XC2VP2-5FFG672C

The XC2VP2-5FFG672C is a Virtex®-II Pro field-programmable gate array in a 672-ball flip-chip BGA package. It implements the Virtex‑II Pro platform architecture and is suited to applications that require programmable logic, embedded processing capabilities, and high-density I/O integration.

With a combination of programmable logic resources, embedded memory, and a broad I/O complement, this commercial-grade, surface-mount FPGA addresses use cases in communications, embedded processing, and high-speed system interfacing where a compact, RoHS-compliant FPGA solution is required.

Key Features

• Programmable Logic — 3,168 logic elements to implement custom digital logic and state machines.
• Embedded Memory — Approximately 0.22 Mbits of on-chip RAM for FIFOs, buffers, and local storage.
• I/O Density — 204 user I/O pins to support wide parallel interfaces and mixed-signal connectivity.
• Platform-Level Capabilities — Virtex‑II Pro platform features documented in the datasheet include support for embedded processor blocks (PowerPC™), RocketIO multi‑gigabit transceivers on applicable devices, dedicated 18×18 multiplier blocks, and advanced clock management (as described in the platform specification).
• Power and Operating Range — Core supply voltage range of 1.425 V to 1.575 V and commercial operating temperature range of 0 °C to 85 °C.
• Package and Mounting — 672-ball flip-chip FCBGA (27×27) package, surface-mount design for high-density board integration.
• Standards Compliance — RoHS-compliant manufacturing.

Typical Applications

• Telecommunications & Datacom — Implement protocol processing and high-speed serial interfaces using the Virtex‑II Pro family features such as RocketIO transceivers (family-level capability) and flexible I/O.
• Embedded Processing — Offload real-time tasks to on-chip processing blocks and custom logic, leveraging the platform’s embedded-processor support and dedicated multiplier resources.
• Network & Interface Bridging — Use the FPGA’s abundant I/O and embedded memory to implement packet buffering, protocol bridging, and glue logic between high‑speed interfaces.

Unique Advantages

• Integrated Platform Feature Set: Built on the Virtex‑II Pro platform, providing documented support for embedded processors and multi‑gigabit transceivers (family-level features) that simplify system-level integration.
• Compact, High‑Density Package: 672‑ball FCBGA (27×27) enables a small board footprint while delivering extensive I/O and logic resources.
• Deterministic On‑Chip Resources: Nearly 3,200 logic elements and on‑chip RAM support deterministic buffering and custom logic implementation without external memory dependency.
• Design Flexibility: A broad voltage and temperature operating envelope and a high I/O count allow adaptation to a wide range of board-level interfaces and system topologies.
• Regulatory and Assembly Friendly: Surface-mount FCBGA format and RoHS compliance simplify modern manufacturing and environmental requirements.

Why Choose XC2VP2-5FFG672C?

The XC2VP2-5FFG672C provides a practical balance of programmable logic capacity, embedded memory, and I/O density in a compact FCBGA package. It is well-suited for engineering teams implementing communications, embedded processing, or complex interfacing functions that benefit from the Virtex‑II Pro platform capabilities documented in the product datasheet.

Its commercial-grade operating range, defined core voltage window, and RoHS compliance make it a straightforward choice for production systems requiring a validated FPGA building block and a well-documented platform reference.

Request a quote or submit an inquiry to receive pricing and availability for the XC2VP2-5FFG672C and to discuss how this Virtex‑II Pro FPGA can be integrated into your next design.