XC2V1500-4FGG676I

The XC2V1500-4FGG676I is a Virtex®-II Field Programmable Gate Array (FPGA) IC from AMD, offered in a 676-ball fine-pitch BGA (27 × 27) package. It delivers substantial logic capacity, embedded memory, and a high I/O count for demanding, industrial-grade digital designs.

Designed for applications that require a combination of programmable logic, on-chip RAM, and flexible I/O, this device targets system-level functions such as high-speed interfaces, DSP tasks, and custom hardware acceleration while supporting industrial operating conditions.

Key Features

• Logic Capacity  Provides 17,280 logic elements (equivalent to approximately 1,500,000 system gates), enabling complex logic implementations and system integration on a single device.
• Embedded Memory  Approximately 0.885 Mbits of on-chip RAM (884,736 total RAM bits), implemented within the Virtex-II SelectRAM memory hierarchy for efficient data storage and buffering.
• I/O and Package  392 user I/Os housed in a 676-FBGA (27×27) package; surface-mount construction supports dense board-level integration and broad connectivity options.
• Arithmetic and DSP Support  Includes dedicated 18-bit × 18-bit multiplier resources (series-level feature) to accelerate arithmetic and signal-processing operations.
• Clock Management  Series-level clocking features such as Digital Clock Manager (DCM) modules and global clock buffers support precise clock de-skew and flexible clocking schemes for synchronous designs.
• Power and Thermal  Nominal supply voltage range of 1.425 V to 1.575 V and an operating temperature range of –40 °C to 100 °C, suitable for industrial environments.
• Standards and I/O Options  Virtex-II series I/O technology supports a wide variety of single-ended and differential standards (including LVDS and LVPECL) for high-speed and mixed-signal interface designs.
• Regulatory  RoHS compliant, meeting modern lead-free assembly and environmental requirements.

Typical Applications

• High‑Performance DSP and Signal Processing  On-chip RAM and dedicated multiplier resources accelerate filtering, FFTs, and other compute-intensive signal tasks.
• Memory Interface and Bridge  Suitable for implementing DRAM/SDRAM/DDR controller logic and memory interface bridging using the device’s ample logic and I/O resources.
• High‑Speed I/O and Protocol Implementation  Large I/O count and series-level SelectIO features support multi‑lane interfaces, custom link protocols, and high‑bandwidth data paths.

Unique Advantages

• High Logic Density: 17,280 logic elements enable consolidation of multiple functions and reduce external glue logic and board complexity.
• Integrated Memory Resources: Approximately 0.885 Mbits of embedded RAM simplifies on-chip buffering and reduces external memory dependency.
• Flexible, High‑Count I/O: 392 I/Os in a 676-FBGA footprint provide broad connectivity for sensors, memory, and peripheral interfaces while maintaining a compact package.
• Industrial Temperature Range: Rated for –40 °C to 100 °C operation, making it suitable for applications that require extended temperature tolerance.
• Series-Level DSP and Clocking Features: Dedicated multiplier blocks and Digital Clock Manager capabilities support robust timing control and arithmetic acceleration where required.
• RoHS Compliance: Supports current lead‑free assembly and environmental requirements for modern production processes.

Why Choose XC2V1500-4FGG676I?

The XC2V1500-4FGG676I combines substantial programmable logic, nearly 0.9 Mbits of embedded RAM, a high I/O count, and industrial temperature capability in a compact 676-FBGA package. It is well suited to engineers and system designers who need to implement complex digital functions, memory interfaces, and high-speed I/O in environments that demand robust thermal performance.

Backed by Virtex®-II platform architecture and AMD support, the device offers a balance of integration and flexibility for mid- to high-complexity designs, helping to optimize system BOM and shorten development cycles through on-chip resources and series-level features.

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