XC2V8000-5FF1517I
| Part Description |
Virtex®-II Field Programmable Gate Array (FPGA) IC 1108 3096576 1517-BBGA, FCBGA |
|---|---|
| Quantity | 399 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FCBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 1108 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 11648 | Number of Logic Elements/Cells | 104832 | ||
| Number of Gates | 8000000 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3096576 |
Overview of XC2V8000-5FF1517I – Virtex®-II FPGA, Industrial 1517-FCBGA
The XC2V8000-5FF1517I is a Virtex®-II field programmable gate array (FPGA) IC manufactured by AMD. It delivers a high-density, flexible programmable logic platform suitable for designs requiring large logic capacity, extensive I/O, and substantial on-chip memory.
Built on the Virtex-II platform architecture, this device targets applications that need deep embedded memory, dedicated arithmetic resources, and configurable high-speed I/O, while supporting industrial temperature operation and surface-mount 1517-FCBGA packaging.
Key Features
- Core Logic Approximately 104,832 logic elements and 8,000,000 system gates for integrating complex digital logic and state machines.
- Embedded Memory Approximately 3.1 Mbits of on-chip RAM (3,096,576 total RAM bits), implemented with 18-Kb block SelectRAM resources for dual-port memory and distributed RAM needs.
- High‑Performance I/O Up to 1,108 user I/Os supported by SelectIO™-Ultra technology, enabling a wide range of single-ended and differential signaling options and programmable drive strength.
- Dedicated Arithmetic Resources Built-in 18-bit × 18-bit multiplier blocks to accelerate DSP and arithmetic-intensive functions.
- Clock Management Virtex-II platform clock-management features such as Digital Clock Manager (DCM) modules and global clock multiplexer buffers for precise clocking and de-skewing.
- Package and Mounting 1517-FCBGA (40×40) supplier device package / 1517-BBGA package case, surface-mount mounting type for compact system integration.
- Power and Temperature Core supply voltage range 1.425 V to 1.575 V and industrial operating temperature from −40 °C to 100 °C.
- Standards and Interfaces Platform-level support for high-performance external memory interfaces (SDR/DDR SDRAM, FCRAM, reduced-latency DRAM) and SRAM interfaces as described in the Virtex-II specification.
- Development Ecosystem Supported by the Virtex-II platform development flow referenced in the datasheet, including Xilinx Foundation™ and Alliance Series™ development systems for HDL-based design and toolchain integration.
- Compliance RoHS compliant for lead‑free assembly and regulatory alignment.
Typical Applications
- Memory Interface Controllers Implement SDR/DDR and specialized DRAM/SRAM interfaces using the device’s high-performance I/O and on-chip memory hierarchy.
- DSP and Signal Processing Use the dedicated 18×18 multiplier blocks and abundant logic elements for filtering, transforms, and real-time signal processing pipelines.
- High‑Bandwidth Communications Leverage the extensive user I/O and differential signaling support for backplane, networking, and interconnect applications requiring high throughput.
- Complex System Integration Integrate large combinational and sequential logic, memory controllers, and custom peripherals into a single 1517-FCBGA package for space-constrained systems.
Unique Advantages
- High Logic Density: 104,832 logic elements and 8,000,000 system gates enable consolidation of multiple functions and reduce external component count.
- Substantial Embedded Memory: Approximately 3.1 Mbits of on-chip RAM supports large buffers, FIFOs, and dual-port memory structures without external memory in many designs.
- Extensive I/O Flexibility: Up to 1,108 user I/Os and SelectIO capabilities provide broad signaling options and drive control for diverse interface requirements.
- Industrial Temperature Range: Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
- Toolchain and Platform Support: Part of the Virtex-II platform with documented support via the referenced development systems to accelerate design implementation and verification.
- Compact, Surface‑Mount Packaging: 1517-FCBGA (40×40) package delivers high pin count in a leadless BGA footprint suitable for modern PCB designs.
Why Choose XC2V8000-5FF1517I?
The XC2V8000-5FF1517I combines high logic capacity, substantial embedded memory, and extensive I/O in a single industrial-grade Virtex-II FPGA package. Its mix of dedicated multiplier blocks, rich SelectRAM resources, and clock-management features make it well suited for designs that require intensive arithmetic, robust memory handling, and flexible high-speed interfaces.
Engineers targeting complex communications, memory controller, or DSP-centric applications will find this device appropriate for consolidating functionality and shortening BOM. Backed by the Virtex-II platform documentation and development tool support referenced in the datasheet, the XC2V8000-5FF1517I offers a clear path from HDL development to system integration and deployment.
Request a quote or submit your requirements to receive pricing and availability for the XC2V8000-5FF1517I.

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