XC2VP2-6FF672C

The XC2VP2-6FF672C is a Virtex®-II Pro family FPGA in a 672-ball FCBGA package designed for surface-mount applications. It provides a compact, reprogrammable logic platform with 3,168 logic elements and approximately 0.22 Mbits of embedded memory, supporting designs that require substantial I/O and on-chip memory in a single device.

As a member of the Virtex-II Pro family, the device is aligned with platform-level features such as advanced logic resources, SelectRAM memory hierarchy, and integrated clock management. The device is intended for commercial-grade applications operating at supply voltages between 1.425 V and 1.575 V and an ambient temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity – 3,168 logic elements to implement custom digital logic and control functions.
• Embedded Memory – Approximately 0.22 Mbits (221,184 bits) of on-chip RAM for buffering, state storage, and local data processing.
• I/O Density – 204 user I/Os to support multiple parallel interfaces and board-level connectivity.
• Supply and Temperature – Operates from 1.425 V to 1.575 V with an operating temperature range of 0 °C to 85 °C (commercial grade).
• Package and Mounting – 672-ball FCBGA (27 × 27 mm) package for surface-mount assembly, offering a high-pin-count footprint in a compact form factor.
• RoHS Compliance – Device is RoHS compliant for environmental regulatory alignment.
• Virtex-II Pro Family Capabilities (platform-level) – Family documentation describes platform features including embedded processor blocks (PowerPC), RocketIO multi-gigabit transceiver options, dedicated 18×18 multipliers, digitally controlled I/O impedance, and advanced clock management; consult product documentation for family-level details.

Typical Applications

• Custom Embedded Logic – Implement control, protocol bridging, and application-specific state machines using the device’s 3,168 logic elements and embedded RAM.
• High-Density I/O Integration – Integrate multiple parallel interfaces and board-level peripherals through up to 204 user I/Os.
• Memory-Backed Processing – Use on-chip RAM for buffering, FIFO structures, lookup tables, and localized data processing in compact FPGA designs.

Unique Advantages

• Compact, high-pin-count package – The 672-ball FCBGA package delivers extensive I/O in a 27 × 27 mm footprint, simplifying board routing for dense designs.
• Balanced logic and memory – 3,168 logic elements paired with approximately 0.22 Mbits of RAM supports a wide range of control and buffering tasks without external memory for many designs.
• Commercial temperature and supply compatibility – Defined operating voltage and temperature range make integration straightforward for commercial-grade electronics.
• RoHS compliant – Suitable for deployments requiring RoHS conformance.
• Platform interoperability – As a Virtex-II Pro family device, the part aligns with established architecture and documentation for designs that may leverage family-level features and migration paths.

Why Choose XC2VP2-6FF672C?

The XC2VP2-6FF672C offers a practical balance of logic capacity, embedded memory, and I/O density in a compact FCBGA package for commercial-grade FPGA designs. Its defined supply and temperature ranges and RoHS compliance make it straightforward to specify for board-level implementations that require reliable reprogrammable logic and on-chip RAM.

This device is well suited to engineers and procurement teams building compact, high-I/O systems that benefit from the Virtex-II Pro platform documentation and family capabilities. It provides a clear upgrade path within the Virtex-II Pro family for designs that may scale to larger device resources or platform-level features.

Request a quote or submit a procurement inquiry to receive pricing, availability, and ordering information for the XC2VP2-6FF672C.