XC2V80-5FGG256I
| Part Description |
Virtex®-II Field Programmable Gate Array (FPGA) IC 120 147456 256-BGA |
|---|---|
| Quantity | 1,341 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 120 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 128 | Number of Logic Elements/Cells | 1152 | ||
| Number of Gates | 80000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 147456 |
Overview of XC2V80-5FGG256I – Virtex®-II Field Programmable Gate Array (FPGA) IC, 120 I/O, ~0.147 Mbit RAM, 256-BGA
The XC2V80-5FGG256I is a Virtex®-II series Field Programmable Gate Array (FPGA) in a 256-ball BGA package designed for industrial-grade embedded applications. It combines programmable logic, on-chip memory, and flexible I/O in a surface-mount 256-FBGA (17×17) package to support custom digital functions in systems that require a rugged operating range and defined supply requirements.
This device is suited to designs that need a balance of logic capacity, embedded RAM, and a substantial I/O count—delivering 1152 logic elements, approximately 0.147 Mbits of embedded memory, and 120 user I/Os within an industrial temperature range.
Key Features
- Core Logic 1152 logic elements and 128 CLBs providing up to 80,000 equivalent gates for custom digital logic implementations.
- Embedded Memory Approximately 0.147 Mbits of on-chip RAM (147,456 total bits) for data buffering, state storage, and small memory structures.
- I/O and Interfaces 120 user I/Os to support parallel and serial interfaces and external device communication in mixed-signal systems.
- DSP and Arithmetic Resources Series-level support includes dedicated 18-bit × 18-bit multiplier blocks for arithmetic and signal-processing functions (as described in the Virtex-II series documentation).
- Clock Management Series features include Digital Clock Manager (DCM) modules for precise clock de-skew and frequency synthesis (see Virtex-II series documentation for details).
- Power Supply Specified core voltage range of 1.425 V to 1.575 V for predictable power design and supply budgeting.
- Package & Mounting Surface-mount 256-BGA (supplier device package: 256-FBGA, 17×17) for compact board-level integration.
- Operating Range & Grade Industrial grade operation from −40 °C to 100 °C suitable for a wide range of industrial applications.
- Environmental Compliance RoHS compliant.
Typical Applications
- Industrial Control Custom logic, sequencing, and I/O aggregation in industrial automation and machine control systems operating across −40 °C to 100 °C.
- Memory Interface and Buffering Implementing DRAM/SDRAM controllers, buffering, and glue logic using the device’s embedded RAM and I/O resources (aligned with Virtex-II series memory interface capabilities).
- Signal Processing and Arithmetic Acceleration Small-scale DSP tasks leveraging dedicated multiplier resources for tasks such as filtering, data aggregation, or protocol processing.
- Custom Embedded Logic Control, glue logic, and protocol conversion for industrial communications and mixed-signal systems where a programmable solution reduces PCB complexity.
Unique Advantages
- Balanced logic and memory: Combines 1152 logic elements with approximately 0.147 Mbits of embedded RAM to implement both control and small data-path functions on a single device.
- Significant I/O count: 120 user I/Os enable flexible interfacing to peripherals, sensors, and memory devices without external multiplexing.
- Industrial temperature rating: Rated for −40 °C to 100 °C, making the device suitable for harsh and factory-floor environments.
- Compact, surface-mount package: 256-FBGA (17×17) delivers a high-density footprint for space-constrained PCB designs.
- Defined supply envelope: Core voltage specified at 1.425 V to 1.575 V simplifies power-supply design and ensures reliable operation within the stated range.
- Regulatory readiness: RoHS compliance supports integration into lead-free manufacturing flows.
Why Choose XC2V80-5FGG256I?
The XC2V80-5FGG256I offers a pragmatic combination of programmable logic, embedded RAM, and high I/O count in a compact 256-BGA package tailored for industrial applications. Its defined voltage and temperature specifications provide deterministic hardware behavior for embedded systems, while the device’s logic and memory resources support a wide variety of custom digital tasks.
This part is a suitable choice for engineering teams needing a durable, programmable solution for control, interface, and modest signal-processing functions where on-chip memory, dedicated arithmetic blocks, and a robust I/O complement reduce BOM complexity and streamline board design.
Request a quote or submit a request for pricing for the XC2V80-5FGG256I to evaluate fit for your next industrial or embedded design.

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Certifications and Memberships: ISO9001:2015, RoHS, REACH








