XC2VP2-6FG456I

The XC2VP2-6FG456I is a Virtex®-II Pro platform FPGA manufactured by AMD, delivered in a 456-ball BGA package for surface-mount assembly. It combines reconfigurable logic, embedded memory, and a broad I/O complement to address industrial embedded and control applications requiring flexible hardware configurability.

This device targets designs that need concentrated logic resources, on-chip RAM, and robust I/O in a compact BGA footprint. Key value comes from its configurable logic fabric, industrial-grade temperature range, and a supply voltage window that supports stable system integration.

Key Features

• Logic Resources — 352 configurable logic blocks (CLBs) and 3,168 logic elements provide the programmable fabric for custom digital functions and acceleration of application-specific tasks.
• Embedded Memory — Approximately 0.22 Mbits (221,184 bits) of on-chip RAM supports data buffering, state storage, and local working memory for logic functions.
• I/O and Packaging — 156 user I/Os in a 456-ball BGA (supplier package: 456-FBGA, 23 × 23) optimized for dense system integration and PCB routing; surface-mount package type for standard assembly processes.
• Power — Core supply voltage range from 1.425 V to 1.575 V for predictable power design and voltage-domain planning.
• Temperature and Grade — Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for harsh or temperature-variable environments.
• Compliance — RoHS compliant, meeting common environmental and materials requirements.
• Platform-Level Capabilities (Virtex‑II Pro family) — Per the Virtex‑II Pro family specification, the platform includes features such as embedded processor blocks and multi‑gigabit transceiver technology for designs that require those capabilities.

Typical Applications

• Industrial Automation — Reconfigurable logic and industrial temperature rating enable use in machine control, PLC offload, and custom I/O bridging.
• Embedded Systems — On-chip RAM and configurable logic support protocol handling, data preprocessing, and custom hardware accelerators in embedded controllers.
• Communications and Networking — Dense I/O and platform-level transceiver/processor capabilities (per Virtex‑II Pro family) suit interface bridging, packet processing, and protocol adaptation.
• Prototyping and Custom Hardware — Compact BGA footprint and abundant logic resources make the device a fit for proof-of-concept boards and bespoke digital designs requiring reprogrammability.

Unique Advantages

• Industrial-Grade Reliability: Rated from −40 °C to 100 °C, supporting deployment in temperature-demanding environments.
• Balanced On-Chip Resources: Combines thousands of logic elements with approximately 0.22 Mbits of embedded RAM for space-efficient hardware acceleration and buffering.
• Generous I/O Count: 156 I/Os enable flexible system interfacing without external I/O expanders, simplifying board-level design.
• Compact, PCB-Friendly Package: 456-BBGA (23 × 23 supplier FBGA) provides high pin density in a compact surface-mount form factor for modern PCB layouts.
• Clear Power Envelope: Defined core supply range (1.425 V–1.575 V) simplifies power-supply selection and margining during system design.
• Standards-Conscious Material Compliance: RoHS compliance supports environmental and manufacturing sourcing requirements.

Why Choose XC2VP2-6FG456I?

The XC2VP2-6FG456I is positioned for designers who need a reconfigurable, industrial-grade FPGA with a compact package and a balanced mix of logic, memory, and I/O. Its Virtex‑II Pro platform heritage provides architectural features applicable to embedded processing and high-speed interfaces, while the device-level specifications (logic elements, embedded RAM, I/O count, temperature range, and voltage window) offer concrete parameters for system planning.

This device is well suited to teams building industrial control, embedded processing, and communication interface solutions that require on-board configurability, a clear power specification, and RoHS-compliant materials. The combination of logic density, on-chip memory, and package density delivers a practical route to consolidate functions and reduce external BOM complexity.

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