XC2V8000-5FF1152I

IC FPGA 824 I/O 1152FCBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 824 3096576 1152-BBGA, FCBGA

Quantity 599 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O824Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs11648Number of Logic Elements/Cells104832
Number of Gates8000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3096576

Overview of XC2V8000-5FF1152I – Virtex®-II Field Programmable Gate Array (FPGA), 1152-FCBGA

The XC2V8000-5FF1152I is an industrial-grade Virtex®-II platform FPGA in a 1152-FCBGA surface-mount package. It delivers high-density programmable logic with a combination of abundant logic elements, embedded memory, dedicated multiplier resources and extensive I/O to support complex, high-performance embedded and communications designs.

Architected for demanding applications that require large gate counts, flexible memory hierarchy and advanced I/O signaling, this device provides the series-level Virtex-II capabilities such as SelectRAM memory resources, dedicated multipliers and Digital Clock Manager support while offering industrial temperature range and RoHS compliance.

Key Features

  • Core Capacity  Provides 8,000,000 system gates with 11,648 CLBs and 104,832 logic elements to implement large, feature-rich FPGA designs.
  • Embedded Memory  Approximately 3.1 Mbits of on-chip RAM (Total Ram Bits: 3,096,576) organized in SelectRAM-style block resources for dual-port and distributed memory needs.
  • High-Performance I/O  Provides 824 user I/O pins. Supports Virtex-II SelectIO features and digitally controlled impedance (DCI) plus a range of high-speed signaling options described in the Virtex-II platform specification.
  • Arithmetic & DSP  Includes dedicated 18-bit × 18-bit multiplier blocks and fast carry logic chains for arithmetic-intensive and DSP applications.
  • Clock Management  Built on the Virtex-II platform clocking architecture with Digital Clock Manager (DCM) support and multiple global clock multiplexer buffers for flexible, low-skew clock distribution.
  • Package & Mounting  1152-FCBGA package (35 × 35 mm), surface-mount mounting type, optimized for high-density PCB layouts.
  • Power & Thermal  Nominal core voltage range 1.425 V to 1.575 V; industrial operating temperature range −40 °C to 100 °C.
  • Compliance  RoHS compliant and specified as industrial grade for wider operating-temperature applications.

Typical Applications

  • Memory Interface Controllers  High-performance DRAM and SRAM interface designs benefit from the device’s SelectRAM architecture and series-level memory interface capabilities.
  • Signal Processing / DSP Acceleration  Dedicated multiplier blocks and embedded RAM make the device suitable for arithmetic-intensive signal processing and filtering tasks.
  • High-Speed I/O and Protocol Bridging  Extensive I/O and SelectIO technology enable implementation of high-bandwidth serial and parallel interfaces for communications and data transport.
  • Complex System Integration  Large logic capacity and rich routing support integration of multiple functions (control, data path, interfaces) into a single FPGA for compact system designs.

Unique Advantages

  • High Logic Density: Enables large, feature-dense designs with 8M system gates and over 104k logic elements, reducing the need for multiple devices.
  • Substantial Embedded Memory: Approximately 3.1 Mbits of on-chip RAM supports large buffers, FIFOs and scratch memory without external RAM.
  • Extensive I/O Support: 824 I/Os combined with Virtex-II SelectIO features provide flexible signaling choices for diverse interface requirements.
  • Dedicated DSP Resources: 18×18 multipliers and fast carry chains accelerate arithmetic and DSP functions while simplifying HDL implementation.
  • Industrial Robustness: Specified for −40 °C to 100 °C operation and RoHS compliance for reliable deployment in industrial environments.
  • Dense, Serviceable Package: 1152-FCBGA (35 × 35 mm) flip-chip package supports compact, high-density PCB designs.

Why Choose XC2V8000-5FF1152I?

The XC2V8000-5FF1152I positions itself as a high-capacity, industrial-grade Virtex®-II FPGA for designs that demand substantial logic, embedded memory and advanced I/O in a single device. Its combination of 8M system gates, roughly 3.1 Mbits of on-chip RAM, dedicated multiplier blocks and robust clocking resources makes it appropriate for complex embedded, communications and DSP-centered systems.

Backed by the Virtex-II platform documentation and development ecosystem described in the product specification, this device supports a design flow that scales from system prototyping to production deployments, offering predictable performance, broad interface support and industrial temperature operation for long-term value in engineered systems.

Request a quote or submit an inquiry to check availability, lead time and pricing for the XC2V8000-5FF1152I. Our team can provide technical and procurement details to support your design and purchase decisions.

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