XC2V80-5FGG256I

IC FPGA 120 I/O 256FBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 120 147456 256-BGA

Quantity 1,341 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-BGANumber of I/O120Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs128Number of Logic Elements/Cells1152
Number of Gates80000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits147456

Overview of XC2V80-5FGG256I – Virtex®-II Field Programmable Gate Array (FPGA) IC, 120 I/O, ~0.147 Mbit RAM, 256-BGA

The XC2V80-5FGG256I is a Virtex®-II series Field Programmable Gate Array (FPGA) in a 256-ball BGA package designed for industrial-grade embedded applications. It combines programmable logic, on-chip memory, and flexible I/O in a surface-mount 256-FBGA (17×17) package to support custom digital functions in systems that require a rugged operating range and defined supply requirements.

This device is suited to designs that need a balance of logic capacity, embedded RAM, and a substantial I/O count—delivering 1152 logic elements, approximately 0.147 Mbits of embedded memory, and 120 user I/Os within an industrial temperature range.

Key Features

  • Core Logic 1152 logic elements and 128 CLBs providing up to 80,000 equivalent gates for custom digital logic implementations.
  • Embedded Memory Approximately 0.147 Mbits of on-chip RAM (147,456 total bits) for data buffering, state storage, and small memory structures.
  • I/O and Interfaces 120 user I/Os to support parallel and serial interfaces and external device communication in mixed-signal systems.
  • DSP and Arithmetic Resources Series-level support includes dedicated 18-bit × 18-bit multiplier blocks for arithmetic and signal-processing functions (as described in the Virtex-II series documentation).
  • Clock Management Series features include Digital Clock Manager (DCM) modules for precise clock de-skew and frequency synthesis (see Virtex-II series documentation for details).
  • Power Supply Specified core voltage range of 1.425 V to 1.575 V for predictable power design and supply budgeting.
  • Package & Mounting Surface-mount 256-BGA (supplier device package: 256-FBGA, 17×17) for compact board-level integration.
  • Operating Range & Grade Industrial grade operation from −40 °C to 100 °C suitable for a wide range of industrial applications.
  • Environmental Compliance RoHS compliant.

Typical Applications

  • Industrial Control Custom logic, sequencing, and I/O aggregation in industrial automation and machine control systems operating across −40 °C to 100 °C.
  • Memory Interface and Buffering Implementing DRAM/SDRAM controllers, buffering, and glue logic using the device’s embedded RAM and I/O resources (aligned with Virtex-II series memory interface capabilities).
  • Signal Processing and Arithmetic Acceleration Small-scale DSP tasks leveraging dedicated multiplier resources for tasks such as filtering, data aggregation, or protocol processing.
  • Custom Embedded Logic Control, glue logic, and protocol conversion for industrial communications and mixed-signal systems where a programmable solution reduces PCB complexity.

Unique Advantages

  • Balanced logic and memory: Combines 1152 logic elements with approximately 0.147 Mbits of embedded RAM to implement both control and small data-path functions on a single device.
  • Significant I/O count: 120 user I/Os enable flexible interfacing to peripherals, sensors, and memory devices without external multiplexing.
  • Industrial temperature rating: Rated for −40 °C to 100 °C, making the device suitable for harsh and factory-floor environments.
  • Compact, surface-mount package: 256-FBGA (17×17) delivers a high-density footprint for space-constrained PCB designs.
  • Defined supply envelope: Core voltage specified at 1.425 V to 1.575 V simplifies power-supply design and ensures reliable operation within the stated range.
  • Regulatory readiness: RoHS compliance supports integration into lead-free manufacturing flows.

Why Choose XC2V80-5FGG256I?

The XC2V80-5FGG256I offers a pragmatic combination of programmable logic, embedded RAM, and high I/O count in a compact 256-BGA package tailored for industrial applications. Its defined voltage and temperature specifications provide deterministic hardware behavior for embedded systems, while the device’s logic and memory resources support a wide variety of custom digital tasks.

This part is a suitable choice for engineering teams needing a durable, programmable solution for control, interface, and modest signal-processing functions where on-chip memory, dedicated arithmetic blocks, and a robust I/O complement reduce BOM complexity and streamline board design.

Request a quote or submit a request for pricing for the XC2V80-5FGG256I to evaluate fit for your next industrial or embedded design.

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