XC2V8000-5FF1517I

IC FPGA 1108 I/O 1517FCBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 1108 3096576 1517-BBGA, FCBGA

Quantity 399 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FCBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O1108Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs11648Number of Logic Elements/Cells104832
Number of Gates8000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3096576

Overview of XC2V8000-5FF1517I – Virtex®-II FPGA, Industrial 1517-FCBGA

The XC2V8000-5FF1517I is a Virtex®-II field programmable gate array (FPGA) IC manufactured by AMD. It delivers a high-density, flexible programmable logic platform suitable for designs requiring large logic capacity, extensive I/O, and substantial on-chip memory.

Built on the Virtex-II platform architecture, this device targets applications that need deep embedded memory, dedicated arithmetic resources, and configurable high-speed I/O, while supporting industrial temperature operation and surface-mount 1517-FCBGA packaging.

Key Features

  • Core Logic  Approximately 104,832 logic elements and 8,000,000 system gates for integrating complex digital logic and state machines.
  • Embedded Memory  Approximately 3.1 Mbits of on-chip RAM (3,096,576 total RAM bits), implemented with 18-Kb block SelectRAM resources for dual-port memory and distributed RAM needs.
  • High‑Performance I/O  Up to 1,108 user I/Os supported by SelectIO™-Ultra technology, enabling a wide range of single-ended and differential signaling options and programmable drive strength.
  • Dedicated Arithmetic Resources  Built-in 18-bit × 18-bit multiplier blocks to accelerate DSP and arithmetic-intensive functions.
  • Clock Management  Virtex-II platform clock-management features such as Digital Clock Manager (DCM) modules and global clock multiplexer buffers for precise clocking and de-skewing.
  • Package and Mounting  1517-FCBGA (40×40) supplier device package / 1517-BBGA package case, surface-mount mounting type for compact system integration.
  • Power and Temperature  Core supply voltage range 1.425 V to 1.575 V and industrial operating temperature from −40 °C to 100 °C.
  • Standards and Interfaces  Platform-level support for high-performance external memory interfaces (SDR/DDR SDRAM, FCRAM, reduced-latency DRAM) and SRAM interfaces as described in the Virtex-II specification.
  • Development Ecosystem  Supported by the Virtex-II platform development flow referenced in the datasheet, including Xilinx Foundation™ and Alliance Series™ development systems for HDL-based design and toolchain integration.
  • Compliance  RoHS compliant for lead‑free assembly and regulatory alignment.

Typical Applications

  • Memory Interface Controllers  Implement SDR/DDR and specialized DRAM/SRAM interfaces using the device’s high-performance I/O and on-chip memory hierarchy.
  • DSP and Signal Processing  Use the dedicated 18×18 multiplier blocks and abundant logic elements for filtering, transforms, and real-time signal processing pipelines.
  • High‑Bandwidth Communications  Leverage the extensive user I/O and differential signaling support for backplane, networking, and interconnect applications requiring high throughput.
  • Complex System Integration  Integrate large combinational and sequential logic, memory controllers, and custom peripherals into a single 1517-FCBGA package for space-constrained systems.

Unique Advantages

  • High Logic Density: 104,832 logic elements and 8,000,000 system gates enable consolidation of multiple functions and reduce external component count.
  • Substantial Embedded Memory: Approximately 3.1 Mbits of on-chip RAM supports large buffers, FIFOs, and dual-port memory structures without external memory in many designs.
  • Extensive I/O Flexibility: Up to 1,108 user I/Os and SelectIO capabilities provide broad signaling options and drive control for diverse interface requirements.
  • Industrial Temperature Range: Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
  • Toolchain and Platform Support: Part of the Virtex-II platform with documented support via the referenced development systems to accelerate design implementation and verification.
  • Compact, Surface‑Mount Packaging: 1517-FCBGA (40×40) package delivers high pin count in a leadless BGA footprint suitable for modern PCB designs.

Why Choose XC2V8000-5FF1517I?

The XC2V8000-5FF1517I combines high logic capacity, substantial embedded memory, and extensive I/O in a single industrial-grade Virtex-II FPGA package. Its mix of dedicated multiplier blocks, rich SelectRAM resources, and clock-management features make it well suited for designs that require intensive arithmetic, robust memory handling, and flexible high-speed interfaces.

Engineers targeting complex communications, memory controller, or DSP-centric applications will find this device appropriate for consolidating functionality and shortening BOM. Backed by the Virtex-II platform documentation and development tool support referenced in the datasheet, the XC2V8000-5FF1517I offers a clear path from HDL development to system integration and deployment.

Request a quote or submit your requirements to receive pricing and availability for the XC2V8000-5FF1517I.

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