XC2V8000-4FFG1517I

The XC2V8000-4FFG1517I is a Virtex®-II field programmable gate array (FPGA) offered in a 1517-FCBGA package. It delivers high integration for complex digital designs with an architecture optimized for large logic density, memory, and high I/O counts.

This industrial-grade device targets high-performance embedded and system applications that require significant on-chip logic, abundant embedded memory, and broad interface flexibility while operating across a wide voltage and temperature range.

Key Features

• Core Density — 8,000,000 system gates with 104,832 logic elements (cells) and 11,648 configurable logic blocks (CLBs) for high-density logic implementations.
• Embedded Memory — Approximately 3.10 Mbits of on-chip RAM across 18-Kb block SelectRAM resources for data buffering, FIFOs, and local storage.
• Arithmetic Resources — Dedicated 18-bit × 18-bit multiplier blocks to accelerate DSP and arithmetic-intensive functions.
• I/O Capability — Up to 1,108 user I/Os supporting multiple single-ended and differential signaling standards for broad external interface support.
• Clock & Timing — Series-level Digital Clock Manager (DCM) and global clock resources to support precise clock de-skew, frequency synthesis, and phase shifting (as described in series documentation).
• Packaging & Mounting — 1517-FCBGA (40×40) flip-chip BGA package, surface-mount mounting for compact board integration.
• Power & Temperature — Core supply range 1.425 V to 1.575 V and operating temperature range from −40 °C to 100 °C suitable for industrial environments.
• Compliance — RoHS compliant.

Typical Applications

• High‑Performance Interface Controllers — Use the large I/O count and flexible I/O standards to implement multi-channel memory and peripheral interfaces.
• Signal Processing and DSP — Leverage embedded multipliers and abundant logic elements for filtering, transforms, and real‑time data processing pipelines.
• Memory Subsystem Bridging — Serve as a configurable bridge for SDR/DDR and other external memory interfaces, utilizing on-chip RAM for buffering and control logic.
• Complex System Integration — Integrate multiple custom control and protocol blocks in a single FPGA to reduce board-level BOM and simplify system architecture.

Unique Advantages

• Highly Integrated Logic and Memory: Combines 104,832 logic elements with approximately 3.10 Mbits of embedded RAM to implement large, self-contained subsystems on chip.
• Extensive I/O Resources: Up to 1,108 user I/Os enable dense external connectivity and flexible signaling choices for heterogeneous system interfaces.
• Dedicated DSP Primitives: Built-in 18×18 multipliers reduce the need for external DSP devices and accelerate arithmetic-heavy functions.
• Industrial Temperature Range: Rated for −40 °C to 100 °C operation, supporting deployment in demanding environmental conditions.
• Industry‑standard BGA Packaging: 1517-FCBGA (40×40) package provides high pin density and robust mounting for compact, manufacturable designs.
• Standards‑focused I/O: Series-level I/O support includes multiple single-ended and differential standards to simplify system integration.

Why Choose XC2V8000-4FFG1517I?

The XC2V8000-4FFG1517I positions itself as a high‑density, industrial-grade FPGA choice for designs that demand substantial on‑chip logic, embedded memory, and extensive I/O resources. Its combination of 8M system gates, dedicated multiplier blocks, and a large CLB count enables consolidation of complex digital subsystems into a single programmable device.

This part is suited to engineering teams building high‑performance interface controllers, DSP engines, and compact system solutions where board-level integration, scalability, and reliability across a wide temperature range are key considerations.

Request a quote or submit an RFQ to receive pricing, availability, and lead-time information for the XC2V8000-4FFG1517I. Our team will respond with the details you need to move your design forward.