XC2VP2-5FGG456C
| Part Description |
Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 156 221184 3168 456-BBGA |
|---|---|
| Quantity | 1,374 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 456-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 456-BBGA | Number of I/O | 156 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 352 | Number of Logic Elements/Cells | 3168 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 221184 |
Overview of XC2VP2-5FGG456C – Virtex®-II Pro FPGA, 456-BBGA
The XC2VP2-5FGG456C is a Virtex®-II Pro Field Programmable Gate Array (FPGA) in a 456-ball BGA package, manufactured by AMD. It is built on the Virtex-II Pro platform and combines configurable logic resources with embedded-memory and dedicated DSP/multiplier blocks to support embedded processing and high-density I/O designs.
This commercial-grade, surface-mount FPGA targets applications that require moderate logic capacity, on-chip memory, and flexible I/O — delivering a compact package with defined voltage and temperature operating ranges for predictable integration into system designs.
Key Features
- Device Core – Virtex-II Pro platform Architecture described in the Virtex-II Pro family documentation, including functional descriptions for embedded processor blocks and FPGA resources.
- Logic Density Approximately 3,168 logic elements, providing a balance of combinational and sequential resources for mid-range FPGA functions.
- Embedded Memory Approximately 0.22 Mbits of on-chip RAM (221,184 total bits) for buffering, packet storage, or local data structures.
- DSP Support Device architecture includes dedicated multiplier resources (18-bit × 18-bit multiplier blocks) for arithmetic and signal processing tasks.
- I/O Capacity 156 user I/Os to support diverse peripheral and interface requirements in a single device footprint.
- Package & Mounting 456-ball BGA (supplier package: 456-FBGA, 23 × 23) in a surface-mount form factor for high-density board layouts.
- Power Supply voltage range defined at 1.425 V to 1.575 V for core power planning and regulator selection.
- Operating Conditions & Compliance Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance for environmental conformity.
Typical Applications
- Embedded Processing Systems Use in designs that leverage the Virtex-II Pro platform's embedded processor block functionality and on-chip resources for system control and data handling.
- High-Density I/O Interfaces Deploy where multiple parallel or mixed-signal interfaces are required — the 156 I/Os allow consolidation of peripheral connectivity.
- Digital Signal Processing Suitable for mid-range DSP tasks using the device's dedicated multiplier blocks alongside on-chip RAM for streaming or block processing.
- Prototyping and Integration Effective for proof-of-concept and integration where a compact BGA package and moderate logic/memory resources meet board-level constraints.
Unique Advantages
- Balanced Logic and Memory Capacity: Approximately 3,168 logic elements and 0.22 Mbits of embedded RAM provide the right mix for mid-range FPGA tasks without over-provisioning.
- Dedicated DSP Resources: On-chip 18 × 18 multipliers accelerate arithmetic and signal-processing workloads, reducing reliance on external DSP ICs.
- High I/O Count in a Compact Package: 156 I/Os in a 456-BBGA (23 × 23) footprint streamline board routing for complex I/O scenarios.
- Defined Power and Thermal Envelope: Core supply specified at 1.425 V–1.575 V and commercial operating range of 0 °C–85 °C simplify system power and thermal planning.
- RoHS Compliant: Environmentally compliant manufacturing standard for modern product lifecycles.
- Surface-Mount Assembly: 456-BBGA surface-mount package enables standard SMT assembly processes for compact, reliable board designs.
Why Choose XC2VP2-5FGG456C?
The XC2VP2-5FGG456C is a compact Virtex-II Pro FPGA option that delivers a practical combination of logic density, embedded memory, DSP multipliers, and a high I/O count in a 456-ball BGA footprint. As a commercial-grade, RoHS-compliant device with clearly defined voltage and temperature ranges, it is well-suited for engineering teams building embedded processing functions, I/O-intensive modules, or mid-range signal-processing applications.
For engineers and purchasers seeking predictable integration from a Virtex-II Pro platform device, the XC2VP2-5FGG456C provides measurable resource counts and packaging details to streamline BOMs, PCB layout, and power budgeting while leveraging the documented platform features.
Request a quote or submit a procurement inquiry to get pricing and availability for the XC2VP2-5FGG456C. Our team can assist with lead times and volume options to support your design cycle.

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Headquarters: Santa Clara, California, USA
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








