricted-substance compliance is required.

Why Choose XC2V1500-6BGG575C?

The XC2V1500-6BGG575C positions itself as a commercial-grade, high-capacity FPGA for designers who need substantial programmable logic, significant embedded RAM, and broad I/O capability in a standard BGA package. It is well suited to applications that demand on-chip memory and high gate counts while maintaining a compact PCB footprint.

Choosing this part provides scalability for complex designs and leverages the Virtex-II family architecture and documentation for implementing clock management and arithmetic functions. It is targeted at engineers and teams building memory-intensive, I/O-rich digital systems who require a reliable, RoHS-compliant FPGA solution.

Request a quote or submit a product inquiry for XC2V1500-6BGG575C to receive pricing, availability, and procurement details referencing the exact part number.

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