XC2VP2-6FG256C

The XC2VP2-6FG256C is a Virtex®-II Pro platform FPGA in a 256-ball BGA package, designed for demanding embedded and communications applications. It combines flexible logic resources with embedded memory and I/O density to support designs that require on-chip processing, high-speed serial interfaces, and in-system reconfiguration.

As a member of the Virtex-II Pro family, this device is built on the platform FPGA architecture and benefits from family-level features such as embedded processor blocks and multi-gigabit transceiver support, along with IP core and reference design resources provided for the platform.

Key Features

• Logic Capacity 352 CLBs and 3,168 logic elements (cells) for implementing custom digital logic and control functions.
• Embedded Memory Approximately 0.22 Mbits of on-chip RAM (221,184 bits) for data buffering, FIFOs, and small on-chip storage.
• I/O 140 user I/O pins to support a wide range of peripheral interfaces and signal interfacing.
• Package & Mounting 256-BGA package (supplier device package: 256-FBGA, 17×17) with surface-mount assembly for compact board integration.
• Power Supply Core voltage range of 1.425 V to 1.575 V to match system power rails and regulator designs.
• Operating Range Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Environmental Compliance RoHS compliant, supporting regulatory requirements for lead-free assemblies.
• Virtex-II Pro Family Capabilities Family-level features include support for embedded PowerPC processor blocks, RocketIO multi-gigabit transceivers, dedicated 18×18 multiplier blocks, and advanced clock management (as part of the Virtex-II Pro platform).

Typical Applications

• Telecom & Datacom Designed to support telecom/datacom use cases where family-level RocketIO transceiver features and telecom support modes are required for high-speed serial connectivity.
• Embedded Processing Systems Suitable for designs that leverage on-chip embedded processor blocks (PowerPC) provided across the Virtex-II Pro family for system-level control and offload.
• High-Speed Serial Interfaces Appropriate for applications needing multi-gigabit serial links and programmable transceiver parameters available within the Virtex-II Pro platform.
• Reconfigurable Hardware Modules Fits use in FPGA-based modules that require SRAM-based in-system configuration and flexible logic/memory resources.

Unique Advantages

• Integrated Logic and Memory: 352 CLBs and approximately 0.22 Mbits of embedded RAM enable tight integration of control logic and data buffering on a single device.
• Platform-Level IP and References: Backed by Virtex-II Pro family IP cores and reference support to accelerate design implementation and validation.
• Compact, High-Density Package: 256-BGA (256-FBGA, 17×17) provides a compact footprint while offering substantial I/O for mid-density applications.
• Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliant to meet common commercial product requirements.
• Configurable Power Requirements: Defined core voltage window (1.425 V–1.575 V) that supports controlled power delivery and thermal budgeting.

Why Choose XC2VP2-6FG256C?

The XC2VP2-6FG256C brings together the Virtex-II Pro platform’s flexible logic fabric, embedded memory, and I/O count in a compact 256-BGA package, making it suitable for mid-density embedded and communications designs. Its association with the Virtex-II Pro family means designers can leverage platform-level processor blocks, transceiver technology, and IP resources when those capabilities align with project requirements.

Choose this device when you need a commercially graded FPGA with defined electrical and thermal limits, RoHS compliance, and integration options that simplify board-level system design while benefiting from the Virtex-II Pro platform ecosystem.

Request a quote or submit an inquiry to obtain pricing and availability for the XC2VP2-6FG256C and to discuss quantity options and lead times.