XC2V8000-4FF1517I

IC FPGA 1108 I/O 1517FCBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 1108 3096576 1517-BBGA, FCBGA

Quantity 883 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FCBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O1108Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs11648Number of Logic Elements/Cells104832
Number of Gates8000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3096576

Overview of XC2V8000-4FF1517I – Virtex®-II FPGA, 1517-FCBGA, Industrial

The XC2V8000-4FF1517I is a Virtex®-II Field Programmable Gate Array (FPGA) in a 1517‑FCBGA package, designed for applications requiring high logic capacity, abundant I/O and significant on-chip RAM. Built on the Virtex-II platform architecture, this device combines approximately 104,832 logic elements with extensive embedded memory and a large I/O complement to support complex digital systems.

Targeted at industrial-grade designs, the device offers features for high-performance interfaces, arithmetic acceleration and flexible clock management while operating across a wide industrial temperature range.

Key Features

  • Logic Capacity Approximately 104,832 logic elements and 11,648 CLB resources providing the programmable fabric for large, complex designs.
  • On‑chip Memory Approximately 3.1 Mbits of embedded memory (total RAM bits: 3,096,576) implemented in 18-Kb SelectRAM blocks for data buffering and local storage.
  • Arithmetic Resources Dedicated 18‑bit × 18‑bit multiplier blocks and fast carry logic for hardware-accelerated DSP and arithmetic functions.
  • I/O Density and Flexibility Up to 1,108 user I/Os supporting multiple signaling modes and programmable sink currents; suitable for high-bandwidth external interfaces and board-level integration.
  • Clock and Timing On-chip clock management including up to 12 Digital Clock Manager (DCM) modules and 16 global clock multiplexer buffers for clock de-skew, phase shifting and flexible frequency synthesis.
  • Performance Indicators Platform-level performance notes include up to a 420 MHz internal clock speed (Advance Data) and support for high-speed I/O signaling modes.
  • Package and Thermal 1517‑FCBGA (40×40) package; industrial operating temperature range from −40 °C to 100 °C.
  • Power Supply Core voltage supply specified between 1.425 V and 1.575 V.
  • Toolchain Support Supported by the Xilinx Foundation and Alliance Series development systems for VHDL/Verilog design flows and large design compilation.
  • RoHS Compliance Device is RoHS compliant.

Typical Applications

  • High‑Performance Memory Interfaces Use the device’s abundant I/O and embedded RAM to create SDR/DDR and other high-speed memory controllers and bridges.
  • Signal Processing & DSP Leverage dedicated multipliers and on‑chip memory for filtering, transforms and other compute-intensive signal processing tasks.
  • Protocol Bridging & Interface Aggregation High I/O count and flexible signaling make this FPGA suitable for consolidating multiple board-level interfaces and protocol translation.
  • System Prototyping and Integration Large logic capacity and robust toolchain support facilitate complex system prototyping and integration in industrial designs.

Unique Advantages

  • Highly integrated programmable fabric: Large logic element count and CLB resources reduce external component count and simplify system partitioning.
  • Substantial embedded memory: Approximately 3.1 Mbits of on‑chip RAM enable local data buffering and reduce latency to external memory.
  • Extensive I/O capability: Up to 1,108 user I/Os with programmable drive and multiple signaling standards provide flexible board-level connectivity.
  • Advanced clock management: Multiple DCMs and global clock buffers allow precise clock control for timing-critical designs.
  • Industrial temperature rating: Specified operation from −40 °C to 100 °C suitable for industrial environments.
  • Established development support: Compatibility with Xilinx Foundation and Alliance design tools helps accelerate development and verification.

Why Choose XC2V8000-4FF1517I?

The XC2V8000-4FF1517I positions itself as a high-capacity Virtex‑II FPGA for industrial applications that demand a combination of large programmable logic, significant embedded memory and a high-density I/O interface. Its dedicated arithmetic blocks, clock management resources and broad toolchain support make it suitable for designs that require on‑chip acceleration, complex interfacing and reliable operation across a wide temperature range.

This device is well suited for engineering teams implementing memory-intensive controllers, DSP acceleration or multi-protocol interface aggregation who require proven platform capabilities and development ecosystem support.

Request a quote or submit a request for availability to receive pricing and lead-time information for the XC2V8000-4FF1517I.

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