XC2VP100-5FF1704I
| Part Description |
Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 1040 8183808 99216 1704-BBGA, FCBGA |
|---|---|
| Quantity | 669 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1704-FCBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1704-BBGA, FCBGA | Number of I/O | 1040 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 11024 | Number of Logic Elements/Cells | 99216 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 8183808 |
Overview of XC2VP100-5FF1704I – Virtex®-II Pro FPGA, 99,216 Logic Cells, 1,040 I/O
The XC2VP100-5FF1704I is a Virtex®-II Pro family field-programmable gate array (FPGA) packaged in a 1704-FCBGA surface-mount format. It delivers a high-density programmable fabric with a large I/O count and substantial on-chip memory for complex system integration.
As part of the Virtex-II Pro family, the device supports platform features such as embedded processor blocks and multi-gigabit transceiver options, alongside FPGA primitives like dedicated multipliers and a SelectRAM™ memory hierarchy, enabling integration of logic, memory, and interface functions on a single device.
Key Features
- High-density logic — 11024 CLBs and 99,216 logic cells provide a large programmable fabric for complex logic implementations.
- Embedded memory — Approximately 8.18 Mbits of on-chip RAM for buffering, lookup tables, and user memory structures.
- Extensive I/O — Up to 1,040 I/O pins enable wide parallel interfaces and high pin-count system connectivity.
- Family-level processor and transceiver options — Virtex-II Pro family devices can include up to two PowerPC RISC processor blocks and up to twenty RocketIO or RocketIO X multi-gigabit transceivers for embedded processing and high-speed serial links.
- Dedicated DSP resources — 18-bit × 18-bit multiplier blocks for arithmetic and signal-processing acceleration.
- Advanced I/O and clocking — SelectI/O™-Ultra technology, Digitally Controlled Impedance (DCI) I/O, and high-performance clock management circuitry for flexible I/O and timing architectures.
- Robust packaging — 1704-FCBGA package (42.5 mm × 42.5 mm) in a surface-mount format suited for high-density board designs.
- Power and temperature — Core supply range of 1.425 V to 1.575 V and industrial operating temperature range of −40 °C to 100 °C.
- Regulatory — RoHS compliant.
Typical Applications
- Telecommunications & Datacom — Use the family’s RocketIO transceiver capability and high I/O count to implement serial link interfaces, protocol bridging, and line-card functions.
- Embedded processing and control — Combine on-chip processor blocks with programmable logic for system control, protocol handling, and offload tasks.
- High-density logic systems — Implement large combinational and sequential designs that require significant logic cells and embedded RAM for buffering and state storage.
- Signal processing — Leverage dedicated 18×18 multipliers and embedded RAM for DSP kernels, filtering, and arithmetic-intensive functions.
Unique Advantages
- Highly integrated platform: Combines logic, embedded memory, dedicated multipliers, and family-level processor/transceiver options to reduce external components and simplify system architecture.
- Large I/O capacity: 1,040 I/O pins support wide parallel buses, high-channel-count interfaces, and flexible board-level routing.
- Substantial on-chip memory: Approximately 8.18 Mbits of embedded RAM provides local storage for buffering and lookup operations, improving system throughput.
- Industrial temperature range: Rated for −40 °C to 100 °C operation, enabling deployment in industrial environments.
- Surface-mount FCBGA packaging: The 1704-FCBGA (42.5 × 42.5 mm) package delivers a compact high-pin-count solution for dense PCB layouts.
- Standards-conscious manufacturing: RoHS compliance supports environmentally conscious production and assembly processes.
Why Choose XC2VP100-5FF1704I?
The XC2VP100-5FF1704I positions itself as a high-density Virtex-II Pro FPGA solution for designs that require large logic capacity, extensive I/O, and significant embedded memory. Its combination of programmable fabric, DSP primitives, and family-level processor/transceiver capabilities make it suitable for systems that integrate processing, high-speed interfacing, and complex logic in a single device.
This part is well suited to engineering teams building industrial-grade applications that demand a high pin count, robust thermal range, and the ability to consolidate multiple functions onto one FPGA, delivering long-term scalability within the Virtex-II Pro platform.
Request a quote or submit an inquiry for the XC2VP100-5FF1704I to receive pricing, availability, and lead-time information tailored to your project needs.

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