XC2V8000-5FFG1517C

IC FPGA 1108 I/O 1517FCBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 1108 3096576 1517-BBGA, FCBGA

Quantity 588 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FCBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O1108Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs11648Number of Logic Elements/Cells104832
Number of Gates8000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3096576

Overview of XC2V8000-5FFG1517C – Virtex®-II Field Programmable Gate Array (FPGA) IC 1108 3096576 1517-BBGA, FCBGA

The XC2V8000-5FFG1517C is a high-density Virtex®-II FPGA offered in a 1517-FCBGA (40×40) package for surface-mount assemblies. It combines a large logic fabric, substantial on-chip RAM and a very high I/O count to address complex digital designs that require extensive connectivity and embedded memory.

Targeted at commercial applications, this device delivers up to 8,000,000 system gates, approximately 3.1 Mbits of embedded memory, and 1,108 user I/Os, providing a platform for high-performance interfaces, complex logic implementations, and dense system integration.

Key Features

  • Logic Capacity — 104,832 logic elements (cells) and an 8,000,000-gate equivalent enable large-scale combinational and sequential logic implementations.
  • Embedded Memory — Approximately 3.1 Mbits of on-chip RAM (3,096,576 total RAM bits) suitable for buffers, FIFOs and local data storage.
  • High I/O Count — 1,108 user I/Os provide extensive external connectivity for parallel buses, memory interfaces and high-pin-count peripherals.
  • Dedicated Arithmetic Resources — On-chip 18-bit × 18-bit multiplier blocks support wide arithmetic and DSP-style operations.
  • Clock Management — Integrated clock management features including multiple clock multiplexer buffers and Digital Clock Manager (DCM) capabilities for precise clocking and de-skew (series-level features referenced in documentation).
  • SelectIO and Signaling — Support for a broad set of I/O standards, programmable sink currents and on-chip termination (DCI) to simplify interfacing with varied signaling standards; supports high-speed differential I/O modes.
  • Package & Mounting — 1517-BBGA (1517-FCBGA, 40×40) package, surface-mount mounting type, suitable for dense board-level integration.
  • Power & Temperature — Voltage supply range: 1.425 V to 1.575 V. Commercial operating temperature range: 0 °C to 85 °C.
  • Compliance — RoHS compliant.

Typical Applications

  • High-performance memory interfaces — Use the device’s I/O density and embedded RAM to implement SDR/DDR memory controllers, wide buses and buffering for external DRAM/SRAM subsystems.
  • Data acquisition and signal processing — Leverage the large logic capacity and dedicated multiplier blocks for real-time processing pipelines, DSP functions and aggregation of high-rate data streams.
  • High-speed communications — The extensive I/O resources and differential signaling support enable implementation of bus interfaces, link aggregation and protocol bridging.
  • Complex digital control — Implement large state machines, parallel processing engines and system control logic where on-chip memory and high I/O count reduce external component count.

Unique Advantages

  • High-density programmable logic: 104,832 logic elements and 8M-system-gate equivalence let you consolidate complex functionality into a single device, reducing system BOM.
  • Substantial embedded memory: Approximately 3.1 Mbits of on-chip RAM supports deep buffering and local storage, lowering latency and external memory dependence.
  • Extensive I/O flexibility: 1,108 user I/Os and series-level SelectIO features provide the signaling options and drive strength control needed for varied external interfaces.
  • Integrated arithmetic and timing resources: Dedicated multipliers and clock-management features simplify implementation of DSP and timing-critical logic without added IP blocks.
  • Commercial-grade robustness: Rated for 0 °C to 85 °C operation and RoHS compliant, suitable for mainstream commercial product designs.

Why Choose XC2V8000-5FFG1517C?

The XC2V8000-5FFG1517C is positioned for designers who need a high-capacity, highly connected FPGA for demanding commercial applications. Its combination of more than 100k logic elements, multi-megabit on-chip RAM and over a thousand I/Os delivers the integration and flexibility required to consolidate complex subsystems and high-speed interfaces into a single package.

For teams focused on scalable, high-density digital designs—such as memory interface controllers, data-path processing and communication bridging—the XC2V8000-5FFG1517C offers a balance of logic, memory and I/O resources backed by documented platform features for clock management and arithmetic acceleration.

Request a quote or submit a purchase inquiry to check current availability and pricing for the XC2V8000-5FFG1517C.

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