XC2VP100-5FF1704I

IC FPGA 1040 I/O 1704FCBGA
Part Description

Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 1040 8183808 99216 1704-BBGA, FCBGA

Quantity 669 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1704-FCBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1704-BBGA, FCBGANumber of I/O1040Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs11024Number of Logic Elements/Cells99216
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits8183808

Overview of XC2VP100-5FF1704I – Virtex®-II Pro FPGA, 99,216 Logic Cells, 1,040 I/O

The XC2VP100-5FF1704I is a Virtex®-II Pro family field-programmable gate array (FPGA) packaged in a 1704-FCBGA surface-mount format. It delivers a high-density programmable fabric with a large I/O count and substantial on-chip memory for complex system integration.

As part of the Virtex-II Pro family, the device supports platform features such as embedded processor blocks and multi-gigabit transceiver options, alongside FPGA primitives like dedicated multipliers and a SelectRAM™ memory hierarchy, enabling integration of logic, memory, and interface functions on a single device.

Key Features

  • High-density logic — 11024 CLBs and 99,216 logic cells provide a large programmable fabric for complex logic implementations.
  • Embedded memory — Approximately 8.18 Mbits of on-chip RAM for buffering, lookup tables, and user memory structures.
  • Extensive I/O — Up to 1,040 I/O pins enable wide parallel interfaces and high pin-count system connectivity.
  • Family-level processor and transceiver options — Virtex-II Pro family devices can include up to two PowerPC RISC processor blocks and up to twenty RocketIO or RocketIO X multi-gigabit transceivers for embedded processing and high-speed serial links.
  • Dedicated DSP resources — 18-bit × 18-bit multiplier blocks for arithmetic and signal-processing acceleration.
  • Advanced I/O and clocking — SelectI/O™-Ultra technology, Digitally Controlled Impedance (DCI) I/O, and high-performance clock management circuitry for flexible I/O and timing architectures.
  • Robust packaging — 1704-FCBGA package (42.5 mm × 42.5 mm) in a surface-mount format suited for high-density board designs.
  • Power and temperature — Core supply range of 1.425 V to 1.575 V and industrial operating temperature range of −40 °C to 100 °C.
  • Regulatory — RoHS compliant.

Typical Applications

  • Telecommunications & Datacom — Use the family’s RocketIO transceiver capability and high I/O count to implement serial link interfaces, protocol bridging, and line-card functions.
  • Embedded processing and control — Combine on-chip processor blocks with programmable logic for system control, protocol handling, and offload tasks.
  • High-density logic systems — Implement large combinational and sequential designs that require significant logic cells and embedded RAM for buffering and state storage.
  • Signal processing — Leverage dedicated 18×18 multipliers and embedded RAM for DSP kernels, filtering, and arithmetic-intensive functions.

Unique Advantages

  • Highly integrated platform: Combines logic, embedded memory, dedicated multipliers, and family-level processor/transceiver options to reduce external components and simplify system architecture.
  • Large I/O capacity: 1,040 I/O pins support wide parallel buses, high-channel-count interfaces, and flexible board-level routing.
  • Substantial on-chip memory: Approximately 8.18 Mbits of embedded RAM provides local storage for buffering and lookup operations, improving system throughput.
  • Industrial temperature range: Rated for −40 °C to 100 °C operation, enabling deployment in industrial environments.
  • Surface-mount FCBGA packaging: The 1704-FCBGA (42.5 × 42.5 mm) package delivers a compact high-pin-count solution for dense PCB layouts.
  • Standards-conscious manufacturing: RoHS compliance supports environmentally conscious production and assembly processes.

Why Choose XC2VP100-5FF1704I?

The XC2VP100-5FF1704I positions itself as a high-density Virtex-II Pro FPGA solution for designs that require large logic capacity, extensive I/O, and significant embedded memory. Its combination of programmable fabric, DSP primitives, and family-level processor/transceiver capabilities make it suitable for systems that integrate processing, high-speed interfacing, and complex logic in a single device.

This part is well suited to engineering teams building industrial-grade applications that demand a high pin count, robust thermal range, and the ability to consolidate multiple functions onto one FPGA, delivering long-term scalability within the Virtex-II Pro platform.

Request a quote or submit an inquiry for the XC2VP100-5FF1704I to receive pricing, availability, and lead-time information tailored to your project needs.

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