XC2VP2-6FG456C

The XC2VP2-6FG456C is a Virtex®-II Pro platform FPGA in a 456-ball BGA package, designed for commercial embedded logic and system applications. It combines configurable logic, embedded memory, and a substantial I/O complement to support complex processing, control, and interfacing tasks in commercial electronic designs.

Based on the Virtex-II Pro platform specification, this device aligns with platform-level features such as embedded processor and high-speed I/O capabilities specified for the family, while providing the specific device resources and package options listed below for surface-mount board implementations.

Key Features

• Logic Resources — 352 CLBs and 3,168 logic elements (cells) for implementing custom digital logic and control functions.
• Embedded Memory — Approximately 0.22 Mbits of on-chip RAM (221,184 total bits) for buffering, lookup tables, and small data storage needs.
• I/O Capacity — 156 user I/O pins to support multiple parallel interfaces and peripheral connections.
• Power and Supply — Core voltage supply range of 1.425 V to 1.575 V, enabling standard FPGA power sequencing and supply design.
• Package and Mounting — 456-BBGA package; supplier device package listed as 456-FBGA (23 × 23). Surface-mount construction for compact PCB integration.
• Operating Conditions — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Compliance — RoHS compliant for regulatory and environmental conformity.
• Platform-Level Capabilities — The Virtex-II Pro family specification includes platform features such as embedded processor blocks, multi-gigabit transceiver options, dedicated multiplier blocks, and advanced clock management; refer to the family datasheet for available functional blocks and configuration details.

Typical Applications

• Commercial Embedded Systems — Implement control logic, custom peripherals, and interface bridging in compact commercial products.
• Communications and Networking — Use the family’s platform-level I/O and transceiver options for protocol bridging, packet processing, and high-speed link interfacing where applicable.
• Prototyping and System Integration — Rapidly prototype system functions and integrate multiple digital subsystems leveraging on-chip logic and memory.

Unique Advantages

• Balanced Logic and Memory — A combination of 3,168 logic cells and ~0.22 Mbits of embedded RAM supports mid-density designs without external memory for many use cases.
• Generous I/O Count — 156 I/O pins facilitate multi-channel interfaces and flexible board-level connectivity.
• Surface-Mount BGA Package — 456-ball BGA (456-FBGA, 23 × 23) enables high-density PCB design and reliable board assembly.
• Commercial Temperature Rating — 0 °C to 85 °C operation suits a wide range of indoor and controlled-environment commercial products.
• RoHS Compliant — Meets environmental compliance expectations for modern electronic product assemblies.

Why Choose XC2VP2-6FG456C?

The XC2VP2-6FG456C brings a compact, surface-mount Virtex-II Pro platform device into commercial embedded designs requiring a balanced mix of logic, embedded RAM, and a substantial I/O count. Its 456-ball BGA package and specified voltage and temperature ranges make it suitable for PCB-integrated systems where proven FPGA platform capabilities and RoHS compliance are required.

This device is well suited to engineering teams and procurement groups looking for a mid-density FPGA solution for commercial applications, prototyping, or product integration where the Virtex-II Pro family’s platform features and the device’s specific resource set align with design requirements.

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