XC2V1500-6BGG575C
| Part Description |
Virtex®-II Field Programmable Gate Array (FPGA) IC 392 884736 575-BBGA |
|---|---|
| Quantity | 961 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 575-BGA (31x31) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 575-BBGA | Number of I/O | 392 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1920 | Number of Logic Elements/Cells | 17280 | ||
| Number of Gates | 1500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 884736 |
Overview of XC2V1500-6BGG575C – Virtex®-II FPGA, 1.5M gates, 575-BBGA
The XC2V1500-6BGG575C is a Virtex®-II field programmable gate array (FPGA) offered in a 575-ball BGA package. It combines high gate density with abundant I/O and on-chip memory to support complex digital designs that require integration of logic, memory and flexible interfacing.
Built for commercial-grade applications, this device delivers approximately 1.5 million gates, 17,280 logic elements, around 0.885 Mbits of embedded memory, and 392 user I/Os — making it suitable for designs that need significant programmable logic and on-chip RAM within a 31 × 31 mm BGA footprint.
Key Features
- Core Logic 17,280 logic elements (cells) providing a high-density programmable fabric for complex combinational and sequential logic implementations.
- On-Chip Memory Approximately 0.885 Mbits of embedded RAM (884,736 total bits) to support data buffering, FIFOs and local storage without external memory.
- Connectivity / I/O 392 available user I/O pins for broad peripheral and bus interfacing needs; supplied in a standard 575-BBGA (575-BGA, 31×31 mm) package for dense board integration.
- Arithmetic & DSP Architecture-level support includes dedicated multiplier resources and arithmetic-friendly structures (as described in the Virtex-II platform documentation) for implementing DSP and signal-processing functions.
- Clock & Timing Management Platform-level clock management features (such as digital clock manager elements) are part of the Virtex-II family architecture to help implement precise clocking and deskew where required by the design.
- Power & Supply Core supply voltage specified between 1.425 V and 1.575 V; surface-mount package simplifies automated assembly workflows.
- Operating Range & Compliance Commercial operating temperature range from 0 °C to 85 °C. RoHS compliant for environmental regulatory alignment.
Typical Applications
- High-density digital processing — Implement custom datapaths, protocol processing or hardware acceleration using the device's large logic capacity and on-chip RAM.
- Memory-centric designs — Use the embedded RAM for buffering, packet queues or local data storage to minimize external memory dependence.
- I/O bridging and interface control — Leverage 392 I/Os to connect multiple peripherals, parallel interfaces or board-level buses within a compact BGA package.
- Prototyping and system integration — Suitable for development platforms that need a commercial-grade, high-capacity FPGA for functional validation and integration testing.
Unique Advantages
- High logic density: 17,280 logic elements enable consolidation of complex functions onto a single device, reducing overall BOM and board area.
- Substantial on-chip memory: Approximately 0.885 Mbits of embedded RAM supports large internal buffering and data handling without immediately requiring external memory.
- Ample I/O count: 392 user I/Os provide flexibility for interfacing multiple peripherals, sensors, or external logic blocks in space-constrained designs.
- Compact BGA package: 575-BBGA (31×31 mm) offers a balance of pin count and board footprint for dense multi-layer PCBs.
- Design ecosystem alignment: As part of the Virtex-II platform, the device aligns with platform-level architectural features such as selectable clock management and DSP-friendly resources described in the product documentation.
- Regulatory compatibility: RoHS compliance supports use in environments where lead-free and restricted-substance compliance is required.
Why Choose XC2V1500-6BGG575C?
The XC2V1500-6BGG575C positions itself as a commercial-grade, high-capacity FPGA for designers who need substantial programmable logic, significant embedded RAM, and broad I/O capability in a standard BGA package. It is well suited to applications that demand on-chip memory and high gate counts while maintaining a compact PCB footprint.
Choosing this part provides scalability for complex designs and leverages the Virtex-II family architecture and documentation for implementing clock management and arithmetic functions. It is targeted at engineers and teams building memory-intensive, I/O-rich digital systems who require a reliable, RoHS-compliant FPGA solution.
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