XC2V8000-4FF1517I
| Part Description |
Virtex®-II Field Programmable Gate Array (FPGA) IC 1108 3096576 1517-BBGA, FCBGA |
|---|---|
| Quantity | 883 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FCBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 1108 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 11648 | Number of Logic Elements/Cells | 104832 | ||
| Number of Gates | 8000000 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3096576 |
Overview of XC2V8000-4FF1517I – Virtex®-II FPGA, 1517-FCBGA, Industrial
The XC2V8000-4FF1517I is a Virtex®-II Field Programmable Gate Array (FPGA) in a 1517‑FCBGA package, designed for applications requiring high logic capacity, abundant I/O and significant on-chip RAM. Built on the Virtex-II platform architecture, this device combines approximately 104,832 logic elements with extensive embedded memory and a large I/O complement to support complex digital systems.
Targeted at industrial-grade designs, the device offers features for high-performance interfaces, arithmetic acceleration and flexible clock management while operating across a wide industrial temperature range.
Key Features
- Logic Capacity Approximately 104,832 logic elements and 11,648 CLB resources providing the programmable fabric for large, complex designs.
- On‑chip Memory Approximately 3.1 Mbits of embedded memory (total RAM bits: 3,096,576) implemented in 18-Kb SelectRAM blocks for data buffering and local storage.
- Arithmetic Resources Dedicated 18‑bit × 18‑bit multiplier blocks and fast carry logic for hardware-accelerated DSP and arithmetic functions.
- I/O Density and Flexibility Up to 1,108 user I/Os supporting multiple signaling modes and programmable sink currents; suitable for high-bandwidth external interfaces and board-level integration.
- Clock and Timing On-chip clock management including up to 12 Digital Clock Manager (DCM) modules and 16 global clock multiplexer buffers for clock de-skew, phase shifting and flexible frequency synthesis.
- Performance Indicators Platform-level performance notes include up to a 420 MHz internal clock speed (Advance Data) and support for high-speed I/O signaling modes.
- Package and Thermal 1517‑FCBGA (40×40) package; industrial operating temperature range from −40 °C to 100 °C.
- Power Supply Core voltage supply specified between 1.425 V and 1.575 V.
- Toolchain Support Supported by the Xilinx Foundation and Alliance Series development systems for VHDL/Verilog design flows and large design compilation.
- RoHS Compliance Device is RoHS compliant.
Typical Applications
- High‑Performance Memory Interfaces Use the device’s abundant I/O and embedded RAM to create SDR/DDR and other high-speed memory controllers and bridges.
- Signal Processing & DSP Leverage dedicated multipliers and on‑chip memory for filtering, transforms and other compute-intensive signal processing tasks.
- Protocol Bridging & Interface Aggregation High I/O count and flexible signaling make this FPGA suitable for consolidating multiple board-level interfaces and protocol translation.
- System Prototyping and Integration Large logic capacity and robust toolchain support facilitate complex system prototyping and integration in industrial designs.
Unique Advantages
- Highly integrated programmable fabric: Large logic element count and CLB resources reduce external component count and simplify system partitioning.
- Substantial embedded memory: Approximately 3.1 Mbits of on‑chip RAM enable local data buffering and reduce latency to external memory.
- Extensive I/O capability: Up to 1,108 user I/Os with programmable drive and multiple signaling standards provide flexible board-level connectivity.
- Advanced clock management: Multiple DCMs and global clock buffers allow precise clock control for timing-critical designs.
- Industrial temperature rating: Specified operation from −40 °C to 100 °C suitable for industrial environments.
- Established development support: Compatibility with Xilinx Foundation and Alliance design tools helps accelerate development and verification.
Why Choose XC2V8000-4FF1517I?
The XC2V8000-4FF1517I positions itself as a high-capacity Virtex‑II FPGA for industrial applications that demand a combination of large programmable logic, significant embedded memory and a high-density I/O interface. Its dedicated arithmetic blocks, clock management resources and broad toolchain support make it suitable for designs that require on‑chip acceleration, complex interfacing and reliable operation across a wide temperature range.
This device is well suited for engineering teams implementing memory-intensive controllers, DSP acceleration or multi-protocol interface aggregation who require proven platform capabilities and development ecosystem support.
Request a quote or submit a request for availability to receive pricing and lead-time information for the XC2V8000-4FF1517I.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








