XC2V80-4FGG256I
| Part Description |
Virtex®-II Field Programmable Gate Array (FPGA) IC 120 147456 256-BGA |
|---|---|
| Quantity | 258 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 120 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 128 | Number of Logic Elements/Cells | 1152 | ||
| Number of Gates | 80000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 147456 |
Overview of XC2V80-4FGG256I – Virtex®-II Field Programmable Gate Array, 120 I/O, ~147,456‑bit RAM, 256‑BGA
The XC2V80-4FGG256I is an industrial‑grade Virtex®-II field programmable gate array (FPGA) in a 256‑ball fine‑pitch BGA package. It delivers a compact, reconfigurable logic fabric with 1,152 logic elements, approximately 147,456 bits of embedded RAM, and 120 user I/O pins for medium‑density embedded designs.
Designed for industrial applications, the device combines on‑chip memory and a high I/O count with a narrow core supply range (1.425 V to 1.575 V) and an extended operating temperature range (−40 °C to 100 °C) to support robust deployment in demanding environments.
Key Features
- Logic Capacity 1,152 logic elements and approximately 80,000 gates provide medium-density programmable logic for custom digital functions and glue logic.
- Embedded Memory Approximately 147,456 bits of on‑chip RAM for data buffering, FIFOs, and small lookup tables.
- I/O Resources 120 user I/O pins delivered in a fine‑pitch 256‑BGA footprint for flexible external interfacing and board routing.
- Power Supply Specified core voltage range of 1.425 V to 1.575 V for predictable power design and supply planning.
- Package & Mounting 256‑FBGA (17×17) package, surface‑mount assembly compatible with standard PCB processes for compact board integration.
- Industrial Temperature Grade Rated for −40 °C to 100 °C operation to meet industrial environmental requirements.
- Compliance RoHS‑compliant manufacturing to support regulatory and environmental goals.
- Virtex‑II Platform Features Series features documented in the Virtex‑II datasheet include SelectRAM memory hierarchy, dedicated 18‑bit × 18‑bit multiplier blocks, Digital Clock Manager (DCM) and global clock management resources, and digitally controlled impedance (DCI) I/O options—enabling advanced clocking, arithmetic, and I/O termination techniques across the platform.
Typical Applications
- Industrial Control Implements deterministic logic, custom interfaces and local data buffering within factory automation, motor control and machine I/O modules.
- Embedded Systems Serves as a reconfigurable glue‑logic or co‑processor for mid‑range embedded platforms requiring on‑chip RAM and flexible I/O routing.
- Communications Equipment Handles protocol adaptation, framing, and medium‑speed I/O aggregation where 120 user I/Os and on‑chip memory enable compact implementations.
- Instrumentation & Test Provides custom signal conditioning, control logic and data buffering in test fixtures and measurement instruments operating across extended temperatures.
Unique Advantages
- Balanced Logic and Memory: 1,152 logic elements paired with ~147,456 bits of embedded RAM allows implementation of control logic alongside local data storage without external memory dependency.
- Compact, High‑I/O Package: 256‑FBGA (17×17) package gives a high I/O count (120 pins) in a small footprint for space‑constrained PCBs.
- Industrial Reliability: Rated for −40 °C to 100 °C operation and supplied as an industrial grade part for deployments that require wider thermal tolerance.
- Predictable Power Envelope: Defined core voltage range (1.425 V–1.575 V) simplifies power‑supply design and system integration.
- Platform Capabilities: Built on the Virtex‑II platform with features such as SelectRAM memory hierarchy, dedicated multipliers and clock management resources to support a range of digital signal and control tasks.
- RoHS‑Compliant: Meets RoHS requirements for environmentally conscious product designs.
Why Choose XC2V80-4FGG256I?
The XC2V80-4FGG256I positions itself as a compact, industrial‑grade FPGA that balances programmable logic, embedded memory and a healthy I/O count for mid‑range embedded and industrial applications. Its fine‑pitch 256‑BGA package enables dense board layouts while the specified supply and temperature ranges support reliable operation in controlled industrial environments.
Engineers building communication interfaces, machine control electronics, instrumentation or embedded processing modules will find the XC2V80-4FGG256I suitable when moderate logic density, local RAM and flexible I/O are required alongside platform‑level features documented for the Virtex‑II family.
Request a quote or submit an inquiry to purchase the XC2V80-4FGG256I and discuss availability and volume pricing for your project.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








