XC2VP2-5FGG256C

The XC2VP2-5FGG256C is a Virtex®-II Pro field programmable gate array (FPGA) IC supplied by AMD. It delivers a mid-range combination of programmable logic, on-chip memory, and I/O density for embedded and board-level designs.

As a member of the Virtex-II Pro family, the device aligns with platform features such as integrated logic resources and family-level options for embedded processors and high-speed serial transceivers. This part is targeted at applications that require moderate logic capacity, significant I/O, and a commercial temperature grade.

Key Features

• Logic Capacity — 3,168 logic elements implemented across 352 CLBs, providing mid-range programmable logic resources for custom digital functions.
• Embedded Memory — Approximately 0.22 Mbits of on-chip RAM (221,184 total bits) for buffering, lookup tables, and small data structures.
• I/O Count — 140 user I/O pins to support a variety of external interfaces and parallel connections.
• Power and Supply — Core supply voltage specification of 1.425 V to 1.575 V for correct device operation.
• Package & Mounting — 256-ball BGA package; supplier device package specified as 256-FBGA (17×17). Surface-mount package suitable for compact board-level integration.
• Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS compliant for environmental and materials considerations.
• Family-Level Capabilities — Virtex-II Pro platform documentation describes options such as embedded PowerPC processor blocks and RocketIO multi-gigabit transceivers available across the family.

Typical Applications

• Embedded Logic and Control — Use the FPGA’s logic elements and embedded RAM for custom control, glue logic, and protocol handling in embedded systems.
• Board-Level I/O Expansion — 140 I/O pins enable parallel and mixed-signal interfaces, making it suitable for I/O-rich subsystems and front-end controllers.
• Prototyping and Development — Mid-range logic and memory capacity make this part useful for proof-of-concept designs and iterative development on the Virtex-II Pro platform.
• Compact System Integration — The 256-FBGA (17×17) surface-mount package supports dense, space-conscious PCB layouts.

Unique Advantages

• Balanced Logic and Memory — 3,168 logic elements with approximately 0.22 Mbits of embedded RAM provide a practical balance for many embedded and control applications.
• Generous I/O — 140 I/O pins let you connect multiple peripherals, buses, or parallel interfaces without external glue chips.
• Compact Package — 256-FBGA (17×17) package offers a compact footprint for space-constrained designs while preserving signal density.
• Defined Power Envelope — Specified core voltage range (1.425 V–1.575 V) supports predictable power design and supply planning.
• Commercial Temperature Rating — 0 °C to 85 °C operation aligns with a wide range of commercial and industrial indoor applications.
• RoHS Compliance — Meets material and environmental compliance expectations for many global markets.

Why Choose XC2VP2-5FGG256C?

The XC2VP2-5FGG256C positions itself as a practical Virtex-II Pro family FPGA for projects that need a mid-level mix of logic, embedded RAM, and I/O density in a compact BGA package. Its specifications—3,168 logic elements, approximately 0.22 Mbits of on-chip memory, 140 I/O pins, and a 256-FBGA (17×17) surface-mount package—make it well suited for developers building embedded controllers, I/O hubs, or prototype systems on the Virtex-II Pro platform.

Backed by Virtex-II Pro family documentation and AMD supply, this device is appropriate for engineering teams seeking predictable electrical requirements (1.425 V–1.575 V) and commercial-grade temperature operation while maintaining RoHS compliance.

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