XC2VP2-5FGG456C

IC FPGA 156 I/O 456FBGA
Part Description

Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 156 221184 3168 456-BBGA

Quantity 1,374 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package456-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case456-BBGANumber of I/O156Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs352Number of Logic Elements/Cells3168
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits221184

Overview of XC2VP2-5FGG456C – Virtex®-II Pro FPGA, 456-BBGA

The XC2VP2-5FGG456C is a Virtex®-II Pro Field Programmable Gate Array (FPGA) in a 456-ball BGA package, manufactured by AMD. It is built on the Virtex-II Pro platform and combines configurable logic resources with embedded-memory and dedicated DSP/multiplier blocks to support embedded processing and high-density I/O designs.

This commercial-grade, surface-mount FPGA targets applications that require moderate logic capacity, on-chip memory, and flexible I/O — delivering a compact package with defined voltage and temperature operating ranges for predictable integration into system designs.

Key Features

  • Device Core – Virtex-II Pro platform Architecture described in the Virtex-II Pro family documentation, including functional descriptions for embedded processor blocks and FPGA resources.
  • Logic Density Approximately 3,168 logic elements, providing a balance of combinational and sequential resources for mid-range FPGA functions.
  • Embedded Memory Approximately 0.22 Mbits of on-chip RAM (221,184 total bits) for buffering, packet storage, or local data structures.
  • DSP Support Device architecture includes dedicated multiplier resources (18-bit × 18-bit multiplier blocks) for arithmetic and signal processing tasks.
  • I/O Capacity 156 user I/Os to support diverse peripheral and interface requirements in a single device footprint.
  • Package & Mounting 456-ball BGA (supplier package: 456-FBGA, 23 × 23) in a surface-mount form factor for high-density board layouts.
  • Power Supply voltage range defined at 1.425 V to 1.575 V for core power planning and regulator selection.
  • Operating Conditions & Compliance Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance for environmental conformity.

Typical Applications

  • Embedded Processing Systems Use in designs that leverage the Virtex-II Pro platform's embedded processor block functionality and on-chip resources for system control and data handling.
  • High-Density I/O Interfaces Deploy where multiple parallel or mixed-signal interfaces are required — the 156 I/Os allow consolidation of peripheral connectivity.
  • Digital Signal Processing Suitable for mid-range DSP tasks using the device's dedicated multiplier blocks alongside on-chip RAM for streaming or block processing.
  • Prototyping and Integration Effective for proof-of-concept and integration where a compact BGA package and moderate logic/memory resources meet board-level constraints.

Unique Advantages

  • Balanced Logic and Memory Capacity: Approximately 3,168 logic elements and 0.22 Mbits of embedded RAM provide the right mix for mid-range FPGA tasks without over-provisioning.
  • Dedicated DSP Resources: On-chip 18 × 18 multipliers accelerate arithmetic and signal-processing workloads, reducing reliance on external DSP ICs.
  • High I/O Count in a Compact Package: 156 I/Os in a 456-BBGA (23 × 23) footprint streamline board routing for complex I/O scenarios.
  • Defined Power and Thermal Envelope: Core supply specified at 1.425 V–1.575 V and commercial operating range of 0 °C–85 °C simplify system power and thermal planning.
  • RoHS Compliant: Environmentally compliant manufacturing standard for modern product lifecycles.
  • Surface-Mount Assembly: 456-BBGA surface-mount package enables standard SMT assembly processes for compact, reliable board designs.

Why Choose XC2VP2-5FGG456C?

The XC2VP2-5FGG456C is a compact Virtex-II Pro FPGA option that delivers a practical combination of logic density, embedded memory, DSP multipliers, and a high I/O count in a 456-ball BGA footprint. As a commercial-grade, RoHS-compliant device with clearly defined voltage and temperature ranges, it is well-suited for engineering teams building embedded processing functions, I/O-intensive modules, or mid-range signal-processing applications.

For engineers and purchasers seeking predictable integration from a Virtex-II Pro platform device, the XC2VP2-5FGG456C provides measurable resource counts and packaging details to streamline BOMs, PCB layout, and power budgeting while leveraging the documented platform features.

Request a quote or submit a procurement inquiry to get pricing and availability for the XC2VP2-5FGG456C. Our team can assist with lead times and volume options to support your design cycle.

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