XC2VP2-5FGG256I

The XC2VP2-5FGG256I is a Virtex‑II Pro platform FPGA IC from AMD, offered in a 256‑ball BGA surface‑mount package. It delivers a balanced set of logic, embedded memory, and I/O resources for industrial-grade embedded and signal‑processing applications.

Built on the Virtex‑II Pro family architecture documented in the product datasheet, this device targets designs that require compact packaging, defined power rails, and an extended operating temperature range.

Key Features

• Logic Resources Approximately 3,168 logic elements and 352 CLBs to implement custom digital logic and control functions.
• Embedded Memory Approximately 0.21 Mbits of embedded memory (221,184 total RAM bits) for buffering, FIFOs, and on‑chip storage.
• I/O and Package 140 user I/O pins in a 256‑BGA (256‑FBGA, 17×17) package, enabling high‑density board integration in a compact footprint.
• Power Supply Specified core voltage range of 1.425 V to 1.575 V for predictable power design and sequencing.
• Thermal and Grade Industrial operating temperature range from −40 °C to 100 °C suitable for extended environmental conditions.
• Platform Capabilities Virtex‑II Pro family features described in the datasheet, including SelectRAM+ memory hierarchy, dedicated 18‑bit × 18‑bit multiplier blocks, and digital clock management circuitry.
• Transceiver & Processor Options (Family‑Level) The Virtex‑II Pro family documentation includes support options for RocketIO/RocketIO X multi‑gigabit transceivers and PowerPC processor blocks; consult the datasheet for device‑specific availability and configuration.
• Environmental Compliance RoHS compliant for lead‑free assembly programs.

Typical Applications

• Embedded Systems Implement custom control and processing subsystems using on‑chip logic and embedded memory.
• High‑Density I/O Interfaces Deliver compact I/O‑rich implementations where up to 140 user I/O are required in a small BGA footprint.
• Signal Processing and Acceleration Use dedicated multiplier blocks and embedded RAM to accelerate DSP workloads and algorithmic kernels.

Unique Advantages

• Compact, high‑density packaging: The 256‑FBGA (17×17) package maximizes I/O and logic in a space‑constrained board area.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in extended environmental conditions.
• Platform interoperability: Based on the Virtex‑II Pro platform, enabling use of documented platform features and device family resources.
• Defined power envelope: Narrow core voltage specification (1.425–1.575 V) simplifies power‑supply design and sequencing strategies.
• Regulatory readiness: RoHS compliance supports lead‑free manufacturing requirements.

Why Choose XC2VP2-5FGG256I?

The XC2VP2-5FGG256I combines a clearly specified set of logic elements, embedded memory, and 140 I/O in a 256‑ball FBGA package, making it well suited for compact industrial designs that require deterministic power and temperature specifications. Its placement within the Virtex‑II Pro platform provides access to documented architectural features such as dedicated multipliers, SelectRAM+ memory hierarchy, and digital clock management circuitry.

This device is intended for engineering teams and procurement departments seeking a platform FPGA with defined electrical and environmental parameters for embedded processing, I/O‑dense interfaces, and signal‑processing tasks. Refer to the Virtex‑II Pro product documentation for detailed platform‑level capabilities and device‑specific configuration options.

Request a quote or submit a purchase inquiry to obtain pricing and availability for the XC2VP2-5FGG256I.