XC2V80-4FGG256C

IC FPGA 120 I/O 256FBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 120 147456 256-BGA

Quantity 924 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O120Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs128Number of Logic Elements/Cells1152
Number of Gates80000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits147456

Overview of XC2V80-4FGG256C – Virtex®-II FPGA, 120 I/O, 256-BGA

The XC2V80-4FGG256C is a Virtex®-II Field Programmable Gate Array (FPGA) in a 256-ball fine-pitch BGA package designed for commercial-grade embedded designs. It combines configurable logic, dedicated arithmetic resources and block SelectRAM to support applications requiring on-chip memory, custom I/O signaling and hardware-accelerated processing.

With 120 user I/O pins, a compact 256-FBGA (17 × 17) surface-mount package and RoHS compliance, this device addresses designs that need flexible I/O, embedded RAM and deterministic clocking features from the Virtex-II family.

Key Features

  • Configurable Logic — 128 configurable logic blocks (CLBs) providing 1,152 logic cells for implementing custom logic and control functions.
  • Embedded Memory — Approximately 0.14 Mbits of on-chip RAM (147,456 total bits) for data buffering, state storage and local memory functions.
  • Arithmetic Resources — Series-level Virtex-II architecture includes dedicated 18-bit × 18-bit multiplier blocks for efficient arithmetic operations and DSP acceleration.
  • I/O and Interface Flexibility — 120 available I/O pins in a fine-pitch 256-BGA package with SelectIO™-style capabilities and series-level support for multiple signaling standards and Digitally Controlled Impedance (DCI) I/O.
  • Clocking and Timing — Supports Digital Clock Manager (DCM) functionality and global clock buffers as defined by the Virtex-II family for precise clock management and phase control.
  • Package and Mounting — 256-FBGA (17 × 17) surface-mount package, optimized for compact board layouts and automated assembly.
  • Power and Thermal — Core supply range 1.425 V to 1.575 V; commercial operating temperature 0 °C to 85 °C.
  • Regulatory — RoHS compliant for lead-free assembly processes.

Typical Applications

  • Memory interface controllers — Implements custom SDR/DDR or SRAM interface logic using on-chip RAM and series-level high-performance memory interface features.
  • High-speed I/O bridging — Acts as a protocol translator or glue logic between diverse I/O standards using programmable I/O and DCI capabilities.
  • DSP acceleration — Offloads arithmetic-intensive tasks using the device’s dedicated multiplier blocks and embedded RAM for interim data storage.
  • Custom control and glue logic — Replaces discrete logic in embedded systems with a compact, reprogrammable solution leveraging the CLBs and logic cells.

Unique Advantages

  • Configurable compute and memory in one device: Combines logic cells and approximately 0.14 Mbits of embedded RAM to consolidate functions and reduce external memory needs.
  • Dedicated arithmetic blocks: On-chip 18-bit × 18-bit multipliers enable efficient implementation of DSP and signal-processing tasks without external accelerators.
  • Flexible I/O in a compact package: 120 I/O pins in a 256-FBGA (17 × 17) enable dense board integration while preserving diverse signaling options.
  • Deterministic clock management: Support for Digital Clock Manager features from the Virtex-II family simplifies phase and frequency control for synchronous systems.
  • Commercial-grade, RoHS-compliant: Rated for 0 °C to 85 °C operation and compliant with RoHS for lead-free production environments.

Why Choose XC2V80-4FGG256C?

The XC2V80-4FGG256C delivers a practical combination of configurable logic, embedded RAM and dedicated arithmetic resources within a compact 256-FBGA footprint. It is suited to engineers who need programmable hardware for memory interfaces, high-speed I/O adaptation and DSP acceleration while maintaining a small board area and RoHS-compliant assembly.

As a member of the Virtex-II family, this device brings series-level clock management and I/O features into a commercial-grade FPGA ideal for mid-density programmable logic tasks. Its electrical and thermal specifications provide a clear basis for system-level power and thermal planning.

Request a quote or contact our sales team to check availability and pricing for the XC2V80-4FGG256C and to discuss how it fits your design requirements.

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