XC2VP100-6FF1704C

The XC2VP100-6FF1704C is a Virtex®-II Pro family FPGA offering a high-density programmable fabric for complex digital systems. This device provides 99,216 logic elements and approximately 8.18 Mbits of embedded memory, delivering the resources required for data-intensive logic, high-channel-count I/O, and system-level integration.

Designed for commercial-grade applications, the part features a 1704-ball FCBGA package and supports a large I/O count, making it well suited to communications, networking, and embedded processing platforms that require a mix of logic capacity, on-chip memory, and dense connectivity.

Key Features

• Logic Capacity — 99,216 logic elements providing high-density programmable logic for complex designs.
• Embedded Memory — Approximately 8.18 Mbits of on-chip RAM to support buffering, packet storage, and LUT-based memory structures.
• High-Density I/O — 1,040 user I/O pins to support wide parallel buses, multiple interfaces, and high-pin-count system integration.
• Package & Mounting — 1704-ball FCBGA (42.5 × 42.5 mm) surface-mount package for compact board-level integration.
• Supply Voltage — Core supply 1.425 V to 1.575 V, enabling predictable power provisioning for the FPGA core.
• Commercial Grade Operating Range — Rated for 0 °C to 85 °C operation for commercial applications.
• Virtex-II Pro Family Capabilities — Family-level features include embedded multi-gigabit transceivers (RocketIO), the option for integrated PowerPC processor blocks (PowerPC 405 core), dedicated 18×18 multipliers, and digital clock management circuitry.
• Standards & Compliance — RoHS compliant.

Typical Applications

• Telecom & Datacom — Supports high-throughput serial links and dense I/O required for networking line cards and protocol processing.
• Embedded Processing Platforms — Suitable for systems leveraging on-chip processors and hardware acceleration for control, signal processing, or packet handling.
• High-Performance Prototyping — Large logic and memory resource counts enable complex SoC emulation, IP integration, and hardware/software co-design validation.
• Data Acquisition & Instrumentation — High I/O count and substantial embedded memory support multi-channel sampling, buffering, and real-time preprocessing.

Unique Advantages

• High Integration Density: Large logic and memory resources reduce the need for external ASICs and discrete memory, simplifying system BOM and board space.
• Extensive I/O Capability: 1,040 I/O pins enable direct interfacing to a wide variety of peripherals and parallel buses without extensive external multiplexing.
• Robust Family Feature Set: Virtex-II Pro family features such as multi-gigabit transceivers and integrated processor blocks provide flexible architectural options for mixed-signal and embedded designs.
• Compact Package: The 1704-FCBGA (42.5 × 42.5 mm) package offers a balance of pin count and board area for dense system implementations.
• Regulatory Compliance: RoHS compliance supports environmentally conscious product design and supply chain requirements.

Why Choose XC2VP100-6FF1704C?

The XC2VP100-6FF1704C is positioned for designers who need a high-resource, commercially graded FPGA with large logic capacity, ample on-chip memory, and a very high I/O count. Its package and supply characteristics make it suitable for dense system boards that require significant programmable logic and memory without relying on extensive external components.

Choosing this Virtex-II Pro device provides scalability for complex designs and access to the platform-level capabilities documented for the family, enabling integration of high-speed serial links and embedded processing where applicable. It is appropriate for teams building communications equipment, instrumentation, and advanced prototyping systems that benefit from a high-density FPGA solution.

Request a quote or submit an inquiry to receive pricing, availability, and additional procurement information for the XC2VP100-6FF1704C. Our team will respond with current lead times and ordering guidance.